IPC-A-600G

ASSOCIATION CONNECTING
ELECTRONICS INDUSTRIES

Acceptability of
Printed Boards

Developed by the IPC-A-600 Task Group (7-31a) of the Product

Assurance Committee (7-30) of IPC

Supersedes: Users of this publication are encouraged to participate in the

IPC-A-600F - November 1999 development of future revisions.

Contact:

IPC
2215 Sanders Road
Northbrook, Illinois
60062-6135
Tel 847 509.9700
Fax 847 509.9798
 Table of Contents

Acknowledgement ................................................... i 2.7 Printed Contacts .......................................... 29

1.0 Introduction .................................................... 1 2.7.1 Surface Plating - General ................ 29
2.7.1.1 Surface Plating - Wire Bond Pads ... 30
1.1 Scope .............................................................. 1
2.7.2 Burrs on Edge-Board Contacts ....... 31
1.2 Purpose .......................................................... 1 2.7.3 Adhesion of Overplate ..................... 32
1.3 Approach To This Document ....................... 1 2.8 Marking ......................................................... 33
1.4 Classification ................................................. 1 2.8.1 Etched Marking ............................... 34
2.8.2 Screened or Ink Stamped
1.5 Acceptance Criteria ....................................... 2
Marking ........................................... 35
1.6 Applicable Documents .................................. 3
2.9 Solder Resist (Solder Mask) ....................... 36
1.7 Dimensions And Tolerances ........................ 3 2.9.1 Coverage Over Conductors
1.8 Terms And Definitions .................................. 3 (Skip Coverage) ............................... 37
2.9.2 Registration to Holes (All Finishes) ... 38
1.9 Workmanship ................................................. 3 2.9.3 Registration to Other Conductive
2.0 Externally Observable Characteristics ........ 4 Patterns ........................................... 39
2.9.3.1 Ball Grid Array (Solder Resist-
2.1 Board Edges .................................................. 4 Defined Lands) ................................ 40
2.1.1 Burrs ................................................. 4 2.9.3.2 Ball Grid Array (Copper-Defined
2.1.1.1 Nonmetallic Burrs .............................. 5 Lands) ............................................. 41
2.1.1.2 Metallic Burrs ..................................... 6 2.9.3.3 Ball Grid Array (Solder Dam) ............ 42
2.1.2 Nicks ................................................. 7 2.9.4 Blisters/Delamination ....................... 43
2.1.3 Haloing .............................................. 8 2.9.5 Adhesion (Flaking or Peeling) ........... 44
2.9.6 Waves/Wrinkles/Ripples .................. 45
2.2 Base Material ................................................. 9
2.9.7 Tenting (Via Holes) ........................... 46
2.2.1 Weave Exposure ............................. 10 2.9.8 Soda Strawing ................................. 47
2.2.2 Weave Texture ................................ 11
2.10 Pattern Definition - Dimensional ................ 48
2.2.3 Exposed/Disrupted Fibers ............... 12
2.2.4 Pits and Voids ................................. 13 2.10.1 Conductor Width and Spacing ........ 48
2.10.1.1 Conductor Width ............................. 49
2.3 Base Material Subsurface ........................... 14 2.10.1.2 Conductor Spacing ......................... 50
2.3.1 Measling .......................................... 17 2.10.2 External Annular Ring -
2.3.2 Crazing ............................................ 18 Measurement .................................. 51
2.3.3 Delamination/Blister ......................... 19 2.10.3 External Annular Ring -
2.3.4 Foreign Inclusions ............................ 20 Supported Holes ............................. 52
2.10.4 External Annular Ring -
2.4 Solder Coatings and Fused Tin Lead ........ 21 Unsupported Holes ......................... 53
2.4.1 Nonwetting ...................................... 21
2.11 Flatness ........................................................ 54
2.4.2 Dewetting ........................................ 22
3.0 Internally Observable Characteristics ....... 55
2.5 Holes – Plated-Through – General ............ 23
3.1 Dielectric Materials ...................................... 56
2.5.1 Nodules/Burrs ................................. 23
2.5.2 Pink Ring ......................................... 24 3.1.1 Laminate Voids (Outside Thermal
Zone) ............................................... 56
2.5.3 Voids - Copper Plating .................... 25
3.1.2 Registration/Conductors to Holes .... 58
2.5.4 Voids - Finished Coating ................. 26
3.1.3 Clearance Hole, Unsupported,
2.5.5 Lifted Lands - (Visual) ...................... 27
to Power/Ground Planes ................. 59
2.6 Holes – Unsupported .................................. 28 3.1.4 Delamination/Blister ......................... 60
2.6.1 Haloing ............................................ 28 3.1.5 Etchback ......................................... 61

IPC-A-600G July 2004 iii

 Table of Contents

3.1.5.1 Etchback ......................................... 62 4.1 Flexible And Rigid-Flex Printed Wiring ..... 98
3.1.5.2 Negative Etchback .......................... 63 4.1.1 Coverlayer Coverage - Coverfilm
3.1.6 Smear Removal ............................... 64 Separations ..................................... 99
3.1.7 Dielectric Material, Clearance, 4.1.2 Coverlayer/Cover Coat Coverage
Metal Plane for Supported Holes ..... 65 Adhesives ...................................... 100
3.1.8 Layer-to-Layer Spacing ................... 66 4.1.2.1 Adhesive Squeeze-Out -
3.1.9 Resin Recession .............................. 67 Land Area ...................................... 100
3.2 Conductive Patterns - General ................... 68 4.1.2.2 Adhesive Squeeze-Out -
Foil Surface ................................... 101
3.2.1 Etching Characteristics .................... 69
4.1.3 Access Hole Registration for
3.2.2 Print and Etch ................................. 71 Coverlayer and Stiffeners ............... 102
3.2.3 Surface Conductor Thickness 4.1.4 Plating Defects .............................. 103
(Foil Plus Plating) ............................. 72
4.1.5 Stiffener Bonding ........................... 104
3.2.4 Foil Thickness - Internal Layers ....... 72
4.1.6 Transition Zone, Rigid Area to
3.3 Plated-Through Holes - General ................ 73 Flexible Area .................................. 105
3.3.1 Annular Ring - Internal Layers ......... 75 4.1.7 Solder Wicking/Plating Migration
3.3.2 Lifted Lands - (Cross-Sections) ....... 77 Under Coverlayer ........................... 106
3.3.3 Foil Crack - (Internal Foil) 4.1.8 Laminate Integrity .......................... 107
‘‘C’’ Crack ....................................... 78 4.1.8.1 Laminate Integrity - Flexible
3.3.4 Foil Crack - (External Foil) ................ 79 Printed Wiring ................................ 108
3.3.5 Plating Crack - (Barrel) 4.1.8.2 Laminate Integrity - Rigid-Flex
‘‘E’’ Crack ....................................... 80 Printed Wiring ................................ 109
3.3.6 Plating Crack - (Corner) 4.1.9 Etchback (Type 3 and
‘‘F’’ Crack ....................................... 81 Type 4 Only) .................................. 110
3.3.7 Plating Nodules ............................... 82 4.1.10 Smear Removal (Type 3
and 4 Only) .................................... 111
3.3.8 Copper Plating Thickness -
4.1.11 Trimmed Edges/Edge
Hole Wall ......................................... 83
Delamination .................................. 112
3.3.9 Plating Voids ................................... 84
3.3.10 Solder Coating Thickness 4.2 Metal Core Printed Boards ....................... 113
(Only When Specified) ..................... 85 4.2.1 Type Classifications ....................... 114
3.3.11 Solder Resist Thickness .................. 86 4.2.2 Spacing Laminated Type ............... 115
3.3.12 Wicking ............................................ 87 4.2.3 Insulation Thickness, Insulated
3.3.12.1 Wicking, Clearance Holes ................ 88 Metal Substrate ............................. 116
3.3.13 Innerlayer Separation - Vertical 4.2.4 Insulation Material Fill, Laminated
(Axial) Microsection .......................... 89 Type Metal Core ............................ 117
3.3.14 Innerlayer Separation - Horizontal 4.2.5 Cracks in Insulation Material Fill,
(Transverse) Microsection ................ 90 Laminated Type ............................. 118
3.3.15 Material Fill of Blind and Buried 4.2.6 Core Bond to Plated-Through
Vias ................................................. 91 Hole Wall ....................................... 119
3.4 Plated-Through Holes - Drilled .................. 92 4.3 Flush Printed Boards ................................ 120
3.4.1 Burrs ............................................... 93 4.3.1 Flushness of Surface Conductor ... 120
3.4.2 Nailheading ...................................... 94
5.0 Cleanliness Testing ................................... 121
3.5 Plated-Through Holes - Punched .............. 95
5.1 Solderability Testing .................................. 122
3.5.1 Roughness and Nodules ................. 96
5.1.1 Plated-Through Holes .................... 123
3.5.2 Flare ................................................ 97
5.2 Electrical Integrity ..................................... 124
4.0 Miscellaneous .............................................. 98

iv July 2004 IPC-A-600G

 1.0 INTRODUCTION

Introduction

1.1 SCOPE c) Applicable Performance Specification

This document describes the preferred, acceptable, and non- d) Acceptability of Printed Boards (IPC-A-600)
conforming conditions that are either externally or internally
observable on printed boards. It represents the visual interpre- When making accept and/or reject decisions, the awareness
tation of minimum requirements set forth in various printed of documentation precedence must be maintained.
board specifications, i.e.; IPC-6010 series, ANSI/J-STD-003, This document is a tool for observing how a product may
etc. deviate due to variation in processes. Refer to IPC-9191.

IPC-A-600 provides a useful tool for understanding and inter-

1.2 PURPOSE pretating Automated Inspection Technology (AIT) results. AIT
The visual illustrations in this document portray specific crite- may be applicable to the evaluation of many of the dimen-
ria of the requirements of current IPC specifications. In order sional characteristics illustrated in this document.
to properly apply and use the content of this document, the
printed wiring product should comply with the design require- 1.3 APPROACH TO THIS DOCUMENT
ments of the applicable IPC-2220 series document and the Characteristics are divided into two general groups:
performance requirements of the applicable IPC-6010 series
• Externally Observable (Section 2)
document. In the event the printed wiring product does not
comply with these or equivalent requirements, then the • Internally Observable (Section 3)
acceptance criteria should be as defined between a user and ‘‘Externally observable’’ conditions are those features or
supplier agreement as part of the procurement documenta- imperfections which can be seen and evaluated on or from
tion. the exterior surface of the board. In some cases, such as
voids or blisters, the actual condition is an internal phenom-
The illustrations in this document portray specific criteria relat-
enon and is detectable from the exterior.
ing to the heading and subheading of each page, with brief
descriptions of the acceptable and nonconforming conditions ‘‘Internally observable’’ conditions are those features or
for each product class. (See 1.4 Classification.) The visual imperfections that require microsectioning of the specimen or
quality acceptance criteria are intended to provide proper other forms of conditioning for detection and evaluation. In
tools for the evaluation of visual anomalies. The illustrations some cases, these features may be visible from the exterior
and photographs in each situation are related to specific and require microsectioning in order to assess acceptability
requirements. The characteristics addressed are those that requirements.
can be evaluated by visual observation and/or measurement
of visually observable features. Specimens should be illuminated during evaluation to the
extent needed for effective examination. The illumination
Supported by appropriate user requirements, this document should be such that no shadow falls on the area of interest
should provide effective visual criteria to quality assurance and except those shadows caused by the specimen itself. It is
manufacturing personnel. recommended that polarization and/or dark field illumination
be employed to prevent glare during the examination of highly
This document cannot cover all of the reliability concerns reflective materials.
encountered in the printed board industry; therefore,
attributes not addressed in this issue shall be agreed upon 1.4 CLASSIFICATION
between user and supplier. The value of this document lies in
its use as a baseline document that may be modified by This document recognizes that the acceptable extent of
expansions, exceptions, and variations which may be appro- imperfection for specific characteristics of printed boards may
priate for specific applications. be determined by the intended end use. For this reason, three
general classes have been established based on functional
This is a document for minimum acceptability requirements reliability and performance requirements.
and is not intended to be used as a performance specification
Class 1 — General Electronic products: Includes consumer
for printed board manufacture or procurement.
products, some computer and computer peripherals suitable
In the event of a conflict between the requirements of this for applications where cosmetic imperfections are not impor-
document and the applicable product performance specifica- tant, and the major requirement is function of the completed
tion, the following precedence shall be used: printed board.

a) Approved Printed Board Procurement Document Class 2 — Dedicated Service Electronic Products: Includes
communications equipment, sophisticated business
b) Generic Specifications machines, and instruments where high performance and

IPC-A-600G July 2004 1