Bm94715eku Rohm

Datasheet
Audio 1-Chip SOC

BM94715EKU
General Description Package
BM94715EKU is 1-Chip SOC for multimedia audio
systems, which supports the USB memory, SD memory
card, and CD. This IC has a built-in ARM946ES
processor, SDRAM, and various peripherals. It is
designated to download programs from external Serial
Flash ROM and execute system control, file system
management, Audio CODEC, and a wide range of media
control.
BM94715EKU supports USB Full-Speed and Bluetooth
A2DP.
Key Features
HTQFP128UA
This IC includes the following blocks:
Processor 16.00mm  16.00mm  1.20mm
 ARM946ES Microprocessor Core 0.4 mm pitch (With Thermal PAD)
Memory
 SDRAM
 Initial Program ROM
 Program SRAM Application
 Data SRAM Component Stereo
 SDRAM Controller
System Application Block
 Multilayer AHB
 Interrupt Controller Audio SoC
 DMA Controller BT
HCI module
HCI
controller
(UART)
BT stack
A2DP
SBC
Decoder
PWM Amp
DSP
SEL
D-class
Serial, Media I/F USB Host
I2S
Output
&
PWM
Processor
Amp
 GPIO USB Memory

/Device Audio I/F
SEL
PC / iPod File System Decoder

controller

LRCK,BCK,SDATA
Pin Controller SD
Memory
SDIO
Host
FAT12/16/32 MP3/WMA
/AAC /WAV

controller
USB2.0 Dual Role(Host/Device) Controller

CD
SD I/F pickup
CD Servo
DSP
CD-ROM
Decoder
&
Audio
Encoder
 Quad SPI I/F CD

Driver
Shock
Proof
File System
ISO9660
MP3/WAV
 SPI I/F (Master/Slave)

 I2C I/F (Master/Slave)
MIXER
MIC I2S
/TUNER ADC Input I/F
/AUX x2
 UART I/F Decode Path

Encode Path

Serial Flash Quad SPI
I2S Input I/F ROM I/F System Controller
Through Path
Control Path

KEY Display Peripheral
I2S Output I/F 3.3V / 1.5V
Control Control Control
Serial I/F
 CD Servo Controllers 16.9344MHz

ADC GPIO
SPI/I2C/UART
 CD-ROM Decoder / 32.768KHz
 General Purpose A/D Converter KEY

/Remote Control
LCD
Controller
Peripheral
modules
Timer
 Timer Figure 1. Application Block
 Watchdog Timer
 Real Time Clock
Other Lineup
 Clock Generator
Type Package Orderable Type
 Reset Generator
 PLL BM94715EKU HTQFP128UA Tray BM94715EKU-Z
○Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
www.rohm.com TSZ02201-0V2V0E600450-1-2
© 2016 ROHM Co., Ltd. All rights reserved. 1/24
TSZ22111・14・001 25.Jan.2017 Rev.002
BM94715EKU
Feature
BM94801KUT BM94803AEKU BM94715EKU
Package TQFP128UM HTQFP128UA HTQFP128UA

ARM946ES 96MHz 108MHz 108MHz
Processor
ICache/Dcache 4kB/4kB 4kB/4kB 4kB/4kB
SDRAM 16Mbit 16Mbit 16Mbit
Initial Program ROM 2kByte 2kByte 2kByte
Memory
Program SRAM 64kByte 64kByte 64kByte
Data SRAM 64kByte 64kByte 64kByte
Multilayer AHB support support support
System Interrupt Controller support support support
DMA Controller 2ch 1ch 1ch
GPIO support support support
Pin Controller support support support
USB2.0 Controller HS 1port HS 1port FS 1port
SD I/F 1ch 1ch 1ch
Quad SPI I/F 1ch 1ch 1ch
SPI I/F (Master) 1ch 1ch 1ch
SPI I/F (Slave) 1ch 1ch 1ch
I2C I/F (Master/Slave) 2ch 2ch 2ch
Peripheral UART I/F 2ch 2ch 2ch

I/F I2S Input I/F 2ch 2series 2ch 2series 2ch 2series
I2S:stereo + mono I2S:stereo I2S:stereo
I2S Output I/F 192kHz/24bit 192kHz/24bit 48kHz/16bit
DSD : 5.6448MHz
CD Servo Controllers support support support
CD-ROM Decoder support support support
RemoteControll support support support
General purpose
1.5V x 8ch 3.3V x 8ch 3.3V x 8ch
A/D Converter
Timer 5ch 5ch 5ch
Timer Watchdog Timer 1ch 1ch 1ch
Real Time Clock 1ch 1ch 1ch
DSP - - -
Entertainment
PWM out - - -
Accelerator FLAC/ALAC - - -
Clock Generator support support support
Clock
Reset Generator support support support
Note: Specification of BM94801KUT and BM94803AEKU are correct for the Datasheet of BM94801KUT and BM94803AEKU respectively.
www.rohm.com
© 2016 ROHM Co., Ltd. All rights reserved. 2/24 TSZ02201-0V2V0E600450-1-2
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Feature – continued
ARM946ES Microprocessor Core

 32Bit RISC Processor
 Operating Frequency: 108MHz
 8kByte Cache
Data Cache 4kByte
Instruction Cache 4kByte
SDRAM
 16Mbit
 SDRAM with built-in MSM56V16160N from LAPIS Semiconductor
 2Bank x 524,288-word x 16Bit
Initial Program ROM

 ITCM ROM Size: 2kByte (512Word x 32Bit)
 boot program
 No-wait access
REMAP
 Remapping can be implemented by writing to internal registers.
SHADOW SRAM
 RAM Size: 512Byte (128-Word x 32-Bit)
 No-wait access
Program SRAM
 ITCM RAM Size: 64kByte (16,384-Word x 32-Bit)
 No-wait access
Data SRAM
 DTCM RAM Size: 64kByte (16,384-Word x 32-Bit)
 No-wait access
SDRAM Controller
 Supports SDRAM
 Supports 11Bit row address, 8-bit column address, and 1-bit bank address to SDRAM
AMBA
 32Bit Data Bus
 Arbitrates ARM and DMA access with an arbiter
Interrupt Controller
 23 IRQ Interrupt Lines
 1 FIQ Interrupt Line
 Allows programmable setting of interrupt priority levels
 Allows setting of 16 vector addresses
DMA Controller
 Supports 1 Channel
 Channel FIFO Depth Up to 16 Bytes
 Allows programmable setting of transfer data width in the range of 1Byte to 4Bytes
 Allows programmable setting of channel priority levels
 Maximum Block Length Up to 4,095 Words
 Includes 12 handshake interfaces available for assignment to channels with software
 Supports multiblock transfers
 Connects the master board to system bus
GPIO
 GPIO0(32 pins), GPIO1(32 pins), GPIO2(13pins)
4 of 17 pins assigned GPIO2 are not available because of analog pin. (See P9 Pin Description)
 Supports a maximum of 77 I/O pins (including 16 GPIO pins for exclusive use)
 Supports the interrupt function
 Supports external level-sensitive interrupt
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Pin Controller
 Controls connection settings between pins and blocks
USB2.0 Dual Role (Host/Device) controller

 USB 2.0 conformance
 Bit rate: Full-Speed(12Mbps)
 Configurable for up to five transmit endpoint FIFOs and four receive endpoint FIFOs (including endpoint 0)
 Each endpoint FIFO supports bulk transfer, interrupt transfer, and isochronous transfer.
 4096-Byte RAM for Endpoint FIFO
SD I/F
 Supports SDHC, and SD cards
 Provide access to SD card in SD Bus mode
 Allows control from the AMBA-AHB Bus
 Includes 512 Byte data transmit/receive FIFOs
Quad SPI I/F

 Supports quad serial flash ROM
 Supports serial flash ROM address up to 24 bits
 Allows the setting of control registers from the AMBA-AHB bus
 Allows direct access from the memory map of the AMBA-AHB bus to serial flash ROM
 Includes 32 byte transmit/receive FIFOs
SSI Master
 FIFO Depth Up to 16 Words and FIFO Data Width Up to 16Bits
 Selectable Data Size from 4 Bits to 16 Bits
 Serial protocol supports SPI from Motorola
 Includes DMA handshake interface
SSI Slave
 FIFO Depth Up to 16 Words and FIFO Data Width Up to 16 Bits
 Selectable Data Size from 4 Bits to 16 Bits
 Serial protocol supports SPI from Motorola
I2C I/F (Master/Slave)

 2 Ch I2C Serial Interface
 Supports two speed modes
 Standard mode (100Kb/s)
 Fast mode (400Kb/s)
 Supports I2C Master and Slave operation
 Allows 7 and 10 bit address generation
 Has built-in 32 stage transmit and receive FIFOs
UART I/F
 IS16550-Based
 Allows various baud rate settings with software (up to 6Mbps)
 No Support for IrDA
 FIFO Depth Up to 32 Words and FIFO Data Width Up to 8 Bits
 Incorporates a function to invert output
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
I2S Input I/F

 Two Lines of 2-Ch Digital Audio Input
 I2S, EIAJ format
 16-Bit Data
 Selectable Bit Clock from 32fs, 48fs, and 64fs
 Selectable Input Sample Rate from 32kHz, 44.1kHz, and 48kHz
 One Line of Internal Input from the CD Servo Controller
 Maximum Input Rate Up to 4x
 Supports detection of CD-DA link
 Supports detection of CD-ROM sync
 Supports CD-ROM data descrambling
 Acquires Sub-Q data
 Acquires CD-Text data
 Built-in DMA 2ch
 Supports I2S Input at CD Play
I2S Output I/F

 2-Ch Digital Audio Output x 1 ( 2ch from Decoder)
 I2S, EIAJ format
 Selectable PCM Output Sample Rate from 32k, 44.1k, 48kHz
 Selectable PCM Data Width from 16 bits
 64 fs PCM Bit Clock
 Supports pitch control (x0.5 - x2.0, 25step)
CD servo controller
 Supports rotation speed of CD up to 4x
 Built-in Preservo-Amplifier with Power Save Mode, which supports Playback of CD-RW
 Allows independent offset adjustment of AC, BD, E, and F amplifiers
 Built-in Auto-Tracking and Focus Adjustment Function
 Built-in PLL and CLV with a Wide Lock Range
 Built-in Asymmetry Correction Function
CD-ROM Decoder
 Supports Mode1, Mode2 form1, Mode2 form2
 Supports ECC, EDC
 Built-in DMA
General Purpose A/D Converter

 10-Bit SAR ADC, 8 Ch ADC
 Analog Input Voltage range: VDD_ADC x10% to VDD_ADC x 90%
 Maximum A/D Conversion frequency Ch=88.2ksps
Timer
 Supports five independent programmable timer functions
 Each timer supports time width up to 32 bits
 Each timer supports independent interrupt signal
Watchdog Timer
 Composed of a counter having a set cycle to monitor the occurrence of timeout event
 Counter Width Up to 32 Bits
 The counter counts down from the set value and sets timeout occurrence when it reaches zero
Realtime clock
 32 Bit Programmable Timer
 Supports interrupt signals
 External 32.768 kHz Crystal Oscillator
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Remote Controller Receiver (RCR)

 Converts infrared remote control signal to code
 Compatible with the signal format of the Association for Electric Home Appliances
 Supports Sony format
 Enables to setup permissible value of input signal cycle to adjust the Duty deviation of input signal
Clock Generator
 Supplies clocks to individual internal blocks
 Allows on/off control of clocks to individual blocks
 Generates master audio clocks
 At the normal operation, supports three modes (High-Speed mode, Middle Speed mode, Low-Speed mode)
 Supports Standby Mode
Reset Generator
 Generates a pulse to be supplied to individual blocks
PLL
 Generates 216MHz / 240MHz clock used to generate system clocks
 Generates 135.4752 MHz and 147.456 MHz clocks used to generate audio clocks
Power Supply Voltage

 I/O Power Supply Voltage : 3.3V(3.0V to 3.6V)
 Analog Power Supply Voltage: 3.3V(3.0V to 3.6V)
(Used for SDRAM, CD servo, USB, and ADC)
 Digital Core Power Supply Voltage : 1.5V(1.45V to 1.65V)
(Used for Digital Core)
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Pin Assignment
JTAG_TRST
JTAG_TMS
JTAG_TDO
JTAG_TCK
DVDD_HV
DVDD_HV
DVDD_HV
GPIO0_25
GPIO0_24
GPIO0_23
JTAG_TDI
DVDD_LV
FL_DAT0
FL_DAT3
FL_DAT1
FL_DAT2
GPIO1_9
GPIO1_8
GPIO1_7
DATAO1
DATAO0
FL_CLK
MCLKO
LRCKO
FL_CS
CLK88
BCKO
DVSS
DVSS
DVSS
SDA0
SCL0
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
USB_DM 97 64 CLVOUT
USB_DP 98 63 SDOUT
DVSS 99 62 TDOUT
REXTI 100 61 FDOUT
UART0_RXD 101 60 FCO
UART0_TXD 102 59 PCO
UART0_RTS 103 58 ASY
UART0_CTS 104 57 LD
GPIO1_14 105 56 PD
GPIO1_15 106 55 F
GPIO1_16 107 54 E
GPIO1_17 108 53 AVSS
GPIO1_18 109 52 VBIAS
LRCKI0 110 51 BD
BCKI0 111 50 AC
DATAI0 112 49 AVDD
LRCKI1 113 48 AD_MONI1
BCKI1 114 47 AD_MONI0
DATAI1 115 46 EQO
UART1_RTS 116 45 RFI
UART1_CTS 117 44 ANA_MONI1
SCL1 118 43 ANA_MONI0
SDA1 119 42 VSS_ADC
RCR 120 41 ADIN7
UART1_RXD 121 40 ADIN6
UART1_TXD 122 39 ADIN5
DVSS 123 38 ADIN4
XIN_32K 124 37 ADIN3
XOUT_32K 125 36 ADIN2
TMODE 126 35 ADIN1
XIN_PLL 127 34 ADIN0
XOUT_PLL 128 33 VDD_ADC
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
1
2
3
4
5
6
7
8
9
DVDD_HV
MSDI
SD_WP
SD_CON
SD_DAT1
SD_DAT0
SD_CLK
SD_CMD
SD_DAT3
SD_DAT2
DVDD_HV
DVSS
GPIO0_9
GPIO0_10
DVSS
DVDD_HV
DVDD_LV
DVSS
DVSS
MSCS
MSCLK
MSDO
SSCS
SSDI
SSCLK
SSDO
GPIO0_19
GPIO0_20
GPIO0_21
RESETX
GPIO0_8
GPIO0_22
Figure 2. Pin Assignment
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Pin Description
No Block Pin Name GPIO I/O Function
1 RESET RESETX I H: Release RESET, L: RESET
2 SD SD_WP GPIO0[0] I/O SD Card I/F WP Detect
3 POWER DVDD_HV - 3.3V Power Supply
4 SD SD_CON GPIO0[1] I/O SD Card I/F Connection Detect
5 SD SD_DAT1 GPIO0[2] I/O SD Card I/F Data I/O (1)
7 SD SD_CLK GPIO0[4] I/O SD Card I/F Clock Output
8 SD SD_CMD GPIO0[5] I/O SD Card I/F Command Output
12 POWER DVSS - GND
13 GPIO GPIO0_8 GPIO0[8] I/O GPIO for exclusive use
GPIO pin. When CD is used, this pin is TRAY
14 GPIO GPIO0_9 GPIO0[9] I/O
OPEN/CLOSE detect pin of CD mechanical tray.
16 POWER DVSS - GND
18 POWER DVDD_LV - 1.5V Power Supply
19 POWER DVSS - GND
20 POWER DVSS - GND
21 MSIO MSCS GPIO0[11] I/O SIO Master Chip Select Output
22 MSIO MSDI GPIO0[12] I/O SIO Master Data Input
23 MSIO MSCLK GPIO0[13] I/O SIO Master Clock Output
24 MSIO MSDO GPIO0[14] I/O SIO Master Data Output
25 SSIO SSCS GPIO0[15] I/O SIO Slave Chip Select Input
26 SSIO SSDI GPIO0[16] I/O SIO Slave Data Input
27 SSIO SSCLK GPIO0[17] I/O SIO Slave Clock Input
28 SSIO SSDO GPIO0[18] I/O SIO Slave Data Output
GPIO pin. When CD is used, this pin is INNER_SW detect
31 GPIO GPIO0_21 GPIO0[21] I/O
pin.
33 POWER VDD_ADC - 3.3V ADC Power Supply
34 ADC ADIN0 GPIO2[0] I AD input CH0 or GPIO
42 POWER VSS_ADC - ADC GND
43 CDDSP ANA_MONI0 GPIO2[8] I/O Input & Analog Monitor Output or GPIO
44 CDDSP ANA_MONI1 GPIO2[9] I/O Input & Analog Monitor Output or GPIO
45 CDDSP RFI I RF Output Capacitance Coupling Re-Input
46 CDDSP EQO O Output RF Equalizer
47 CDDSP AD_MONI0 GPIO2[10] I/O Input & Monitor Signal Output or GPIO
48 CDDSP AD_MONI1 GPIO2[11] I/O Input & Monitor Signal Output or GPIO
49 POWER AVDD - 3.3V CD RF Power Supply
50 CDDSP AC I A + C Voltage Input
51 CDDSP BD I B + D Voltage Input
52 CDDSP VBIAS O VBIAS Output
53 POWER AVSS - CD RF GND
54 CDDSP E I E Voltage Input
55 CDDSP F I F Voltage Input
56 CDDSP PD I APC Photo Detector Input
57 CDDSP LD O APC Laser Drive Output
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Pin Description – continued

58 CDDSP ASY I Asymmetric Correction
59 CDDSP PCO O PLL PCO Output
60 CDDSP FCO O PLL FCO-DAC Output
Focus Drive Output
61 CDDSP FDOUT GPIO2[12] I/O
Use this pin as analog pin.
Tracking Drive Output
62 CDDSP TDOUT GPIO2[13] I/O
Sled Drive Output
63 CDDSP SDOUT GPIO2[14] I/O
CLV Drive Output
64 CDDSP CLVOUT GPIO2[15] I/O
65 CDDSP CLK88 GPIO2[16] I/O Clock Output for Driver IC or GPIO
66 JTAG JTAG_TDO O JTAG TDO
67 JTAG JTAG_TCK I JTAG TCK
68 JTAG JTAG_TMS I JTAG TMS
69 JTAG JTAG_TDI I JTAG TDI
70 JTAG JTAG_TRST I/O JTAG TRST
71 POWER DVSS - GND
75 I2C SCL0 GPIO0[26] I/O I2C Clock I/O (0), Open drain output pin
76 I2C SDA0 GPIO0[27] I/O I2C Data I/O (0), Open drain output pin
77 I2S OUT MCLKO GPIO0[28] I/O Digital Audio Master Clock Output
80 POWER DVSS - GND
81 I2S OUT DATAO0 GPIO0[29] I/O Digital Audio Data Output (0)
82 I2S OUT BCKO GPIO0[30] I/O Digital Audio Bit Clock Output
83 I2S OUT LRCKO GPIO0[31] I/O Digital Audio Channel Clock Output
84 I2S OUT DATAO1 GPIO1[0] I/O Digital Audio Data Output (1)
85 POWER DVSS - GND
86 FLASH FL_DAT2 GPIO1[1] I/O Serial Flash ROM IF Data I/O (2)
87 FLASH FL_DAT1 GPIO1[2] I/O Serial Flash ROM I/F Data I/O (1)
88 FLASH FL_CS GPIO1[3] I/O Serial Flash ROM I/F Command Output
90 FLASH FL_CLK GPIO1[5] I/O Serial Flash ROM I/F Clock Output
92 POWER DVDD_LV - 1.5V Power Supply
97 USB USB_DM I/O USB D-
98 USB USB_DP I/O USB D+
99 POWER DVSS - GND
USB Reference Voltage Output. Connect a pull down
resistance to DVSS pin. The pull down resistance must be
12.3 kΩ±1%.
100 USB REXTI I
About on PCB, do not wire as long as possible and not wire
side by side long distance with noise line, especially note
the next pin UART0_RXD(pin101).
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Pin Description - continued

101 UART UART0_RXD GPIO1[10] I/O UART0 Receive Data
102 UART UART0_TXD GPIO1[11] I/O UART0 Transmit Data
103 UART UART0_RTS GPIO1[12] I/O UART0 Transfer Request
104 UART UART0_CTS GPIO1[13] I/O UART0 Clear Request
110 I2S IN LRCKI0 GPIO1[19] I/O Digital Audio Channel Clock Input (0)
111 I2S IN BCKI0 GPIO1[20] I/O Digital Audio Bit Clock Input (0)
112 I2S IN DATAI0 GPIO1[21] I/O Digital Audio Data Input (0)
113 I2S IN LRCKI1 GPIO1[22] I/O Digital Audio Channel Clock Input (1)
114 I2S IN BCKI1 GPIO1[23] I/O Digital Audio Bit Clock Input (1)
115 I2S IN DATAI1 GPIO1[24] I/O Digital Audio Data Input (1)
116 UART UART1_RTS GPIO1[25] I/O UART1 Transfer Request
117 UART UART1_CTS GPIO1[26] I/O UART1 Clear Request
118 I2C SCL1 GPIO1[27] I/O I2C Clock I/O (1), Open drain output pin
119 I2C SDA1 GPIO1[28] I/O I2C Data I/O (1), Open drain output pin
120 RCR RCR GPIO1[29] I/O Remote Controller Signal Input
121 UART UART1_RXD GPIO1[30] I/O UART1 Receive Data
122 UART UART1_TXD GPIO1[31] I/O UART1 Transmit Data
123 POWER DVSS - GND
124 CLOCK XIN_32K I X'tal(32.768KHz) connection input pin.
125 CLOCK XOUT_32K O X'tal(32.768KHz) connection output pin.
126 TEST TMODE I Test Mode pin: This pin is connected to GND.
127 CLOCK XIN_PLL I X'tal(16.9344MHz) Connection Input
128 CLOCK XOUT_PLL O X'tal(16.9344MHz) Connection Output
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Application Circuit Diagram
Serial Flash ROM

SIO0 GND
SCLK SIO2 ICE(ARM debugger)
SIO3 SIO1 for software debug
VDDH
VCC CS#
VDDH
0.1µ VDDH
*. The Pull-up resistor of the I2C bus is affected by a condition of
Slave IC or PCB. Please adjust the value of resistor as needed.
22 22 22 22 22 22 Audio Device 33
Amp
I2C
I/F 10k
About REXT (pin100) on PCB, do not wire Digital 10k
as long as possible and not wire side by VDDH VDDL Audio I/F
10k
side long distance with noise line, especially 10k
note the next terminal UART0_RXD 0.1µ
10k
(*) 10k
0.1µ
(pin101). 0.1µ (*)
96
95
94
93
92
91
90
89
88
FL_DAT1 87
86
85
84
83
82
81
80
79
78
77
76
75
74
GPIO0_24 73
72
71
70
69
68
67
66
65
5V
CLK88
JTAG_TDI
JTAG_TMS
GPIO1_7
FL_DAT0
FL_DAT3
FL_CS
FL_DAT2
DATAO1
LRCKO
BCKO
DATAO0
DVSS
DVDD_HV
MCLKO
GPIO0_23
DVSS
JTAG_TDO
GPIO1_9
GPIO1_8
DVSS
GPIO0_25
SCL0
DVDD_LV
FL_CLK
DVDD_HV
JTAG_TRST
JTAG_TCK
DVDD_HV
SDA0
VBUS 1 0.1µ
DM 2 97 USB_DM CLVOUT 64
[USB]
DP 3 98 USB_DP SDOUT 63
GND 4 99 DVSS TDOUT 62

12.3k
100 REXTI FDOUT 61
TX 101 UART0_RXD FCO 60
[Device] RX 102 UART0_TXD PCO 59
UART I/F RTS 103 UART0_RTS ASY 58
CTS 104 UART0_CTS LD 57
105 GPIO1_14 PD 56
CD
106 GPIO1_15 F 55
Block
107 GPIO1_16 E 54 Reference
108 GPIO1_17 AVSS 53
109 GPIO1_18 VBIAS 52

LRCLK
110 LRCKI0 BD 51
Digital Audio
BCLK 111 BCKI0 AC 50
output
112 DATAI0 AVDD 49
DATA
113 LRCKI1 AD_MONI1 48
114 BCKI1 AD_MONI0 47
115 DATAI1 EQO 46
116 UART1_RTS RFI 45
10k 117 UART1_CTS ANA_MONI1 44

(*)
I2C 118 SCL1 ANA_MONI0 43
10k
I/F (*) 119 SDA1 VSS_ADC 42
Remote Control 120 RCR ADIN7 41
Receiver Module
121 UART1_RXD ADIN6 40
122 UART1_TXD ADIN5 39
123 DVSS ADIN4 38

10p VDDH
124 XIN_32K ADIN3 37
10p 32.768kHz 4.7M
125 XOUT_32K ADIN2 36 2.7k
0 126 TMODE ADIN1 35

10p 680 1.2K 2.2K 6.8K
127 XIN_PLL ADIN0 34
VDDH
10p 16.9344MHz 1M
128 XOUT_PLL VDD_ADC 33
DVDD_HV
GPIO0_21
30 GPIO0_20
11 DVDD_HV
17 DVDD_HV
32 GPIO0_22
29 GPIO0_19
15 GPIO0_10
0.1μ
18 DVDD_LV
SD_DAT0
SD_DAT1
SD_DAT3
10 SD_DAT2
SD_CMD
14 GPIO0_9
13 GPIO0_8
SD_CON
RESETX
SD_CLK
SD_WP
270
23 MSCLK
0.1μ
27 SSCLK
24 MSDO
21 MSCS
28 SSDO
19 DVSS
12 DVSS
16 DVSS
20 DVSS
25 SSCS
22 MSDI
26 SSDI
31
1
H
L
0.1µ
VDDH
* Design route of X’tal, IC and capacitor to be the shortest
because the characteristic of X’tal oscillation is sensitive for
Write protect
DAT3
DAT2
CLK
CDM
Connect
DAT1
DAT0
routing of PCB pattern. 0.1µ 0.1µ 0.1µ
X’tal using for matching with ROHM’s evaluation board

- 32.768kHz
NIHON DEMPA KOGYO CO., LTD. [SD Card]
Parts Name：NX3215SA [Device0] [Device1]
- 16.9344MHz SlaveSPI MasterSPI
NIHON DEMPA KOGYO CO., LTD.
Parts Name：NX3225GA
VDDH VDDH VDDL
Figure 3. Application Circuit Diagram
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Absolute Maximum Ratings (Ta=25°C)

Parameter Symbol Rating Unit Remarks
Input Voltage DVDD_HV, VDD_ADC,
VDDHMAX -0.3 to +4.5 V
(Analog, I/O) AVDD
Input Voltage (Core) VDDLMAX -0.3 to +2.1 V DVDD_LV
Input Voltage VIN -0.3 to VDDH+0.3 V
Storage Temperature
TSTG -55 to +125 °C
Range
Operating Temperature
TOPR -40 to +85 °C
Range
Maximum Junction
Tjmax +125 °C
Temperature
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta=25°C)

Parameter Symbol Rating Unit Remarks
Input Voltage DVDD_HV, VDD_ADC,
VDDH 3.0 to 3.6 V
(Analog, I/O) AVDD
Input Voltage (Core) VDDL 1.45 to 1.65 V DVDD_LV
Thermal Resistance (Note 1)

Thermal Resistance (Typ)
Parameter Symbol (Note 3) (Note 4) Unit
1s 2s2p
HTQFP128UA
Junction to Ambient θJA 54.9 27.6 °C/W
(Note 2)
Junction to Top Characterization Parameter ΨJT 10 9 °C/W
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Material Board Size
Measurement Board
Single FR-4 114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern Thickness
Footprints and Traces 70µm
Layer Number of Thermal Via (Note 5)

Material Board Size
Measurement Board Pitch Diameter
4 Layers FR-4 114.3mm x 76.2mm x 1.6mmt 1.20mm Φ0.30mm
Top 2 Internal Layers Bottom
Copper Pattern Thickness Copper Pattern Thickness Copper Pattern Thickness
Footprints and Traces 70µm 74.2mm (Square) 35µm 74.2mm (Square) 70µm
(Note 5) This thermal via connects with the copper pattern of all layers.
Caution: As reference information of thermal design, thermal resistance of 1s and 2s2p are described. If the maximum junction temperature rating be exceeded
the rise in temperature of the chip may result in deterioration of the properties of the chip. Increase the board size and copper area to prevent exceeding the
maximum junction temperature rating. This IC is recommended more than 2s PCB.
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Electrical Characteristics
(Unless otherwise noted, Ta=25°C, DVDD_HV = VDD_ADC = AVDD = 3.3V, DVDD_LV = 1.5V, DVSS=VSS_ADC=AVSS
=0V, XIN_PLL= 16.9344MHz, XIN_32K =32.768kHz, REXTI pin externally fitted resistance = 12.3 kΩ±1%)
Rating Conditions
Parameter Symbol Unit
MIN TYP MAX Suitable Pin
<Overall>
Operating Current
IDDFS1 - 65 130 mA Using USB Full-Speed
Consumption (VDDH)
Operating Current
IDD2 - 150 210 mA
Consumption (VDDL)
In a standby mode
Consumption current ISTBH - 1.1 - mA At standby mode
(VDDH)
In a standby mode
Consumption current ISTBL - 50 - μA At standby mode
(VDDL)
<Logic Interface>
(Note 1)
H input current IIH - - 1.0 μA
(Note 1)
L input current IIL -1.0 - - μA
(Note 1)
Input “H” Voltage VIH VDDH*0.7 - VDDH V
(Note 1)
Input “L” Voltage VIL DVSS - VDDH*0.3 V
(Note 2)
Output “H” Voltage 1 VOH1 VDDH-0.4 - VDDH V IOH=-1.6mA,
(Note 2)
Output “L” Voltage 1 VOL1 0 - 0.4 V IOL=1.6mA.
(Note 3)
(Note 3) (Note 4)
Output “L” Voltage 2 VOL2 0 - 0.4 V IOL=3.6mA,
(Note 5)
(Note 5)
Output “L” Voltage 3 VOL3 0 - 1.0 V IOL=0.6mA,
<USB Interface>
(Note 7)
Idle Pull-Up Resistance RPU_ID 0.9 - 1.575 kΩ
(Note 7)
RX Pull-Up Resistance RPU_RX 1.425 - 3.09 kΩ
(Note 6)
Pull-Down Resistance RPD 14.25 - 24.8 kΩ
(Note 6)
FS High Output Impedance ZFDRH - 45 - Ω
(Note 6)
FS Low Output Impedance ZFDRL - 45 - Ω
Measured when pin is pulled
FS High Voltage VFOH 2.8 - 3.6 V down to VSS using 15 kΩ resistor
(Note 6)
Measured when pin is pulled up

FS Low Voltage VFOL 0 - 0.3 V to DVDD_HV using 1.5 kΩ
(Note 6)
resistor
FS RX Differential Input (Note 6)
VFLSNS - - 200 mV
Sensitivity
FS RX Differential Input (Note 6)
VFLCM 0.8 - 2.5 V
Range
(Note 6)
H input voltage VIHUSB 2 - VDDH V
(Note 6)
L input voltage VILUSB DVSS - 0.8 V
<ADC>
A/D Conversion Frequency FADCONV - - 705.6 kHz FADCONV≤16.9344MHz/24
Analog Input Voltage Range VAIN 0.1*VDDH - 0.9*VDDH V
Differential Non-Linearity DNL - - ±5 LSB
Integral Non-Linearity INL - - ±5 LSB
(Note 1) Input pin 1,2,4-10,13-15,21-32,34-41,43-44,47-48,65,67-70,72-77,81-84,86-91,93-95,101-122 pin

(Note 2) Output pin1 13-15,29-32,34-41,43,44,47,48,61-66,77,81-84,93-95,101-117,120-122 pin
(Note 3) Output pin2 2,4-10,21-28,72-74,86-91 pin
(Note 4) Output pin3 75,76,118,119 pin
(Note 5) Output pin4 125,128 pin
(Note 6) USB pin 97,98 pin
(Note 7) USB pin 98 pin
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Electrical Characteristics – continued

(Unless otherwise noted, Ta=25°C, DVDD_HV = VDD_ADC = AVDD = 3.0V, DVDD_LV = 1.55V, DVSS= VSS_ADC= AVSS=
0V, XIN_PLL= 16.9344MHz, XIN_32K =32.768kHz, RL=10kΩ, VBIAS=Reference)
Rating Conditions
Parameter Symbol Unit
MIN TYP MAX Suitable Pin
<PLL (VCO) Block>
Maximum Oscillation
fVCOH 4.6 6.5 - MHz GPIO1_7,1/4 of VCO Output
Frequency
Minimum Oscillation
fVCOL - 1.1 1.7 MHz GPIO1_7,1/4 of VCO Output
Frequency
<FC DAC>
Offset Voltage VFCOF -50 - +50 mV FCO
Maximum Output
VFCH 0.2 0.5 - V FCO
Voltage
Minimum Output
VFCL - -0.5 -0.2 V FCO
Voltage
<PCO.>
Output “L” Voltage VPCH - -1.0 -0.6 V PCO
Output “H” Voltage VPCL 0.6 1.0 - V PCO
< EFM Comparator >
Threshold Voltage VEFM -200 - 200 mV RFI,ANA_MONI0,GPIO1_8
<Servo ADC>
Offset Voltage VADOF -140 - +140 mV ANA_MONI0,ANA_MONI1
Maximum Conversion
VADH 1.0 1.2 1.4 V ANA_MONI0,ANA_MONI1
Voltage
Minimum Conversion
VADL -1.4 -1.2 -1.0 V ANA_MONI0,ANA_MONI1
Voltage
<Servo DAC>
Offset Voltage VDAOF -80 - +80 mV FDOUT,TDOUT,SDOUT,CLVOUT
Maximum Output
VDAH 0.8 1.2 - V FDOUT,TDOUT,SDOUT,CLVOUT
Voltage
Minimum Output
VDAL - -1.2 -0.8 V FDOUT,TDOUT,SDOUT,CLVOUT
Voltage
<Bias Amplifier>
Maximum Output
IBO - ±1.5 - mA VBIAS, BIAS Fluctuation: 200mV or less
Current
<RF Amplifier>
Offset Voltage VRFOF - 0 - mV AC,BD,EQO
Maximum Output
VRFH 1.0 1.2 - V AC,BD,EQO
Voltage
Minimum Output
VRFL - -1.3 -1.1 V AC,BD,EQO
Voltage
<FE Amplifier>
Offset Voltage VFEOF - 0 - mV AC,BD,ANA_MONI0,ANA_MONI1
Maximum Output
VFEH 1.0 1.4 - V AC,BD,ANA_MONI0,ANA_MONI1
Voltage
Minimum Output
VFEL - -1.4 -1.0 V AC,BD,ANA_MONI0,ANA_MONI1
Voltage
<TE Amplifier>
Offset Voltage VTEOF - 70 - mV E,F,ANA_MONI0,ANA_MONI1
Maximum Output
VTEH 1.0 1.4 - V E,F,ANA_MONI0,ANA_MONI1
Voltage
Minimum Output
VTEL - -1.4 -1.0 V E,F,ANA_MONI0,ANA_MONI1
Voltage
<Asymmetry Amplifier>
Offset Voltage VASYOF - 0 - mV ASY=VBIAS,RFI,ANA_MONI0
Maximum Output
VASYH 1.1 1.4 - V ASY,RFI,ANA_MONI0
Voltage
Minimum Output
VASYL - -1.4 -1.1 V ASY,RFI,ANA_MONI0
Voltage
<APC Block>
PD=”H”,
Output Voltage 1 VAPC1 2.4 2.8 - V
LD,ANA_MONI0
PD=”L”,
Output Voltage 2 VAPC2 - 0.1 0.5 V
LD,ANA_MONI0
Maximum Reference
VAPCH - 220 - mV PD,LD,ANA_MONI0
Voltage
Minimum Reference VAPCL - 145 - mV PD,LD,ANA_MONI0
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Application Information
Power on/ Reset Timing/ Power off

Release the Reset Signal by L input with over 100μs after clock input from I/O pins of 16.9344MHz becomes stable.
(See Figure 4)
Waiting for Oscillation Stabilization

DVDD_HV
VDD_ADC
AVDD
DVDD_LV
XIN_PLL
RESETX
tVDDon tRSTX
XIN_32K
Figure 4. Power on/ Reset Timing
DVDD_HV
VDD_ADC
AVDD
DVDD_LV
XIN_PLL
tVDDoff
Figure 5. Power off
Rating
Parameter Symbol Unit Remarks
MIN TYP MAX
Time lag of Power Supply
tVDDon 0 - - ms
at Starting
Reset L Interval tRSTX 100 - - μs
Time lag of Power Supply
tVDDoff 0 - - ms
at Shutting down.
Note) There is a risk that the electric current flows in case the order of power supply starting and shutting down is other than the above order.
Oscillation Stable Time

Suggested value for XIN_PLL(16.9344MHz) oscillation stable time is 4ms.
Suggested value for XIN_32K(32.768kHz) oscillation stable time is 500ms.
The above-mentioned oscillation stable time cannot be guaranteed since the oscillation stable time depends on crystal
oscillator, external constant, or board layout. Check the oscillation stable time of your own system.
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
I/O Equivalence Circuits
No. Name I/O Power Internal Circuits No. Name I/O Power Internal Circuits
1 RESETX I 2 SD_WP I DVDD_HV
DVDD_HV 4 SD_CON I
5 SD_DAT1 I/O
6 SD_DAT0 I/O
7 SD_CLK O
8 SD_CMD O
9 SD_DAT3 I/O
10 SD_DAT2 I/O
34 ADIN0 I 13 GPIO0_8 I/O
35 ADIN1 I VDD_ADC 14 GPIO0_9 I/O
36 ADIN2 I 15 GPIO0_10 I/O
37 ADIN3 I 21 MSCS O
38 ADIN4 I 22 MSDI I
39 ADIN5 I 23 MSCLK O
40 ADIN6 I 24 MSDO O
41 ADIN7 I 25 SSCS I
43 ANA_MONI0 O 26 SSDI I
44 ANA_MONI1 O AVDD 27 SSCLK I
47 AD_MONI0 O 28 SSDO O
48 AD_MONI1 O 29 GPIO0_19 I/O
61 FDOUT O 30 GPIO0_20 I/O
62 TDOUT O 31 GPIO0_21 I/O
63 SDOUT O 32 GPIO0_22 I/O
64 CLVOUT O 65 CLK88 O
72 GPIO0_23 I/O
45 RFI I 73 GPIO0_24 I/O
AVDD 74 GPIO0_25 I/O
77 MCLKO O
81 DATAO0 O
82 BCKO O
83 LRCKO O
84 DATAO1 O
46 EQO O 93 GPIO1_7 I/O
AVDD 94 GPIO1_8 I/O
95 GPIO1_9 I/O
101 UART0_RXD I
102 UART0_TXD O
103 UART0_RTS O
104 UART0_CTS I
105 GPIO1_14 I/O
106 GPIO1_15 I/O
50 AC I 107 GPIO1_16 I/O
51 BD I AVDD 108 GPIO1_17 I/O
109 GPIO1_18 I/O
110 LRCKI0 I
111 BCKI0 I
112 DATAI0 I
113 LRCKI1 I
54 E I 114 BCKI1 I
55 F I AVDD 115 DATAI1 I
116 UART1_RTS I/O
117 UART1_CTS I/O
120 RCR I
121 UART1_RXD I
122 UART1_TXD O
Figure 6. I/O equivalence circuits 1
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
I/O Equivalence Circuits – continued
No. Name I/O Power Internal Circuits No. Name I/O Power Internal Circuits
56 PD I 75 SCL0 I/O
57 LD O AVDD PD
76 SDA0 I/O DVDD_HV
LD
118 SCL1 I/O
119 SDA1 I/O
86 FL_DAT2 I/O DVDD_HV

58 ASY I 87 FL_DAT1 I/O
AVDD 88 FL_CS O
89 FL_DAT3 I/O
90 FL_CLK O
91 FL_DAT0 I/O
97 USB_DM I/O
98 USB_DP I/O DVDD_HV
52 VBIAS O
USB_DM
AVDD
USB_DP
59 PCO O 100 REXTI I

60 FCO O AVDD DVDD_HV
PCO
124 XIN_32K I
FCO
125 XOUT_32K O DVDD_HV
XIN_32K XOUT_32K
66 JTAG_TDO O
DVDD_HV
127 XIN_PLL I
128 XOUT_PLL O DVDD_HV
XIN_PLL XOUT_PLL
67 JTAG_TCK I
68 JTAG_TMS I DVDD_HV
69 JTAG_TDI I
70 JTAG_TRST I
126 TMODE I
Figure 7. I/O equivalence circuits 2
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Operational Notes1
1. About Compatibility in USB Memory Device and SD Memory Card

According to the file structure and communication speed of USB memory, SD memory card, this LSI might not play
back correctly.
2. About Compatibility in Bluetooth device

According to the type of Bluetooth device, , this LSI might not play back correctly.
3. About 2X Speed Recording

Recording to a memory with slow access speed may require data connection operation.
2X speed recording to all the memories cannot be guaranteed.
4. Power OFF or Memory Disconnection Under Memory Writing

The sudden power off or memory disconnection during recording or file write operation to a memory may break the data
in a memory.
5. Browsing Operation
With a memory with slow access speed, browsing operation during music playing may generate skipping.
6. CD-ROM Playing
CD-ROM playing operation is premised on data being inputted so that an internal data buffer may not become empty.
When an input does not meet the deadline and internal data buffers become empty, skipping occurs.
7. Playing Time of MP3 File

The playing time when MP3 file playing may shift when fast forward playing, rewind playing, and VBR playing.
8. Write-In Operation Exceeding Memory Size

Writing to a file when memory size is exceeded is not supported.
9. Write-In Operation of the File Size Exceeding FAT Specification

Writing to a file when file size is exceeded is not supported.
10. About I2C Format I/F

Although this LSI has adopted the I2C format, the level shifter circuit is not built in.
For this reason, level shifter is needed for connection with the device besides the range of operating power supply
voltage of this LSI.
11. CD Media Playing

According to the condition of CD media, flawed, dirty, curved, eccentric and etc., this LSI might not play back normally.
12. Application Block Diagram

Each software function of Audio Encoder, Audio Decoder, BT stack A2DP, SBC Decoder and File System(FTA12/16/32,
ISO9660) described in Figure 1. Application Block are realized by downloading applicable program from external Serial
Flash ROM.
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Operational Notes2
1. Reverse Connection of Power Supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
2. Power Supply Lines

Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern

When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6. Recommended Operating Conditions

These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Operational Notes2 – continued
9. Testing on Application Boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors

Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins

Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC

In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor

When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Ordering Information
B M 9 4 7 1 5 E K U - Z
Part Number Package

HTQFP128UA,supply with tray
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Marking Diagram
HTQFP128UA (TOP VIEW)

Part Number Marking
94715 LOT Number
1PIN MARK
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Physical Dimension, Tape and Reel Information

Package Name HTQFP128UA
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
BM94715EKU
Revision History
Date Revision Changes
22.Dec.2016 001 New Release
P10: Modified Block name of 118/119pin to I2C.
25.Jan.2017 002
P18: Added Note about Application Block diagram.
www.rohm.com
TSZ22111・15・001 25.Jan.2017 Rev.002
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅡb
CLASSⅢ CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label

A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition

When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act

Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights

1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
Notice-PGA-E Rev.003
Datasheet
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Notice – WE Rev.001

Bm94715eku Rohm

Uploaded by

Copyright:

Available Formats

Bm94715eku Rohm

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Bm94715eku Rohm

Uploaded by

Copyright:

Available Formats

Datasheet

Audio 1-Chip SOC

 GPIO USB Memory

PC / iPod File System Decoder

 Quad SPI I/F CD

 SPI I/F (Master/Slave)

 UART I/F Decode Path

 CD Servo Controllers 16.9344MHz

 CD-ROM Decoder / 32.768KHz

 General Purpose A/D Converter KEY

BM94801KUT BM94803AEKU BM94715EKU

Package TQFP128UM HTQFP128UA HTQFP128UA

Peripheral UART I/F 2ch 2ch 2ch

ARM946ES Microprocessor Core

Initial Program ROM

USB2.0 Dual Role (Host/Device) controller

Quad SPI I/F

I2C I/F (Master/Slave)

I2S Input I/F

I2S Output I/F

General Purpose A/D Converter

Remote Controller Receiver (RCR)

Power Supply Voltage

Figure 2. Pin Assignment

Pin Description – continued

Pin Description - continued

Application Circuit Diagram

Serial Flash ROM

GND 4 99 DVSS TDOUT 62

TX 101 UART0_RXD FCO 60

[Device] RX 102 UART0_TXD PCO 59

UART I/F RTS 103 UART0_RTS ASY 58

CTS 104 UART0_CTS LD 57

109 GPIO1_18 VBIAS 52

114 BCKI1 AD_MONI0 47

115 DATAI1 EQO 46

116 UART1_RTS RFI 45

10k 117 UART1_CTS ANA_MONI1 44

122 UART1_TXD ADIN5 39

123 DVSS ADIN4 38

0 126 TMODE ADIN1 35

routing of PCB pattern. 0.1µ 0.1µ 0.1µ

X’tal using for matching with ROHM’s evaluation board

VDDH VDDH VDDL

Figure 3. Application Circuit Diagram

Absolute Maximum Ratings (Ta=25°C)

Recommended Operating Conditions (Ta=25°C)

Thermal Resistance (Note 1)

Layer Number of Thermal Via (Note 5)

Measured when pin is pulled up

(Note 1) Input pin 1,2,4-10,13-15,21-32,34-41,43-44,47-48,65,67-70,72-77,81-84,86-91,93-95,101-122 pin

Electrical Characteristics – continued

Power on/ Reset Timing/ Power off

Waiting for Oscillation Stabilization

Figure 4. Power on/ Reset Timing

Figure 5. Power off

Oscillation Stable Time

I/O Equivalence Circuits

Figure 6. I/O equivalence circuits 1