LINEAR INTEGRATED CIRCUIT

1 W AUDIO AMPLIFIER
The TBA 810 S is a monolithic integrated circuit in a 12 lead quad in-line plastic package, intended for
use as a low frequency class B amplifier.
The TBA 810 S provides 7 W power output at 16 V/4 n, 6 W at 14.4 V/If n, 2.5 W at9 V/4 n, 1 Wat
6 V/4 n and works with a wide range of supply voltages (4 to 20 V); it gives high output current (up to
2.5 A), high efficiency (75% at 6 W output). very low harmonic and cross-over distortion. In addition,
the circuit is provided with a thermal protection circuit.
The TBA 810 AS has the same electrical characteristics as the TBA 810S, but its cooling tabs are flat
and pierced so that an external heatsink can easily be attached.

ABSOLUTE MAXIMUM RATINGS

VS Supply voltage 20 V
10 Output peak current (non-repetitive) 3.5 A
10 Output current (repetitive) 2.5 A
Ptot Power dissipation: at Tamb = 70°C W
at T tab = 100°C 5 W
T st9 ' T j Storage and junction temperature -40 to 150 °C

ORDERING NUMBERS: TBA 810 S

TBA810 AS

MECHANICAL DATA Dimensions in mm

1 " ' lUB

~
"-
' ...•..............'.

~
.. .•...........•.........

TBA810S TBA810As

6/82 396
CONNECTION AND SCHEMATIC DIAGRAM I

(top view) j
I,

05

SUPPLY 12 OUTPUT
VOLTAGE
08
N.C. N. C.

N. C. 10 GROUND

GROUND GROUND

BOOTSTRAP GROUND
(SUBSTRATE) 013
COMPENSATION INPUT
RIPPLE
FEEDBACK REJECTION Q16

5-0289

D4
D9
RII

TEST AND APPLICATION CIRCUIT

C9 C6 1000
O.1~F I I 100~F
lSV

C8
100)'F
15V
12
Tabs
R2
C2
100kil C3* 1000~F
1500pF 15V

C7*r C4
600pF O.1~F
(5 Rl
( I 100~F 10
500~F 15V
• See fig. 5. 6V
5-0142/3

THERMAL DATA TBA810S TBA810AS

Rth j-tab Thermal resistance junction-tab max 12°C/W 10°C/W
Rth j-amb Thermal resistance junction-ambient max 70*0 C/W 80 0 C/W

* Obtained with. tabs soldered to printed circuit with minimized copper area.

397
ELECTRICAL CHARACTERISTICS (Refer to the test circuit; Tamb = 25 °el

Parameter Test conditions Min. Typ. Max. Unit

Vs Supply voltage (pin 1) 4 20 V

Vo Quiescent output voltage (pin 12) 6.4 7.2 8 V
Id Quiescent drain current Vs = 14.4V 12 20 mA
Ib Bias current (pin 8) 0.4 jlA
Po Power output d - 10%
R L = 4n
f = 1 kHz
V s = 16V 7 W
V s = 14.4V 5.5 6 W
V s = 9V 2.5 W
V s = 6V 1 W

Vi(rms) I nput voltage 220 mV

Vi I nput sensitivity Po - 6W
Vs=14.4V
R L =4n
f =1kHz
R f = 56n 80 mV
Rf =22n 35 mV

Ri I nput resistance (pin 8) 5 Mn

B Frequency response Vs = 14.4V
(-3 dB) RL=4n
C3 =820 pF 40 to 20,000 Hz
C3 = 1500 pF 40 to 10,000 Hz
d Distorsion Po = 50mW to 3W
Vs=14.4V
RL =4n
f =1kHz 0.3 %
Gv Voltage gain Vs=14.4V
(open loop) R L =4n
f =1kHz 80 dB
Gv Voltage gain Vs=14.4V
(closed loop) R L =4n
f = 1kHz 34 37 40 dB

eN Input noise voltage Vs=14.4V

Rg =0
B (-3 dB) = 20Hz to
20,000 Hz 2 jlV

iN I nput noise current Vs=14.4V

B (-3 dB) = 20 Hz to
20,000 Hz 0.1 nA

1'/ Efficiency Po =5W

Vs = 14.4V
RL =4n
f =1kHz 70 %
SVR Supply voltage rejection Vs=14.4V
R L =4n
f ripple = 100 Hz 38 dB

398
 Fig. 1 - Power output versus Fig. 2 - Maximum power Fig. 3 - D istorsion versus
supply voltage dissipation versus supply output power
voltage (sine wave operation)
G09"',

W~-
Pto t

k~li (~.I HttHt----t,-t--t-l++t-H

~HI:~
Po
I

J
(wi -f _L I LL L IW I -----
'd_lOO,.
f
-1 I'
f= 1 kHz 12 - - - - - IRL=40
~'~
RL:4 a '--HR, =560 I---+-++++-H-H
10 ___ 1--'!=lkHz _ - I
c---- 'Is=14.4V

t-
6 f---- - -- - \ -
'1
I-----t~_+++_H+I---­
I---~-~_r++~~--

---- I~-
----

-- II IH
12 12 16 'Is (V) 10-
1

Fig. 4 - Distorsion versus Fig. 5 - Value of C3 versus Fig. 6 - Power dissipation

frequency Rf for various values of B and efficiency versus output
power
-OUIl
d C3
(pF)
Ptot
H:± __ l . , . i I!. i

jl"'i
~,.I (W) V5 ,,14.4 V
'Is_14-4V
r-- ",=560 RL=4fl l' I 1+

6 r-- RL=4 n I ~- +; r 80
.lj-'
,I--- -
I
'V -+ + r j
"11:tj
=10kHz:

m'
.~
dr.! V 1
1 +-

2r--

1
Fb=0.05W
~IIII
~~II
,
C7=5C3
lTIh
'tI f !( I, (
1 1
fb=2S\\1~ I-

, 111111
ler , , w'
I
III ~
° tJ
4661022 4 a8 4 561(t
f(!~;) 8 PoN'-l)

Fig. 7 - Quiescent output Fig. 8 - Quiescent current Fig. 9 - Supply voltage

voltage (pin 12) versus supply versus supply voltage rejection
voltage
1+
15

I total

10

-20

~(O;t ut transistors
-30 I-~ -f--+-~-+-+-H--H
- 40 H--+--+-j-"""i-..-+--1"''i--ld-+-+-H--t--i
--~ -1--1-
-50 L-l--"---'---'--L-l--'---'--.LJ--'--'-.L..L.J
12 16 'Is (V) 10 15 Vs(V) 50 100 Rf (0)

399
For portable equipment the circuit in Fig. 10 has the advantages of fewer external components and a
better behaviour at low supply voltages (down to 4 V).

Fig. 10 - Application circuit with load connected to the supply Fig. 1,1 - Supply voltage
voltage rejection versus Rf
(circuit of fig. 10)
SVR
:1 : I I t ,t, L
l;l'j·~~~~t t-t
(dB)

C9 C6 j 1 ! 1' :f"pp',e=,100~z
O.1}JF I I
_
100~F
25V ;11;;; m
' l l t H '-
.. 1 j I ~~J•.. -
V, : :"1; t-i
-10
- 20
Ij :
t-, i I ..
i: .
R2
100ka
-30 :-11 : -; .
-40 ti ItT
; I
ltd:
50 100

MOUNTING INSTRUCTIONS
The thermal power dissipated in the circuit may be removed by connecting the tabs to an external heat
sink (TBA 810 AS - fig. 12) or by soldering them to an area of copper on the printed circuit board (TBA
810 S - fig. 13).

Fig. 12 - Maximum power Fig. 13 - Maximum power dissipation

dissipation versus ambient versus copper area of the P.C. board (for
temperature (for TBA 810 TBA 810 S only)
AS only) GC952
p~rrrn-'''TT~,,<r~''~~
I#
COPPER AREA 35,. THICKNESS
Ptot R'h
rt ~-
;~+
IXNI)
(W) i-+-+ t-r-rl-I i (W)
-t+
IT
-+- - 80

60

Rth ]-amb
40

--i'to' (Tam" ·c
20

i{tot(Tamb:: 7OOC

50 100 150Tamb(t) 10 20 30 40 l(mm)

400
During soldering the tabs temperature must not exceed 260 C and the soldering time must not be longer
0

than 12 seconds.
Fig. 14a and 14b show two ways that can be used for mounting the device.
Fig. 14a shows a method of mounting the TBA 810 S, that is satisfactory both from the point of view
of heat dissipation and from mechanical considerations. For TBA 810 AS the desired thermal resistance \1
is obtained by fixing the elements shown in fig. 14b, to a suitably dimensioned plate. This plate can also I
act as a support for the whole printed circuit board; the mechanical stresses do not damage the integrated
circuit. This is firmly fixed to the element, in fig. 14b.

Fig. 14a Fig. 14b

HEATSINK
Rth:='OOC/W

Fig. 15 - Output power and

THERMAL SHUT-DOWN drain current versus package
The presence of a thermal limiting circuit offers temperature
the following advantages:
1) An overload on the output (even if it is
permanent). or an above-limit ambient
temperature can be easily supported.
2) The heat sink can have a smaller factor of
safety compared with that of a conven-
tional circuit. There is no device damage in
the case of too high a junction temperature:
all that happens is that Po (and therefor
Ptot ) and Id are reduced (fig. 15).

50 100 150 Tcase(OC)

401