Technology Innovator for a Better World

SK hynix strives for a future where all stakeholders and

societies may prosper together through technological innovation.

’s
An Introduction

5G

Visit http://product.skhynix.com for the latest on SK hynix products.

Information within this material is up to date as of November 10, 2021
© 2021 SK hynix Inc. All rights reserved.
Specifications and designs are subject to change without notice. All data were deemed correct at time of creation.
SK hynix is not liable for errors or omissions.
B-AP-E01-211110-R01
 Overview
Discover our diverse product lines,
compatible and competitive across applications

DRAM SSD
03 Server DIMM 10 Enterprise SSD
04 PC DIMM 11 Client SSD
05 DDR
06 LPDDR
07 HBM
08 GDDR

MCP NAND Mobile

13 MCP 15 UFS
16 eMMC

and
our efforts to drive the IT ecosystem towards creating a new,
sustainable future, where people, societies,
and the environment thrive with the power of technology.

ESG Memory Forest

18 2020 at a Glance 23 Memory Forest
19 Environment
20 Social
21 Governance

SK hynix’s New Initiative for Tomorrow’s Tech Ecosystem

DRAM
Server DIMM
PC DIMM
DDR
LPDDR
HBM
GDDR
Server DIMM DRAM
RDIMM and LRDIMM for servers with separate register between DRAM and system memory controller

Features

In-DRAM ECC PMIC 3DS TSV

Improved RAS (Reliability, Availability, and More stable power supply from host to Ultra-high capacities including 128GB &
Serviceability) with DDR5 RDIMM’s in-DRAM DRAM with on-board power 256GB enabled by direct connection of
ECC (Error Correction Code) detecting and management IC (PMIC) on DDR5 RDIMM stacked DRAM die with 3DS TSV
eliminating major DRAM errors (Through Silicon Via) instead of
traditional wire bonding technique

Learn More

World’s First DDR5 RDIMMs

For server and networking solutions

Product Portfolio

RDIMM
Mode Density Configuration Data Rate
16, 32, 64, 128, 256GB (16Gb) 2Gx80, 4Gx80, 8Gx80, 4Gx72, 8Gx72, 16Gx80, 32Gx80 (16Gb die) 4,800-6,400Mbps
DDR5
24, 48, 96GB (24Gb) 3Gx80, 6Gx80, 12Gx80, 6Gx72, 12Gx72 (24Gb die) and higher

DDR4 16, 32, 64, 128, 256GB 2Gx72, 8Gx72, 16Gx72, 32Gx72 2,666-3,200Mbps

LRDIMM
Mode Density Configuration Data Rate
DDR4 64, 128, 256GB 2Gx72, 8Gx72, 16Gx72, 32Gx72 2,666-3,200Mbps

Applications
Server Networking

See link for information regarding RELATED MATERIALS

Datasheet / Part No. Decoder / SPD / Device Operation / Label Information / Handling guide

03
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PC DIMM DRAM
Unbuffered DIMM (UDIMM) and Small-outline DIMM (SODIMM) for PC computing systems

Features

In-DRAM ECC PMIC Easy of Replacement

Improved RAS (Reliability, Availability, and More stable power supply from host to UDIMM being standard form factor for
Serviceability) with DDR5 UDIMM and DRAM with on-board power desktops and SODIMM for laptops, both
SODIM in-DRAM ECC (Error Correction management IC (PMIC) on DDR5 UDIMM are easy to maintain and replace
Code) detecting and eliminating major and SODIM
DRAM errors

Learn More
Change smart flexibility,
enhanced scalability your remotely,
desktop and laptop with SK hynix

Product Portfolio

UDIMM
Mode Density Configuration Data Rate

DDR5 1Gx64, 1.5Gx64, 2Gx64, 3Gx64, 4Gx64, 6Gx64,

8-48GB 4,800-6,400Mbps and higher
1Gx72, 2Gx72, 3Gx72, 4Gx72, 6Gx72
512Mx64, 1Gx64, 2Gx64, 4Gx64,
DDR4 4-32GB 2,666-3,200Mbps
1Gx72, 2Gx72, 4Gx72

SODIMM
Mode Density Configuration Data Rate
1Gx64, 1.5Gx64, 2Gx64, 3Gx64, 4Gx64, 6Gx64,
DDR5 8-48GB 4,800-6,400Mbps and higher
1Gx72, 2Gx72, 3Gx72, 4Gx72, 6Gx72
512Mx64, 1Gx64, 2Gx64, 4Gx64,
DDR4 4-32GB 2,666-3,200Mbps
1Gx72, 2Gx72, 4Gx72

Applications
PC Networking

See link for information regarding RELATED MATERIALS

Datasheet / Part No. Decoder / SPD / Device Operation / Label Information / Handling guide

04
Contents are up to date as of November 10, 2021. Click here to view the full SK hynix PC DIMM lineup
DDR DRAM
Double Data Rate solutions for fast compute and stable data transfers

Features

32Banks DDR5 Higher Speed Power Savings

Within 32 DRAM banks in eight groups, Data rates enhanced to 4,800Mbps on Greater efficiency with 2x speeds on
Same Bank Refresh enables access during DDR5 and tracking further to DDR5 1.1V of operating voltage and
refresh to all remaining banks not 6,400Mbps vs. DDR4 maximum speed of 20% total power savings vs. DDR4
targeted for refresh, improving latency 3,200Mbps
and channel utilization over DDR4

Learn More

SK hynix Launches World’s First DDR5 DRAM

Product Portfolio

Mode Density Organization Data Rate

DDR5 16, 24Gb 4,800-6,400Mbps and higher
x16, x8
DDR4 4-16Gb 2,666-3,200Mbps

Applications
Server PC Networking Consumer

Mode Density Organization Data Rate

DDR3 4Gb x16, x8 800-2,133Mbps

Applications
Networking Consumer Automotive

See link for information regarding RELATED MATERIALS

Datasheet / Part No. Decoder / Device Operation

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Contents are up to date as of November 10, 2021. Click here to view the full SK hynix DDR lineup
LPDDR DRAM
Low-power memory with rapid data processing for premium mobile and automotive experience

Features

Higher Scability Faster Perormance Power Efficiency

LPDDR5 expands configurable module LPDDR5 doubles performance to LPDDR5 saves power with lower supply
capacity from 8GB and 12GB to 18GB, the 6,400Mbps in data rate with voltage required (1.05V) vs. LPDDR4X
industry’s largest, in line with growing architecture of 16 banks, 2x vs. LPDDR4 (1.1V)
needs for larger mobile memory

Learn More Learn More

Smartphones, laptops SK hynix begins volume-producing

and cars solutions, LPDDR5 LPDDR5 with industry’s largest capacity

Product Portfolio

Mode Density Data Rate

LPDDR5 6-18GB 6,400Mbps
LPDDR4X 6-12GB 4,266Mbps

Applications
Mobile PC Networking Consumer Automotive

Mode Density Data Rate

LPDDR4 6-12GB 4,266Mbps

Applications
PC Networking Consumer Automotive

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HBM DRAM
High-bandwidth memory solution that supports supercomputing with ultra-high densities and speeds

Features

Fastest Performance Thermal Improvement In-Package Memory

Also referred to as “premium” or HBM2E runs an avg. 14C cooler than As an in-package memory assembled
“highest-speed” DRAM, HBM2E supports prior-gen products in the same into SoC (System-on-Chip) with a silicon
over 460GB per-second bandwidth with operational environment with 36% interposer, HBM enables use of more I/O
3.6Gbps per-pin data rates on 1,024 greater heat dissipation pins for data workloads than the
data I/Os maximum count in existing off-chip
packages

Learn More Learn More

SK hynix’s collaboration with Synopsys to validate SK hynix Announces Development

the DesignWare HBM2E IP at maximum speed of HBM3 DRAM

Product Portfolio

Mode Density Speed Package

HBM3 16-24GB ~6.4Gbps(819GB/s) 8,12Hi
HBM2E 8-16GB ~3.6Gbps(460GB/s) 4, 8Hi

Applications
Server Networking Consumer Automotive

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Contents are up to date as of November 10, 2021. Click here to view the full SK hynix HBM lineup
GDDR DRAM
Graphics memory that quickly tracks and processes sophisticated graphics for realistic rendering

Features

Intensive Graphics Data Faster Speed Lower Power Consumption

Specialized memory in processing Latest GDDR6 offers substantial GDDR6 achieves the significant
graphics and videos upon command gen-on-gen performance improvement, performance boost with 10% less power
from graphic card in PCs, workstations, reaching 20Gbps in speed and 80GB/s in of 1.35V
audiovisual devices, high-performance bandwidth
gaming systems, and GPUs

Learn More Learn More

Cloud Gaming
About SK hynix GDDR6 Play Your Game Anytime, Anywhere!

Product Portfolio

Mode Density Speed Package

GDDR6 8-16Gb Up to 16Gbps
DDP
GDDR5 8Gb 6-8Gbps

Applications
PC Consumer Server

See link for information regarding RELATED MATERIALS

Part No. Decoder

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 SSD
Enterprise SSD
Client SSD
Enterprise SSD SSD
High performance, capacity, reliability, and endurance for stringent datacenter and enterprise requirements

Features

Total Memory Solution Best-Class-Performance Optimal Product line-up

All SK hynix enterprise SSDs are a PE8000 series are SK hynix’s first PCIe Up to 32TB of large capacity and various
combination of SK hynix’s latest Gen4 NVMe enterprise drives, optimized form factors including M.2, U.2/3, and
in-house NAND flash, controller, DRAM for next-gen server and storage E1.S/L, combined with 1-3 DWPD
and firmware applications endurance rating for strongest and
power-efficient performance with any
user workload

Learn More Learn More

SK hynix’s Low-Power
NVMe PCIe Gen4 Enterprise SSDs: Maximize Value of
Available Now for Sampling your server from the core, SK hynix

Product Portfolio
PE8000 Series
Model Name Interface NAND Form Factor Density Endurance

U.2/U.3 15mm 960GB-7.68TB

PE8110 PCIe Gen4x4 V6 512Gb TLC E1.S 15mm 1.92TB-7.68TB 1 DWPD
M.2 22110 960GB-3.84TB
PE8130 PCIe Gen4x4 V6 512Gb TLC U.2/U.3 15mm 800GB-6.4TB 3 DWPD
PE8111 PCIe Gen3x4 V6 512Gb TLC E1.L 18mm/9.5mm 16TB 1 DWPD
PCIe Gen4x4 U.2/U.3 15mm 960GB-7.68TB
PE8010 V5 512Gb TLC 1 DWPD
PCIe Gen3x4 M.2 2280 480GB-1.92TB

PE8030 PCIe Gen4x4 V5 512Gb TLC U.2/U.3 15mm 800GB-6.4TB 3 DWPD

SE5000 Series
Model Name Interface NAND Form Factor Density Endurance

SE5110 SATA 6Gbps V6 512Gb TLC STD 2.5” 480GB-3.84TB 1DWPD

SE5031 SATA 6Gbps V6 512Gb TLC STD 2.5” 480GB-3.84TB 3DWPD

Applications
Server Networking

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Contents are up to date as of November 10, 2021. Click here to view the full SK hynix Enterprise SSD lineup
Client SSD SSD
Adapted to evolving client computing environments with diverse form factors, strong performance,
low power, and robust data protection

Features

PCIe Gen4 NVMe SSD Ultimate Performance Larger Capacity &

Two lines of SK hynix’s first PCIe Gen4 Maximum client SSD speeds achieved
Low Power Consumption
NVMe client SSDs – mainstream PC801 on both drives with PCIe Gen4 interface, Up to 2TB of storage even in compact
and value BC901 – equally fitted with more power-efficiently using latest V7 M.2 form factor. L1.2 low power mode
best and latest of SK hynix technologies 4D NAND flash can keep the drive running at less than
5mW for saving crucial battery life for
mobile PCs

Learn More

SK hynix’s First PCIe Gen4 NVMe Client SSD

Product Portfolio

Model Name Interface NAND Form Factor Density Grade

BC901 M.2 2230/42/80 256GB-1TB Value
PCIe Gen4x4 V7 512Gb TLC
PC801 256GB-2TB
M.2 2280 Main-Stream
PC711 256GB-1TB
PCIe Gen3x4 V6 512Gb TLC
BC711 M.2 2230/42/80 128GB-1TB Value

Applications
PC Server

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Contents are up to date as of November 10, 2021. Click here to view the full SK hynix Client SSD lineup
 MCP
Multi Chip Package
MCP MCP
Storage meets processing in hybrid package

Features

Mobile Market Solutions Higher Density & Speed Area-efficient Package

uMCP (UFS & LPDDR) or eMCP (eMMC & High-capacity and high-speed More than 40% board area saved with a
LPDDR) offered in diverse capacity and 512GB+12GB uMCP processes data at single MCP instead of individual DRAM
speed configurations, emerging as most up to 6,400Mbps speeds with continued and NAND chips
widely sought smartphone memory upgrades expected

Learn More

MCPs have upgraded your smartphone.

Product Portfolio
UFS3.1+LPDDR5
Density(NAND+DRAM) 128GB+6GB-512GB+12GB
Speed 6,400Mbps
Package 297Ball

UFS2.2+LPDDR4X
Density(NAND+DRAM) 64GB+3GB-256GB+12GB
Speed 4,266Mbps
Package 254Ball

eMMC5.1+LPDDR4X
Density(NAND+DRAM) 16GB+2GB-128GB+6GB
Speed 3,733-4,266Mbps
Package 254Ball

Applications
Mobile

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Contents are up to date as of November 10, 2021. Click here to view the full SK hynix MCP lineup
NAND Mobile
UFS
eMMC
UFS NAND Mobile
Next-generation mobile storage pushing past the capacity and performance limits
of low-power mobile systems

Features

New 5G Mobile Solution Stronger Performance Space-efficient Package

Latest UFS3.1 standard supported for UC310/220 with latest 176-layer 4D Smaller chip size of 11x13x0.8T
high-performance mobile storage in NAND combined with next-gen SoC and (1.0T@1TB) with up to 1TB in capacity
line with 5G demands firmware. Enhanced with added makes optimal solution for next-gen
features – advanced WB, HPB 2.0, HAGC mobile/automotive applications

Learn More Learn More

V7 NAND Flash, a new revolution

SK hynix 176-Layer (V7) UFS in mobile memory by SK hynix

Product Portfolio

Spec Model Name NAND Density Chip Size Type Voltage (VCC/VCCQ)
UD310 V7 512Gb TLC 128GB-1TB 11x13x0.8T
(1.0T @1TB) 2.5V/ 1.2V
UFS3.1
UC310 V6 512Gb TLC 128GB-512GB 11.5x13x1.0T 153FBGA
UD220 V7 512Gb TLC 11.5x13x0.8T
UFS2.2 64GB-256GB 3.3V/ 1.8V
UC220 V6 512Gb TLC 11.5x13x1.0T

Applications
Mobile Consumer Automotive

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Contents are up to date as of November 10, 2021. Click here to view the full SK hynix UFS lineup
eMMC NAND Mobile
Stable and optimized flash memory with automotive-grade reliability and longevity of support

Features

Optimized Interface Speed All-rounded Portfolio Longevity Solution

Optimum speeds with latest eMMC5.1 Established go-to memory solution for Diverse capacity options from 8GB to
supported by HS400 mode for many consumer electronics, from 128GB and longevity of support for
maximum interface speed and smartphones and tablets to GPS systems, discrete/automotive packages
Command Queuing (CQ) function DTV, set-top boxes, OTT, and even
automobiles

Learn More

All-round storage covering

mobile computing to automotive platforms

Product Portfolio

Model Name NAND Density Chip Size Type Spec

EE510 F1y 64Gb MLC 8GB 11.5x13x0.8T

EG510 F1z 128Gb MLC 16GB-64GB 11.5x13x0.8T 153FBGA eMMC5.1

(1.0T @64GB)

EF510 V4 256Gb MLC 128GB 11.5x13x1.0T

Applications
Mobile PC Consumer

Model Name NAND Density Chip Size & Type Spec

EE510A F1y 64Gb MLC 8GB-64GB 11.5x13x0.8T 153FPGA eMMC5.1

(1.0T @32/64GB)

Applications
Automotive

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Contents are up to date as of November 10, 2021. Click here to view the full SK hynix eMMC lineup
 ESG
2020 at a Glance
Environment
Social
Governance
 2020 at a Glance Glance

·Accumulated
KRW 270.5 billion
in Shared Growth Fund
·Signed Shared Growth Agreements
with 123 companies
·Generated KRW 73.6 billion
in social contributions

·Invested KRW 1.83 million in training and

skills development per employee
2.1%
·Maintained turnover rate of
·Created dedicated “Happiness Design”
group for women
·Ensured 99% return-to-work rates after
paternal leave
·Nominated first Honored Engineer,
technical expert without retirement age

·Won Grand Prize in CDP Water Security program

·Conserved 42.77 million tons of water
·Achieved clean water standard
for wastewater discharge
·Obtained ZWTL Gold certification at Icheon
and Cheongju sites in Korea

RE100
·Became first chipmaker to join

·Maintained its CDP Platinum Club status

in Climate Change program for fifth consecutive year
·Developed highly efficient low-power memory

RTC
Reinforced NAND and solution Established R&D organization “RTC”
competitiveness in line with Big Data ·Full-scale mass production of
Era requirements high bandwidth DRAM HBM2E
Closed deal to acquire Intel’s NAND ·Released world’s first DDR5
memory business ·Developed the industry’s highest 176-layer 4D NAND

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Environment ESG
SK hynix makes sustained efforts for a greener world.

We work to make the world We recognize the value of water

a better place with action circulation and seek to lead
to address climate change in sustainable water use
·Joined RE100 as first Korean enterprise ·Won Grand Prize in CDP Water Security program
·Maintained Platinum Club status ·Conserved 42.77 million tons of water
in CDP Climate Change program (equivalent to volume usable by 400,000 people in a year)
for fifth consecutive year ·Achieved “clean water” standard for
wastewater discharge in four key indicators

We are committed We ensure an eco-friendly

to zero waste manufacturing process
for a sustainable future for all of our products
·Obtained Zero Waste To Landfill (ZWTL) Gold ·Saved KRW 7.8 billion worth of steam
certification with 90% ZWTL progress across sites worldwide usage & KRW 3.5 billion in power via
·Reduced annual waste incineration by 1,997 tons, energy efficiency solutions
achieving air pollutant reduction including 2,631 tons
in annual CO2 emissions

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Social ESG
SK hynix strives for the happiness of all stakeholders.

We aim and work to ensure employee health and

continued operations as we overcome COVID
·Increased flexibility of work environment and set up system
for seamless remote work
·Established remote mental health support channel for employees
with content for psychological wellbeing

We prepare for a better

future together by securing
the best talent and enabling
continued skills development
·With full-time positions constituting
over 99.6% of workforce (in Korean sites as
of 2020), comprised of skilled talent
for each job description
·Maintaining low turnover rate of 2.1%
with job security and strong employee
welfare (in Korean sites as of 2020)
·Nominated first Honored Engineer,
technical expert position without
retirement age limit

We strive to protect crucial technologies

and create a culture of compliance
·Provided industrial security training to 100% of workforce
·Distribution of and training on global compliance guidebook
·Ensuring zero cases of major legal violations

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Governance ESG
SK hynix delivers on its social responsibility with transparent governance.

We continue exploring ways to enhance

independence and transparency of governance
·Appointed outside directors to constitute over 67% of Board of Directors
& named outside director as Board Chair for greater independence

We reinforce the Board’s checks

and balances on management
by operating various dedicated
subcommittees
·Widened committee function to deliberations
on personnel decisions on top of remuneration
for directors and management
·Expanded and redesigned subcommittees
to enable deeper discussions
on respective expert fields

We keep working towards building a stronger

governance structure
·Received top “A” rating in corporate governance assessment
(by Korea Corporate Governance Service (KCGS) in 2020)
·Increased Board meeting participation to 100%
(vs. 98% in 2019)

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Memory Forest
Memory Forest
SK hynix’s New Roadmap for Tomorrow’s Tech Ecosystem

Creating ESG values with global eco-system partners and customers

in the ever growing data era
Just as a natural forest is a holistic ecosystem inhabited by a variety of fauna and flora, Memory Forest is a
model that aspires to a similarly rich and green ecosystem of IT players.
A natural forest, consists of tiers starting from the emergent layer and downwards through the canopy, under-
story, and forest floor. This can be mapped to the hierarchy of memory systems, from in-package memory and
main memory through storage-class memory and storage at the foundation.
From an application perspective, the layers would represent AI and machine learning at the top, supported by
real-time analytics, batch analytics, and data lake below.

Nature Forest Memory Forest CPU Cache

Processing-in-Memory
HBM (PIM)
Memory

Insight-Foresight
DRAM
Emergent
AI/ML Model

CXL Memory
Intelligence SCM
Canopy Near-Data Processing
Real-�me Analy�cs (NDP)
Compute SSD
Information
Under story In-Storage Processing
(ISP)
Storage

Batch Analytics
Storage SSD

Forest Floor
Raw Data sHDD
Data Lake HDD
Tape

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Memory Forest
SK hynix’s New Roadmap for Tomorrow’s Tech Ecosystem

Memory for Environment–Society–Tomorrow

As the world evolves into a data-centric society at accelerating speeds, the ICT industry is faced with the
challenge of providing more environmentally sustainable solutions that also excel in performance.
SK hynix presents “Memory Forest” as its new vision in line with such calls to create eco-friendly products and a
sustainable ecosystem with customers and partners.

Memory ForEST: Environment

Memory for the Environment, which considers a sustainable future for planet Earth.

E
Provide high-performance low-power products to customers, and reduce or reuse
resources and utility for increase of environmental values

Considerations
Resource TCO Trash Water Toxic Material

Action Plans
Users
Low Power High
performance

Producers
Recycle Reuse Reduce

Memory ForEST: Society

Memory for Society, which helps communities grow and enables shared prosperity.

S
Provide new solution/open innovation/new Biz/outstanding work environment to
customers/partners/investors/suppliers/employees for increase of social values

Considerations
Investor Partner Customer Supplier Employee

Action Plans
New biz Open New Working Co-existence
opportunity innovation Solution environment value up
development

Memory ForEST: Tomorrow

T
Which enhances the value we deliver, through an innovative business model and novel memory solutions.
Memory for Tomorrow, which enhances the value we deliver, through an innovative
business model and novel memory solutions.

Considerations
Eco-friendly Chemicals New Business Future
Manufacturing & Materials Model Technology

Action Plans
Eco-friendly Eco-friendly New By-product Recycling
Fab Process Material Hierarchy process Technology
Development Memory development development
solutions
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Memory Forest
SK hynix’s New Roadmap for Tomorrow’s Tech Ecosystem

SK hynix’s datacenter memory solutions to build Memory Forest

DPU
HBM Ethernet
(Service)
GPU DDR

HBM HBM
Accelerator
Interconnect NPU CPU
(e.g., NVLink) CPU
HBM
Interconnect

CXL CPU PIM 1)

HBM Switch
DDR
xPU : Processing Element
: Memory

HPC Server

SSD CXL Memory

ISP Unit 3) DRAM / SCM
NAND / SCM
NDP Unit 2)

Disaggregated Disaggregated
Memory Pool Storage Pools
CXL/Gen
- ISP Unit 3)
Z Fabric
DRAM / SCM
NAND / SCM
NDP Unit 2)

Another
Fabric HPC Server
Network

1)PiM: Processing in Memory 2)NDP: Near Data Processing 3)ISP: In-Storage Processing

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Memory Forest
SK hynix’s New Roadmap for Tomorrow’s Tech Ecosystem

High “Performance/W” memory types: DDR5, HBM2E/3

BW: BW:

25.6 GB/s
DDR4 DIMM
2x 51.2 GB/s
DDR5 DIMM

· World’s first DDR5 launch in Oct’20

· >2x bandwidth over DDR4 translates into reduced number of servers for same system performance.

Energy Eff: Energy Eff:

~20 pJ/b
DDR4 DIMM
0.2x ~4 pJ/b
HBM2E

HBM(KGSD) TSV Region

Core 7
Core Top
· World’s fastest HBM2E at 460GB/s in Aug’19
Core 6
Core 5
· ~0.2x pJ/b over DDR4 DIMM translates into
Core 4 TCO reduction
Core 3
Core 2
Core 1
Base
TSV PHY Interposer

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Memory Forest
SK hynix’s New Roadmap for Tomorrow’s Tech Ecosystem

High “Performance/W” memory types: CXL memory

· Server memory power reduction and resource utilization improvements through memory tiering/pooling
· Resource savings through increase in number of bits per wafer through high-capacity CXL memory products
and through device yield improvements by ECC in controllers

... Server Node-Z

Server Node-A

HBM HBM
DDR5

DDR5
HBM3/4 I/F
DDR5 I/F

Processor
DDR5

DDR5
CXL I/F CXL I/F

Memory CTRL

CXL
Switch

CXL
Switch
MEMORY POOL

CTRL CTRL CTRL CTRL

A C B D ... E F X Y

Memory Memory Memory Memory

CXL-CME CXL-BME CXL-PME

(Capacity Memory Expansion) (Bandwidth Memory Expansion) (Persistent Memory Expansion)

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Memory Forest
SK hynix’s New Roadmap for Tomorrow’s Tech Ecosystem

Local computation memory types: NDP, PIM, ISP

Reduce system power and increase internal memory data bandwidth by reducing data traffic through
NDP/ISP computational memory/storage solutions

Computer Node

DDR In-memorv
x86 ... Data Pool
...
...
...

CXL Memory
CXL

...
...
...
...
...
...
NDP
... ...
Real-time Analytics
Computational Memory Data Pool
NIC Solution (CMS)

Storage Node

ISP IBOF
Intelligent Brunch of Flash

...
...
...
...
...
...
... ...
ISP ISP ISP ISP
... ...
Batch (Big-Data) Analytics
Data Pool
Computational SSD (CSD)

System power comparison

1.0
Normalized Power Consumption

0.8
80%
0.6

0.4
18%
0.2

0
GPU CPU+GPU NDP
Server Server Server
Ex) ~80% power reduction over GPU only server expected in NDP server
(Deep learning recommendation model case)

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 SK hynix can be found close to our customers across the globe.
Please see our website for details on our global network.

| Sales Offices | Distributors | R&D Subsidiary

China China Belarus
Finland Germany Italy
France India Japan
Germany Israel Republic of Korea
India Japan Taiwan
Ireland Republic of Korea USA
Japan Russia
Malaysia Singapore | Production Site
Singapore Taiwan China
Taiwan Ukraine Republic of Korea
UK USA
USA Various regions in Europe
Vietnam

Visit http://product.skhynix.com for the latest on SK hynix products.

Information within this material is up to date as of November 10, 2021.
© 2021 SK hynix Inc. All rights reserved.
Specifications and designs are subject to change without notice. All data were deemed correct at time of creation.
SK hynix is not liable for errors or omissions.
B-AP-E01-211110-R01