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The Effects of micro Aluminum fillers In Epoxy resin on the thermal

conductivity

Article  in  Journal of Physics Conference Series · May 2018

DOI: 10.1088/1742-6596/1003/1/012082

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IHSCICONF2017 IOP Publishing
IOP Conf. Series: Journal of Physics: Conf. Series 1003 (2018)
1234567890 ‘’“” 012082 doi:10.1088/1742-6596/1003/1/012082

The Effects of micro Aluminum fillers In Epoxy resin on the

thermal conductivity

Kareem A Jasim* , Rihab N Fadhil**

Department of Physics, College of Education for pure science, University of Baghdad,
Baghdad, Iraq.

*[email protected], **[email protected]

Abstract. A hand lay-up molding method was used to prepare Epoxy/ Aluminum composites.
As a matrix used Epoxy resin (EP) with reinforced by Aluminum particles. The preparation
technique includes preparing carousel mold with different weight percentage of fillers (0, 0.05,
0.15, 0.25, 0.35, and 0.45). Standard specimens (in 30 mm diameter) were prepared to the
thermal conductivity tests. The result of experimental thermal conductivity (k), for EP/
Aluminum composites show that , k increase with increasing Aluminums percentage and it
have maximum values of (1.4595 W/m .K).

Keywords: Epoxy/ Aluminum composites, thermal conductivity, Epoxy resin, Aluminum.

1. Introduction
The defined of composite material as: “A substance consisting of two or more of two materials,
insoluble in one another, which are joint to form a useful engineering material possessing certain
properties not possessed by the constituents” [1].
Such materials offer advantages over conventional isotropic structural materials such as aluminum,
and other sorts of metal .These advantages involve high strength, low weight, and good fatigue
strength and corrosion resistance [2].
Polymer composite materials, based on a polymer matrix and inorganic micro particle fillers, have
dragged great attention among researchers, due to improvements in different properties including
thermal, electrical, optical and mechanical properties [3]. The polymer composite collects the
advantages of polymer (e.g., ductility, dielectric, flexibility, and process ability) and the advantages of
the filler materials (e.g., hardness and the stability thermal). Epoxy resins are used to generate
structural adhesives helpful to large portions requisitions. Epoxy built adhesives will security an
extensive variety about substrates includes composites, metals, pottery and elastic. They might be
figured should confer heat and compound safety What's more will show hole filling Furthermore
different obliged properties. Adhesives in light of Epoxy resins would skilled about accomplishing
precise highshear qualities and would utilize extensively clinched alongside structural holding
provisions in the air ship industry [4].

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution
of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.
Published under licence by IOP Publishing Ltd 1
IHSCICONF2017 IOP Publishing
IOP Conf. Series: Journal of Physics: Conf. Series 1003 (2018)
1234567890 ‘’“” 012082 doi:10.1088/1742-6596/1003/1/012082

2. Thermal conductivity
Thermal conductivity is the capacity of a material to heat conducting. This quantity represents the rate
of heat flow per unit time in a homogenous material under steady conditions, per unit area, per unit
temperature gradient in a direction perpendicular to area [5].Polymers are often utilized as thermal
insulators because of their low thermal conductivities. For these materials, the transfer of energy is
accomplished by the rotation and vibration of the molecules chain [6].
Imply that free bath and the temperature gradient in (equ.1) are because of the random nature of
the thermal conductivity procedures into the expression for the thermal flux [7]. The heat transfer
method depends upon several factors, consisting of sort of material, temperature and case of the
thermal material. Specifically there are two mechanisms for heat transfer through a solid substance [8].
 Free electrons and lattice vibration in solid conductors are the dominant mechanism of
temperature transfer.
 The phonons in solid insulator substances are the unique mechanism.
Consistent with the first clear assertion proposed via Fourier, heat flow through a substance is
proportional to the temperature gradient, as the following Equation:

d𝑇
𝑞 = −𝑘 (1)
d𝑥

Where q: the thermal energy flux transmitted across a unit area per unit time. 𝑘 is the coefficient of
thermal conductivity, and (dT/dx) is the gradient of temperature. The unit of q is W/m2 and the unit of
k is W/m. k [9]. Most conveniently in describe term for Thermal conduction is the scattering of
phonons, via other phonons, or by using electrons [10].
Through the ‘figure 1’, the substance S was contained between two copper discs B and C, and the
heater between B and a third copper disc A. The temperatures of all the copper discs were measured
with a thermometer. When the discs had were assembled they were varnished to give them the same
emissivity, and the whole apparatus was suspended in an enclosure of constant temperature. In the
theory given below, the following symbols are used [11]:
IV: rate of supply of energy to the heater, after the steady state has been reached.
e: heat loss per second per sq.cm for each 1˚ increase of discs temperature, over that of enclosure.
T: excess of temperature over that of the enclosure.
d: thickness of disc, r: radius of disc.
The heat received per second by disc A and given up to air is:
(πr2 + 2π r dA) e TA (2)

The heat received per second by S and given up to air from its exposed surface or passed on to A is
e TA(π r2 + 2π r dA)+2π r ds (1/2)( TA+TB) (3)

In terms of IV can be obtained, since the total heat supplied must be equal to that given up by the
various surfaces:
H=I.V = π r2e (TA+TB) +2πre [(1/2) dS (TA+TB) + dATA+dBTB +dCTC] (4)

So, thermal conductivity becomes:

KT ((TB –TA)/dS) = e [TA+ (2/r) (dA+ (1/4) dS) TA+ (1/2r)dSTB] (5)

2
IHSCICONF2017 IOP Publishing
IOP Conf. Series: Journal of Physics: Conf. Series 1003 (2018)
1234567890 ‘’“” 012082 doi:10.1088/1742-6596/1003/1/012082

Figure 1: Schematic diagram of Lee's disc.

3. Thermal Conductivity in Composites

So as to attain material with desired thermal, electric, physical, and mechanical residences, polymers
combined with deffrent types of fillers are used as matrix materials .The thermal conductivity of
compsite materials, which can be represented as multiphase substance, depends upon thermal
conductivity, proportion, and the distribution of the phase [12]. The distribution of the phase consists
of its shape, size, volume reaction, orientation, weight percent, and conductivity relative to the heat
flow direction path [8, 10, and12]. Agari et al. (1990), studied thermal conductivity of a polymer (PS
and PS composite), filled with particles (quartz or Al2O3) for extensive variety from volume
concentration. The results showed that thermal conductivity increased from low to super-high of filler
con in order will get materials with wanted thermal, mechanical, electrical and physical properties,
polymers mixed with different kinds of fillers ( particles or fibers) are used as matrix material. The
thermal conductivity of composite materials depends up on proportion, and the distribution of the
phase [12]. In 1995 studied Torquto and Rintoul the impact of interface on the characteristic of
composite media for metallic particles in epoxy matrices for different volume friction they developed
rigorous bounds on the thermal conductivity effective of dispersion. [6]. Tavaman (2002) studied the
thermal conductivity effective of composites filled with particles .His results were compared with
experimental data of micro sized Al2O3 particles filled with HDPE composites [13].
Asmaa, Harith and Ekram (2010), studied The Effect of metals as Additives on Thermal
conductivity of Epoxy Resin. They obtained results show increase thermal conductivity with
increasing weight per cent age for Epoxy/Aluminum and Epoxy/Copper composites. While thermal
conductivity for Ep/Fe composite show slight increase [14] Those primary destinations of the
research will be with get ready and test tests about particulate composite, which comprises
for epoxy resin as a matrix, with metal powder (Aluminum) about different weight
percentage (0, 0.05, 0.15, 0.25, 0.35, and 0.45) as fillers. Those Examine expects with examine
the impact for filler weight percentage and its sort on the thermal conductivity of the
composite.

4. Experimental
For thermal tests, the procedures of preparing EP/Al composites with different additive weight
percentage (0, 0.05, 0.15, 0.25, 0.35, and 0.45) percentage) were almost similar. The materials used to
prepare the test samples ware epoxy resin (EP Euxit 50) production of Swisschem with the hardener
(Euxit 50 KII) as a matrix and metal particle Al has average diameter of (7.1228 µm) of purity (99.0)
as fillers. (Table 1) summarizes the materials and some of their properties. The chemical structure of
epoxy resin is shown in ‘figure 2’.

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IHSCICONF2017 IOP Publishing
IOP Conf. Series: Journal of Physics: Conf. Series 1003 (2018)
1234567890 ‘’“” 012082 doi:10.1088/1742-6596/1003/1/012082

Table1. Some of properties of the used material

Material Sample Density (g/cm3) Thermal conductivity (W/m. K)

Epoxy EP 1.05 -------

Aluminum Al 2.7 247(9)

Figure 2: Epoxy structure [15].

A hand lay-up method was used to prepare all the specimens in this work .Samples composed of
epoxy resin with Aluminum powder at different weight percentage (0%, 5%, 15%, 25%, 35%, and
45%), and the ratio of Epoxy to hardener is (5:2).To get good homogeneity between epoxy resin and
Aluminum powder, homogenizer device at 700 rpm with 10 minutes to have good distribution for
particles in epoxy resin. Vacuum system was used to remove the bubble before cast the composites in
earlier prepared mold, blend was then poured into the mould, allowed to cure for 24 hours at room
temperature (26 ± 2) oC.
Lee's disc was used to calculate the thermal conductivity. the prepared samples have a diameter 30
mm as shown in ‘Figure 3’ and ‘Figure 4’, the temperatures were measured by thermometers to
calculate Heat current (H) and thermal conductivity (K) were calculated by using ‘equation (4) and ‘
equation (5)’ [16]. The experimental values for epoxy (0.671688 W/m. K)

Figure 3. Dimension of thermal conductivity Test Specimens.

Figure 4: Photograph of Thermal conductivity Test Specimens for Epoxy and Epoxy/ Aluminum
composites.

4
IHSCICONF2017 IOP Publishing
IOP Conf. Series: Journal of Physics: Conf. Series 1003 (2018)
1234567890 ‘’“” 012082 doi:10.1088/1742-6596/1003/1/012082

5. Results and Discussion

A Scanning Electron Microscope (SEM) with a magnifying force 5µm was used to calculate the
average diameter partical for Al (7.1228µm) as shown in ‘figure 5’.

Figure 5. SEM image for Al

The results appear that k values for increase with increasing weight percentage from reinforcement,
the maximum value 1.459549 W/m. K at 45% filler weight percentage for EP/Al composite as shown
in (table 2). This table includes the type and weight percentage affect thermal conductivity of the
composite.

Table 2.Thermal conductivity k for EP/Al composite

K
Wt% V%
( W/m. K)
0% 0 0.671688
5% 2.005731 0.732399
15% 6.422018 0.857353
25% 11.47541 0.976934
35% 17.31449 1.104591
45% 24.13793 1.459549

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IHSCICONF2017 IOP Publishing
IOP Conf. Series: Journal of Physics: Conf. Series 1003 (2018)
1234567890 ‘’“” 012082 doi:10.1088/1742-6596/1003/1/012082

‘Figure 6’ shows the obtained results of thermal conductivity for EP/Al composites under study state.
It is clear that k for Epoxy/Aluminum composites increase with increasing wt% of filler, this can be
due to the well separation of the particles, that there is no interaction between them.
A phonon is a collective excitation in a periodic, elastic arrangement of atoms or molecules in
condensed matter, such as solids and some liquids [17].
Aluminum has thermal conductivity and its value (247 W/m. K) [9]. When you add (5%) percentage
of Aluminum to epoxy found that there was an increase in thermal conductivity by (0.060711) on
thermal conductivity for epoxy.
The reason for this that when you mix epoxy with Al, Aluminum granules will spread in the matrix
material at random according to manufacturing process, The presence of these particles plays an
important role in the transition process.
When the sample surface bearing its thermal shed will move this energy from the higher temperature
zone to the region least heat the heat transfer mechanism in the composite that depend on heat transfer
phenomena by phonons and electrons. Upon arrival of a quantity of heat to the polymer chains and
molecules made up a bunch of phonons which in turn will travel or absorb by Aluminum granules,
transporting energy by electrons to the surrounding area leading to heat transfer from the higher
temperature zone to the region least heat. Thermal conductivity for composites increase with
increasing wt% of filler, The consequences show that the thermal conductivity increase for all
composites .additionally it's affected by the type and weight percentage of additive, this end result is in
a good agreement with general theory of the thermal conductivity of composites, which has been
predicted that the addition of a second phase with thermal conductivity different than that of the matrix
can be effect on the thermal conductivity of the resulting composite [18].

Figure 6. K vs. wt% of EP/ Al composite.

6. Conclusions
Composites were preparation using Epoxy resin as a matrix with metal particles Al which have
average diameter (7.1228µm) as fillers with different weight percentage of fillers (0, 0.05, 0.15, 0.25,
0.35, and 0.45). Increase thermal conductivity for (EP/Al) composites with increasing addition rates of
fillers, where maximum value (1.459549 (W/m. K)) at (45%Al), which increased by (117.3%)
compared with epoxy.

6
 IHSCICONF2017 IOP Publishing
IOP Conf. Series: Journal of Physics: Conf. Series 1003 (2018)
1234567890 ‘’“” 012082 doi:10.1088/1742-6596/1003/1/012082

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