Datasheet - HK S29al016j70tfi020 6599589

S29AL016J
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)

CMOS 3.0 Volt-only Boot Sector Flash Memory
Data Sheet S29AL016J Cover Sheet
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number S29AL016J_00 Revision 12 Issue Date April 12, 2012

D at a S hee t
Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of
product information or intended specifications throughout the product life cycle, including development,
qualification, initial production, and full production. In all cases, however, readers are encouraged to verify
that they have the latest information before finalizing their design. The following descriptions of Spansion data
sheet designations are presented here to highlight their presence and definitions.
Advance Information
The Advance Information designation indicates that Spansion Inc. is developing one or more specific
products, but has not committed any design to production. Information presented in a document with this
designation is likely to change, and in some cases, development on the product may discontinue. Spansion
Inc. therefore places the following conditions upon Advance Information content:
“This document contains information on one or more products under development at Spansion Inc.
The information is intended to help you evaluate this product. Do not design in this product without
contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed
product without notice.”
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment
to production has taken place. This designation covers several aspects of the product life cycle, including
product qualification, initial production, and the subsequent phases in the manufacturing process that occur
before full production is achieved. Changes to the technical specifications presented in a Preliminary
document should be expected while keeping these aspects of production under consideration. Spansion
places the following conditions upon Preliminary content:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. The Preliminary status of this document indicates that product qualification has been
completed, and that initial production has begun. Due to the phases of the manufacturing process that
require maintaining efficiency and quality, this document may be revised by subsequent versions or
modifications due to changes in technical specifications.”
Combination
Some data sheets contain a combination of products with different designations (Advance Information,
Preliminary, or Full Production). This type of document distinguishes these products and their designations
wherever necessary, typically on the first page, the ordering information page, and pages with the DC
Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first
page refers the reader to the notice on this page.
Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes
are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include
those affecting the number of ordering part numbers available, such as the addition or deletion of a speed
option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a
description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following
conditions to documents in this category:
“This document states the current technical specifications regarding the Spansion product(s)
described herein. Spansion Inc. deems the products to have been in sufficient production volume such
that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.”
Questions regarding these document designations may be directed to your local sales office.
2 S29AL016J S29AL016J_00_12 April 12, 2012

S29AL016J
16 Megabit (2 M x 8-Bit/1 M x 16-Bit)
CMOS 3.0 Volt-only Boot Sector Flash Memory
Data Sheet
Distinctive Characteristics
Architectural Advantages Performance Characteristics
 Single Power Supply Operation  High Performance
– Full voltage range: 2.7 to 3.6 volt read and write operations for – Access times as fast as 55 ns
battery-powered applications – Extended temperature range (–40°C to +125°C)
 Manufactured on 110 nm Process Technology  Ultra Low Power Consumption (typical values at 5 MHz)
– Fully compatible with 200 nm S29AL016D – 0.2 µA Automatic Sleep mode current
 Secured Silicon Sector region – 0.2 µA standby mode current
– 128-word/256-byte sector for permanent, secure identification – 7 mA read current
through an 8-word/16-byte random Electronic Serial Number – 20 mA program/erase current
accessible through a command sequence  Cycling Endurance: 1,000,000 cycles per sector typical
– May be programmed and locked at the factory or by the customer
 Data Retention: 20 years typical
 Flexible Sector Architecture
– One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and thirty-one 64 Kbyte Package Options
sectors (byte mode)
 48-ball Fine-pitch BGA
– One 8 Kword, two 4 Kword, one 16 Kword, and thirty-one 32 Kword
sectors (word mode)  64-ball Fortified BGA
 Sector Group Protection Features  48-pin TSOP
– A hardware method of locking a sector to prevent any program or
erase operations within that sector Software Features
– Sectors can be locked in-system or via programming equipment  CFI (Common Flash Interface) Compliant
– Temporary Sector Unprotect feature allows code changes in – Provides device-specific information to the system, allowing host
previously locked sectors software to easily reconfigure for different Flash devices
 Unlock Bypass Program Command  Erase Suspend/Erase Resume
– Reduces overall programming time when issuing multiple program – Suspends an erase operation to read data from, or program data to,
command sequences a sector that is not being erased, then resumes the erase operation
 Top or Bottom Boot Block Configurations Available  Data# Polling and Toggle Bits
 Compatibility with JEDEC standards – Provides a software method of detecting program or erase operation
– Pinout and software compatible with single-power supply Flash completion
– Superior inadvertent write protection
Hardware Features
 Ready/Busy# Pin (RY/BY#)
– Provides a hardware method of detecting program or erase cycle
completion
 Hardware Reset Pin (RESET#)
– Hardware method to reset the device to reading array data
 WP# input pin
– For boot sector devices: at VIL, protects first or last 16 Kbyte sector
depending on boot configuration (top boot or bottom boot)
Publication Number S29AL016J_00 Revision 12 Issue Date April 12, 2012

This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient pro-
duction volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid com-
binations offered may occur.
D at a S hee t
General Description
The S29AL016J is a 16 Mbit, 3.0 Volt-only Flash memory organized as 2,097,152 bytes or 1,048,576 words.
The device is offered in 48-ball Fine-pitch BGA (0.8 mm pitch), 64-ball Fortified BGA (1.0 mm pitch) and 48-
pin TSOP packages. The word-wide data (x16) appears on DQ15–DQ0; the byte-wide (x8) data appears on
DQ7–DQ0. This device is designed to be programmed in-system with the standard system 3.0 volt VCC
supply. A 12.0 V VPP or 5.0 VCC are not required for write or erase operations. The device can also be
programmed in standard EPROM programmers.
The device offers access time of 55 ns allowing high speed microprocessors to operate without wait states. To
eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable
(OE#) controls.
The device requires only a single 3.0 volt power supply for both read and write functions. Internally
generated and regulated voltages are provided for the program and erase operations.
The S29AL016J is entirely command set compatible with the JEDEC single-power-supply Flash standard.
Commands are written to the command register using standard microprocessor write timings. Register
contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write
cycles also internally latch addresses and data needed for the programming and erase operations. Reading
data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. This initiates the Embedded
Program algorithm—an internal algorithm that automatically times the program pulse widths and verifies
proper cell margin. The Unlock Bypass mode facilitates faster programming times by requiring only two write
cycles to program data instead of four.
Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase
algorithm—an internal algorithm that automatically preprograms the array (if it is not already programmed)
before executing the erase operation. During erase, the device automatically times the erase pulse widths
and verifies proper cell margin.
The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin,
or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been
completed, the device is ready to read array data or accept another command.
The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the
data contents of other sectors. The device is fully erased when shipped from the factory.
Hardware data protection measures include a low VCC detector that automatically inhibits write operations
during power transitions. The hardware sector protection feature disables both program and erase
operations in any combination of the sectors of memory. This can be achieved in-system or via programming
equipment.
The Erase Suspend/Erase Resume feature enables the user to put erase on hold for any period of time to
read data from, or program data to, any sector that is not selected for erasure. True background erase can
thus be achieved.
The hardware RESET# pin terminates any operation in progress and resets the internal state machine to
reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also
reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory.
The device offers two power-saving features. When addresses have been stable for a specified amount of
time, the device enters the automatic sleep mode. The system can also place the device into the standby
mode. Power consumption is greatly reduced in both these modes.
Spansion combines years of flash memory manufacturing experience to produce the highest levels of quality,
reliability and cost effectiveness. The device electrically erases all bits within a sector simultaneously via
Fowler-Nordheim tunneling. The data is programmed using hot electron injection.
4 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
Table of Contents
Distinctive Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1. Product Selector Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
3. Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3.1 Special Handling Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4. Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5. Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6.1 S29AL016J Standard Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
7. Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.1 Word/Byte Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.2 Requirements for Reading Array Data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
7.3 Writing Commands/Command Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.4 Program and Erase Operation Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.5 Standby Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7.6 Automatic Sleep Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.7 RESET#: Hardware Reset Pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.8 Output Disable Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7.9 Autoselect Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.10 Sector Group Protection/Unprotection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.11 Temporary Sector Group Unprotect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
8. Secured Silicon Sector Flash Memory Region . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
8.1 Factory Locked: Secured Silicon Sector Programmed and Protected at the Factory . . . . . . 24
8.2 Customer Lockable: Secured Silicon Sector NOT Programmed
or Protected at the Factory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
9. Common Flash Memory Interface (CFI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
9.1 Hardware Data Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
10. Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.1 Reading Array Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.2 Reset Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.3 Autoselect Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
10.4 Enter/Exit Secured Silicon Sector Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
10.5 Word/Byte Program Command Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
10.6 Unlock Bypass Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
10.7 Chip Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
10.8 Sector Erase Command Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
10.9 Erase Suspend/Erase Resume Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
10.10 Command Definitions Table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
11. Write Operation Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
11.1 DQ7: Data# Polling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
11.2 RY/BY#: Ready/Busy#. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
11.3 DQ6: Toggle Bit I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
11.4 DQ2: Toggle Bit II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
11.5 Reading Toggle Bits DQ6/DQ2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
11.6 DQ5: Exceeded Timing Limits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
11.7 DQ3: Sector Erase Timer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
12. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
13. Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
14. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
14.1 CMOS Compatible . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
April 12, 2012 S29AL016J_00_12 S29AL016J 5

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15. Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

16. Key to Switching Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
17. AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
17.1 Read Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
17.2 Hardware Reset (RESET#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
17.3 Word/Byte Configuration (BYTE#) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
17.4 Erase/Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
17.5 Temporary Sector Group Unprotect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
17.6 Alternate CE# Controlled Erase/Program Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
18. Erase and Programming Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
19. TSOP and BGA Pin Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
20. Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
20.1 TS 048—48-Pin Standard TSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
20.2 VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA) 8.15 mm x 6.15 mm . . . . . . . . . . . . . . . 54
20.3 LAE064–64-Ball Fortified Ball Grid Array (BGA) 9 mm x 9 mm . . . . . . . . . . . . . . . . . . . . . . . 55
21. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
6 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
Figures
Figure 3.1 48-pin Standard TSOP (TS048). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3.2 48-ball Fine-pitch BGA (VBK048) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 3.3 64-ball Fortified BGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7.1 Temporary Sector Group Unprotect Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 7.2 In-System Sector Group Protect/Unprotect Algorithms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 8.1 Secured Silicon Sector Protect Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 10.1 Program Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 10.2 Erase Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Figure 11.1 Data# Polling Algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 11.2 Toggle Bit Algorithm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 13.1 Maximum Negative Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 13.2 Maximum Positive Overshoot Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Figure 15.1 Test Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 16.1 Input Waveforms and Measurement Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 17.1 Read Operations Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 17.2 RESET# Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 17.3 BYTE# Timings for Read Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 17.4 BYTE# Timings for Write Operations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Figure 17.5 Program Operation Timings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Figure 17.6 Chip/Sector Erase Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 17.7 Back to Back Read/Write Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Figure 17.8 Data# Polling Timings (During Embedded Algorithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 17.9 Toggle Bit Timings (During Embedded Algorithms) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Figure 17.10 DQ2 vs. DQ6 for Erase and Erase Suspend Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Figure 17.11 Temporary Sector Group Unprotect/Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 17.12 Sector Group Protect/Unprotect Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Figure 17.13 Alternate CE# Controlled Write Operation Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
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Tables
Table 7.1 S29AL016J Device Bus Operations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 7.2 Sector Address Tables (Top Boot Device). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 7.3 Secured Silicon Sector Addresses (Top Boot). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Table 7.4 Sector Address Tables (Bottom Boot Device) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 7.5 Secured Silicon Sector Addresses (Bottom Boot) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 7.6 S29AL016J Autoselect Codes (High Voltage Method) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 7.7 S29AL016J Top Boot Device Sector/Sector Group Protection . . . . . . . . . . . . . . . . . . . . . . . 21
Table 7.8 S29AL016J Bottom Boot Device Sector/Sector Group Protection. . . . . . . . . . . . . . . . . . . . . 21
Table 9.1 CFI Query Identification String. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 9.2 System Interface String . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 9.3 Device Geometry Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 9.4 Primary Vendor-Specific Extended Query . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 10.1 S29AL016J Command Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 11.1 Write Operation Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Table 15.1 Test Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
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1. Product Selector Guide

Family Part Number S29AL016J
Speed Option Voltage Range: VCC = 2.7-3.6V 70
VCC = 3.0-3.6V 55
Max access time, ns (tACC) 55 70
Max CE# access time, ns (tCE) 55 70
Max CE# access time, ns (tOE) 30 30
Note
See AC Characteristics on page 43 for full specifications.
2. Block Diagram
DQ0–DQ15 (A-1)
RY/BY#
VCC
Sector Switches
VSS
Erase Voltage Input/Output

RESET# Generator Buffers
WE# State
BYTE# Control
WP# Command
Register PGM Voltage
Generator
Chip Enable Data
CE# Output Enable Latch
OE# Logic
Y-Decoder Y-Gating
Address Latch
VCC Detector Timer
X-Decoder Cell Matrix
A0–A19
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3. Connection Diagrams
Figure 3.1 48-pin Standard TSOP (TS048)
A15 1 48 A16
A14 2 47 BYTE#
A13 3 46 VSS
A12 4 45 DQ15/A-1
A11 5 44 DQ7
A10 6 43 DQ14
A9 7 42 DQ6
A8 8 41 DQ13
A19 9 40 DQ5
NC 10 39 DQ12
WE# 11 38 DQ4
RESET# 12 37 VCC
NC 13 36 DQ11
WP# 14 35 DQ3
RY/BY# 15 34 DQ10
A18 16 33 DQ2
A17 17 32 DQ9
A7 18 31 DQ1
A6 19 30 DQ8
A5 20 29 DQ0
A4 21 28 OE#
A3 22 27 VSS
A2 23 26 CE#
A1 24 25 A0
Figure 3.2 48-ball Fine-pitch BGA (VBK048)
(Top View, Balls Facing Down)
A6 B6 C6 D6 E6 F6 G6 H6
A13 A12 A14 A15 A16 BYTE# DQ15/A-1 VSS
A5 B5 C5 D5 E5 F5 G5 H5
A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6
A4 B4 C4 D4 E4 F4 G4 H4
WE# RESET# NC A19 DQ5 DQ12 VCC DQ4
A3 B3 C3 D3 E3 F3 G3 H3
RY/BY# WP# A18 NC DQ2 DQ10 DQ11 DQ3
A2 B2 C2 D2 E2 F2 G2 H2
A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1
A1 B1 C1 D1 E1 F1 G1 H1
A3 A4 A2 A1 A0 CE# OE# VSS
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Figure 3.3 64-ball Fortified BGA

(Top View, Balls Facing Down)
A8 B8 C8 D8 E8 F8 G8 H8
NC NC NC NC VSS NC NC NC
A7 B7 C7 D7 E7 F7 G7 H7
A13 A12 A14 A15 A16 BYTE# DQ15/A-1 VSS
A6 B6 C6 D6 E6 F6 G6 H6
A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6
A5 B5 C5 D5 E5 F5 G5 H5
WE# RESET# NC A19 DQ5 DQ12 VCC DQ4
A4 B4 C4 D4 E4 F4 G4 H4
RY/BY# WP# A18 NC DQ2 DQ10 DQ11 DQ3
A3 B3 C3 D3 E3 F3 G3 H3
A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1
A2 B2 C2 D2 E2 F2 G2 H2
A3 A4 A2 A1 A0 CE# OE# VSS
A1 B1 C1 D1 E1 F1 G1 H1
NC NC NC NC NC NC NC NC
3.1 Special Handling Instructions

Special handling is required for Flash Memory products in BGA packages.
Flash memory devices in BGA packages may be damaged if exposed to ultrasonic cleaning methods. The
package and/or data integrity may be compromised if the package body is exposed to temperatures above
150° C for prolonged periods of time.
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4. Pin Configuration
A0–A19 20 addresses
DQ0–DQ14 15 data inputs/outputs
DQ15/A-1 DQ15 (data input/output, word mode), A-1 (LSB address input, byte mode)
BYTE# Selects 8-bit or 16-bit mode
CE# Chip enable
OE# Output enable
WE# Write enable
WP# Write protect: The WP# contains an internal pull-up; when unconnected, WP is at VIH.
RESET# Hardware reset
RY/BY# Ready/Busy output
3.0 volt-only single power supply (see Product Selector Guide on page 9 for speed options and voltage supply
VCC
tolerances)
VSS Device ground
NC Pin not connected internally
5. Logic Symbol
20
A0–A19 16 or 8
DQ0–DQ15
(A-1)
CE#
OE#
WE#
RESET#
BYTE# RY/BY#
WP#
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6. Ordering Information
6.1 S29AL016J Standard Products

Spansion standard products are available in several packages and operating ranges. The order number
(Valid Combination) is formed by a combination of the elements below.
S29AL016J 70 T F I 01 0
Packing Type
0 = Tray
2 = 7” Tape and Reel
3 = 13” Tape and Reel
Model Number
01 = VCC = 2.7 - 3.6V, top boot sector device (CFI Support)
02 = VCC = 2.7 - 3.6V, bottom boot sector device (CFI Support)
03 = VCC = 2.7 - 3.6V, top boot sector device (No CFI Support)
04 = VCC = 2.7 - 3.6V, bottom boot sector device (No CFI Support)
R1 = VCC = 3.0 - 3.6V, top boot sector device (CFI Support)
R2 = VCC = 3.0 - 3.6V, bottom boot sector device (CFI Support)
Temperature Range
I = Industrial (-40°C to +85°C)
N = Extended (-40°C to +125°C)
Package Material Set
F = Pb-Free
H = Low-Halogen, Pb-Free
Package Type
T = Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F = Fortified Ball-Grid Array Package
Speed Option
55 = 55 ns Access Speed
70 = 70 ns Access Speed
Device Number/Description
S29AL016J
16 Megabit Flash Memory manufactured using 110 nm process technology
3.0 Volt-only Read, Program, and Erase
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Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S29AL016J Valid Combination

Package Type, Package Description
Speed
Device Number Material, and Model Number Packing Type
Option
Temperature Range
TFI, TFN 0, 3 (Note 1) TS048 (Note 3) TSOP
55 BFI, BFN, BHI, BHN R1, R2 VBK048 (Note 4) Fine-Pitch BGA
0, 2, 3 (Note 1)
FFI, FFN LAE064 (Note 4) Fortified BGA
TFI, TFN 0, 3 (Note 1) TS048 (Note 3) TSOP
S29AL016J
BFI, BFN, BHI, BHN 01, 02 VBK048 (Note 4) Fine-Pitch BGA
0, 2, 3 (Note 1)
70 FFI, FFN LAE064 (Note 4) Fortified BGA
TFI 0, 3 (Note 1) TS048 (Note 3) TSOP
03, 04
BFN, BHN 0, 2, 3 (Note 1) VBK048 (Note 4) Fine-Pitch BGA
Notes
1. Type 0 is standard. Specify other options as required.
2. Type 1 is standard. Specify other options as required.
3. TSOP package markings omit packing type designator from ordering part number.
4. BGA package marking omits leading S29 and packing type designator from ordering part number.
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7. Device Bus Operations

This section describes the requirements and use of the device bus operations, which are initiated through the
internal command register. The command register itself does not occupy any addressable memory location.
The register is composed of latches that store the commands, along with the address and data information
needed to execute the command. The contents of the register serve as inputs to the internal state machine.
The state machine outputs dictate the function of the device. Table 7.1 lists the device bus operations, the
inputs and control levels they require, and the resulting output. The following subsections describe each of
these operations in further detail.
Table 7.1 S29AL016J Device Bus Operations

DQ8–DQ15
Addresses DQ0– BYTE# BYTE#
Operation CE# OE# WE# RESET# WP# (Note 1) DQ7 = VIH = VIL
Read L L H H X AIN DOUT DOUT DQ8–DQ14 = High-Z,
Write L H L H (Note 3) AIN (Note 4) (Note 4) DQ15 = A-1
VCC ± VCC ±
Standby X X X X High-Z High-Z High-Z
0.3 V 0.3 V
Output Disable L H H H X X High-Z High-Z High-Z
Reset X X X L X X High-Z High-Z High-Z
Sector Address,
Sector Group Protect A6 = L,
L H L VID H (Note 4) X X
(2) (3) A3 = A2 = L,
A1 = H, A0 = L
Sector Address,
Sector Group A6 = H,
L H L VID H (Note 4) X X
Unprotect (2) (3) A3 = A2 = L,
A1 = H, A0 = L
Temporary Sector
X X X VID H AIN (Note 4) (Note 4) High-Z
Group Unprotect
Legend
L = Logic Low = VIL; H = Logic High = VIH; VID = 8.5 V to 12.5 V; X = Don’t Care; AIN = Address In; DOUT = Data Out
Notes
1. Address In = Amax:A0 in WORD mode (BYTE#=VIH), Address In = Amax:A-1 in BYTE mode (BYTE#=VIL). Sector addresses are Amax
to A12 in both WORD mode and BYTE mode.
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See Section 7.10, Sector Group
Protection/Unprotection on page 20.
3. If WP# = VIL, the outermost sector remains protected (determined by device configuration). If WP# = VIH, the outermost sector protection
depends on whether the sector was last protected or unprotected using the method described in Section 7.10, Sector Group Protection/
Unprotection on page 20. The WP# contains an internal pull-up; when unconnected, WP is at VIH.
4. DIN or DOUT as required by command sequence, data polling, or sector group protection algorithm.
7.1 Word/Byte Configuration

The BYTE# pin controls whether the device data I/O pins DQ15–DQ0 operate in the byte or word
configuration. If the BYTE# pin is set at logic 1, the device is in word configuration, DQ15–DQ0 are active and
controlled by CE# and OE#.
If the BYTE# pin is set at logic 0, the device is in byte configuration, and only data I/O pins DQ0–DQ7 are
active and controlled by CE# and OE#. The data I/O pins DQ8–DQ14 are tri-stated, and the DQ15 pin is used
as an input for the LSB (A-1) address function.
7.2 Requirements for Reading Array Data

To read array data from the outputs, the system must drive the CE# and OE# pins to VIL. CE# is the power
control and selects the device. OE# is the output control and gates array data to the output pins. WE# should
remain at VIH. The BYTE# pin determines whether the device outputs array data in words or bytes.
The internal state machine is set for reading array data upon device power-up, or after a hardware reset. This
ensures that no spurious alteration of the memory content occurs during the power transition. No command is
necessary in this mode to obtain array data. Standard microprocessor read cycles that assert valid addresses
April 12, 2012 S29AL016J_00_12 S29AL016J 15

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on the device address inputs produce valid data on the device data outputs. The device remains enabled for
read access until the command register contents are altered.
See Reading Array Data on page 29 for more information. Refer to the AC Read Operations on page 43 for
timing specifications and to Figure 17.1 on page 43 for the timing diagram. ICC1 in DC Characteristics
on page 41 represents the active current specification for reading array data.
7.3 Writing Commands/Command Sequences

To write a command or command sequence (which includes programming data to the device and erasing
sectors of memory), the system must drive WE# and CE# to VIL, and OE# to VIH.
For program operations, the BYTE# pin determines whether the device accepts program data in bytes or
words. See Word/Byte Configuration on page 15 for more information.
The device features an Unlock Bypass mode to facilitate faster programming. Once the device enters the
Unlock Bypass mode, only two write cycles are required to program a word or byte, instead of four. Word/
Byte Program Command Sequence on page 30 has details on programming data to the device using both
standard and Unlock Bypass command sequences.
An erase operation can erase one sector, multiple sectors, or the entire device. Table 7.2 on page 18 and
Table 7.4 on page 19 indicate the address space that each sector occupies. A “sector address” consists of
the address bits required to uniquely select a sector. The Command Definitions on page 29 has details on
erasing a sector or the entire chip, or suspending/resuming the erase operation.
After the system writes the autoselect command sequence, the device enters the autoselect mode. The
system can then read autoselect codes from the internal register (which is separate from the memory array)
on DQ7–DQ0. Standard read cycle timings apply in this mode. Refer to Autoselect Mode on page 20 and
Autoselect Command Sequence on page 29 for more information.
ICC2 in DC Characteristics on page 41 represents the active current specification for the write mode. AC
Characteristics on page 43 contains timing specification tables and timing diagrams for write operations.
7.4 Program and Erase Operation Status

During an erase or program operation, the system may check the status of the operation by reading the
status bits on DQ7–DQ0. Standard read cycle timings and ICC read specifications apply. Refer to Write
Operation Status on page 35 for more information, and to AC Characteristics on page 43 for timing diagrams.
7.5 Standby Mode

When the system is not reading or writing to the device, it can place the device in the standby mode. In this
mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state,
independent of the OE# input.
The device enters the CMOS standby mode when the CE# and RESET# pins are both held at VCC ± 0.3 V.
(Note that this is a more restricted voltage range than VIH.) If CE# and RESET# are held at VIH, but not within
VCC ± 0.3 V, the device will be in the standby mode, but the standby current will be greater. The device
requires standard access time (tCE) for read access when the device is in either of these standby modes,
before it is ready to read data.
If the device is deselected during erasure or programming, the device draws active current until the operation
is completed.
ICC3 and ICC4 represents the standby current specification shown in the table in DC Characteristics
on page 41.
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7.6 Automatic Sleep Mode

The automatic sleep mode minimizes Flash device energy consumption. The device automatically enables
this mode when addresses remain stable for tACC + 30 ns. The automatic sleep mode is independent of the
CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are
changed. While in sleep mode, output data is latched and always available to the system. ICC4 in the DC
Characteristics on page 41 represents the automatic sleep mode current specification.
7.7 RESET#: Hardware Reset Pin

The RESET# pin provides a hardware method of resetting the device to reading array data. When the system
drives the RESET# pin to VIL for at least a period of tRP, the device immediately terminates any operation in
progress, tristates all data output pins, and ignores all read/write attempts for the duration of the RESET#
pulse. The device also resets the internal state machine to reading array data. The operation that was
interrupted should be reinitiated once the device is ready to accept another command sequence, to ensure
data integrity.
Current is reduced for the duration of the RESET# pulse. When RESET# is held at VSS ±0.3V, the device
draws CMOS standby current (ICC4). If RESET# is held at VIL but not within VSS ±0.3/0.1V, the standby
current will be greater.
The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the Flash
memory, enabling the system to read the boot-up firmware from the Flash memory. Note that the CE# pin
should only go to VIL after RESET# has gone to VIH. Keeping CE# at VIL from power up through the first read
could cause the first read to retrieve erroneous data.
If RESET# is asserted during a program or erase operation, the RY/BY# pin remains a 0 (busy) until the
internal reset operation is complete, which requires a time of tREADY (during Embedded Algorithms). The
system can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is
asserted when a program or erase operation is not executing (RY/BY# pin is 1), the reset operation is
completed within a time of tREADY (not during Embedded Algorithms). The system can read data tRH after the
RESET# pin returns to VIH.
Refer to the tables in AC Characteristics on page 43 for RESET# parameters and to Figure 17.2 on page 44
for the timing diagram.
7.8 Output Disable Mode

When the OE# input is at VIH, output from the device is disabled. The output pins are placed in the high
impedance state.
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Table 7.2 Sector Address Tables (Top Boot Device)

Sector Size Address Range (in hexadecimal)
(Kbytes/
Sector A19 A18 A17 A16 A15 A14 A13 A12 Kwords) Byte Mode (x8) Word Mode (x16)
SA0 0 0 0 0 0 X X X 64/32 000000–00FFFF 00000–07FFF
SA1 0 0 0 0 1 X X X 64/32 010000–01FFFF 08000–0FFFF
SA2 0 0 0 1 0 X X X 64/32 020000–02FFFF 10000–17FFF
SA3 0 0 0 1 1 X X X 64/32 030000–03FFFF 18000–1FFFF
SA4 0 0 1 0 0 X X X 64/32 040000–04FFFF 20000–27FFF
SA5 0 0 1 0 1 X X X 64/32 050000–05FFFF 28000–2FFFF
SA6 0 0 1 1 0 X X X 64/32 060000–06FFFF 30000–37FFF
SA7 0 0 1 1 1 X X X 64/32 070000–07FFFF 38000–3FFFF
SA8 0 1 0 0 0 X X X 64/32 080000–08FFFF 40000–47FFF
SA9 0 1 0 0 1 X X X 64/32 090000–09FFFF 48000–4FFFF
SA10 0 1 0 1 0 X X X 64/32 0A0000–0AFFFF 50000–57FFF
SA11 0 1 0 1 1 X X X 64/32 0B0000–0BFFFF 58000–5FFFF
SA12 0 1 1 0 0 X X X 64/32 0C0000–0CFFFF 60000–67FFF
SA13 0 1 1 0 1 X X X 64/32 0D0000–0DFFFF 68000–6FFFF
SA14 0 1 1 1 0 X X X 64/32 0E0000–0EFFFF 70000–77FFF
SA15 0 1 1 1 1 X X X 64/32 0F0000–0FFFFF 78000–7FFFF
SA16 1 0 0 0 0 X X X 64/32 100000–10FFFF 80000–87FFF
SA17 1 0 0 0 1 X X X 64/32 110000–11FFFF 88000–8FFFF
SA18 1 0 0 1 0 X X X 64/32 120000–12FFFF 90000–97FFF
SA19 1 0 0 1 1 X X X 64/32 130000–13FFFF 98000–9FFFF
SA20 1 0 1 0 0 X X X 64/32 140000–14FFFF A0000–A7FFF
SA21 1 0 1 0 1 X X X 64/32 150000–15FFFF A8000–AFFFF
SA22 1 0 1 1 0 X X X 64/32 160000–16FFFF B0000–B7FFF
SA23 1 0 1 1 1 X X X 64/32 170000–17FFFF B8000–BFFFF
SA24 1 1 0 0 0 X X X 64/32 180000–18FFFF C0000–C7FFF
SA25 1 1 0 0 1 X X X 64/32 190000–19FFFF C8000–CFFFF
SA26 1 1 0 1 0 X X X 64/32 1A0000–1AFFFF D0000–D7FFF
SA27 1 1 0 1 1 X X X 64/32 1B0000–1BFFFF D8000–DFFFF
SA28 1 1 1 0 0 X X X 64/32 1C0000–1CFFFF E0000–E7FFF
SA29 1 1 1 0 1 X X X 64/32 1D0000–1DFFFF E8000–EFFFF
SA30 1 1 1 1 0 X X X 64/32 1E0000–1EFFFF F0000–F7FFF
SA31 1 1 1 1 1 0 X X 32/16 1F0000–1F7FFF F8000–FBFFF
SA32 1 1 1 1 1 1 0 0 8/4 1F8000–1F9FFF FC000–FCFFF
SA33 1 1 1 1 1 1 0 1 8/4 1FA000–1FBFFF FD000–FDFFF
SA34 1 1 1 1 1 1 1 X 16/8 1FC000–1FFFFF FE000–FFFFF
Note
Address range is A19:A-1 in byte mode and A19:A0 in word mode. See Word/Byte Configuration on page 15.
Table 7.3 Secured Silicon Sector Addresses (Top Boot)
Sector Size (bytes/words) x8 Address Range x16 Address Range

256/128 1FFF00h–1FFFFFh FFF80h–FFFFFh
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Table 7.4 Sector Address Tables (Bottom Boot Device)

Sector Size Address Range (in hexadecimal)
(Kbytes/
Sector A19 A18 A17 A16 A15 A14 A13 A12 Kwords) Byte Mode (x8) Word Mode (x16)
SA0 0 0 0 0 0 0 0 X 16/8 000000–003FFF 00000–01FFF
SA1 0 0 0 0 0 0 1 0 8/4 004000–005FFF 02000–02FFF
SA2 0 0 0 0 0 0 1 1 8/4 006000–007FFF 03000–03FFF
SA3 0 0 0 0 0 1 X X 32/16 008000–00FFFF 04000–07FFF
SA4 0 0 0 0 1 X X X 64/32 010000–01FFFF 08000–0FFFF
SA5 0 0 0 1 0 X X X 64/32 020000–02FFFF 10000–17FFF
SA6 0 0 0 1 1 X X X 64/32 030000–03FFFF 18000–1FFFF
SA7 0 0 1 0 0 X X X 64/32 040000–04FFFF 20000–27FFF
SA8 0 0 1 0 1 X X X 64/32 050000–05FFFF 28000–2FFFF
SA9 0 0 1 1 0 X X X 64/32 060000–06FFFF 30000–37FFF
SA10 0 0 1 1 1 X X X 64/32 070000–07FFFF 38000–3FFFF
SA11 0 1 0 0 0 X X X 64/32 080000–08FFFF 40000–47FFF
SA12 0 1 0 0 1 X X X 64/32 090000–09FFFF 48000–4FFFF
SA13 0 1 0 1 0 X X X 64/32 0A0000–0AFFFF 50000–57FFF
SA14 0 1 0 1 1 X X X 64/32 0B0000–0BFFFF 58000–5FFFF
SA15 0 1 1 0 0 X X X 64/32 0C0000–0CFFFF 60000–67FFF
SA16 0 1 1 0 1 X X X 64/32 0D0000–0DFFFF 68000–6FFFF
SA17 0 1 1 1 0 X X X 64/32 0E0000–0EFFFF 70000–77FFF
SA18 0 1 1 1 1 X X X 64/32 0F0000–0FFFFF 78000–7FFFF
SA19 1 0 0 0 0 X X X 64/32 100000–10FFFF 80000–87FFF
SA20 1 0 0 0 1 X X X 64/32 110000–11FFFF 88000–8FFFF
SA21 1 0 0 1 0 X X X 64/32 120000–12FFFF 90000–97FFF
SA22 1 0 0 1 1 X X X 64/32 130000–13FFFF 98000–9FFFF
SA23 1 0 1 0 0 X X X 64/32 140000–14FFFF A0000–A7FFF
SA24 1 0 1 0 1 X X X 64/32 150000–15FFFF A8000–AFFFF
SA25 1 0 1 1 0 X X X 64/32 160000–16FFFF B0000–B7FFF
SA26 1 0 1 1 1 X X X 64/32 170000–17FFFF B8000–BFFFF
SA27 1 1 0 0 0 X X X 64/32 180000–18FFFF C0000–C7FFF
SA28 1 1 0 0 1 X X X 64/32 190000–19FFFF C8000–CFFFF
SA29 1 1 0 1 0 X X X 64/32 1A0000–1AFFFF D0000–D7FFF
SA30 1 1 0 1 1 X X X 64/32 1B0000–1BFFFF D8000–DFFFF
SA31 1 1 1 0 0 X X X 64/32 1C0000–1CFFFF E0000–E7FFF
SA32 1 1 1 0 1 X X X 64/32 1D0000–1DFFFF E8000–EFFFF
SA33 1 1 1 1 0 X X X 64/32 1E0000–1EFFFF F0000–F7FFF
SA34 1 1 1 1 1 X X X 64/32 1F0000–1FFFFF F8000–FFFFF
Note
Address range is A19:A-1 in byte mode and A19:A0 in word mode. See the Word/Byte Configuration on page 15.
Table 7.5 Secured Silicon Sector Addresses (Bottom Boot)
Sector Size (bytes/words) x8 Address Range x16 Address Range

256/128 000000h–0000FFh 00000h–0007Fh
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7.9 Autoselect Mode

The autoselect mode provides manufacturer and device identification, and sector group protection
verification, through identifier codes output on DQ7–DQ0. This mode is primarily intended for programming
equipment to automatically match a device to be programmed with its corresponding programming algorithm.
However, the autoselect codes can also be accessed in-system through the command register.
When using programming equipment, the autoselect mode requires VID (8.5 V to 12.5 V) on address pin A9.
Address pins A6 and A3–A0 must be as shown in Table 7.6. In addition, when verifying sector group
protection, the sector address must appear on the appropriate highest order address bits (see Table 7.2
on page 18 and Table 7.4 on page 19). Table 7.6 shows the remaining address bits that are don’t care. When
all necessary bits have been set as required, the programming equipment may then read the corresponding
identifier code on DQ7-DQ0.
To access the autoselect codes in-system, the host system can issue the autoselect command via the
command register, as shown in Table 10.1 on page 34. This method does not require VID. See Command
Definitions on page 29 for details on using the autoselect mode.
Table 7.6 S29AL016J Autoselect Codes (High Voltage Method)
A19 A8 A5 A3 DQ8 DQ7

to to to to to to
Description Mode CE# OE# WE# A10 A9 A7 A6 A4 A2 A1 A0 DQ15 DQ0
Manufacturer ID: Spansion L L H X VID X L X L L L X 01h
Device ID: S29AL016J Word L L H 22h C4h

X VID X L X L L H
(Top Boot Block) Byte L L H X C4h
Device ID: S29AL016J Word L L H 22h 49h

X VID X L X L L H
(Bottom Boot Block) Byte L L H X 49h
X 01h (protected)
Sector Group Protection Verification L L H SA VID X L X L H L
X 00h (unprotected)
Secured Silicon Sector Indicator Bit (DQ7) Top 8Eh (factory locked)
L L H X VID X L X L H H X
Boot Block 0Eh (not factory locked)
Secured Silicon Sector Indicator Bit (DQ7) 96h (factory locked)

L L H X VID X L X L H H X
Bottom Boot Block 16h (not factory locked)
Legend
L = Logic Low = VIL; H = Logic High = VIH; SA = Sector Address; X = Don’t care
Note
The autoselect codes may also be accessed in-system via command sequences. See Table 10.1 on page 34.
7.10 Sector Group Protection/Unprotection

The hardware sector group protection feature disables both program and erase operations in any sector
group (see Table 7.2 on page 18 to Table 7.4 on page 19). The hardware sector group unprotection feature
re-enables both program and erase operations in previously protected sector groups. Sector group
protection/unprotection can be implemented via two methods.
Sector protection/unprotection requires VID on the RESET# pin only, and can be implemented either in-
system or via programming equipment. Figure 7.2 on page 23 shows the algorithms and Figure 17.12
on page 50 shows the timing diagram. This method uses standard microprocessor bus cycle timing. For
sector group unprotect, all unprotected sector groups must first be protected prior to the first sector group
unprotect write cycle.
The device is shipped with all sector groups unprotected. Spansion offers the option of programming and
protecting sector groups at its factory prior to shipping the device through Spansion Programming Service.
Contact a Spansion representative for details.
It is possible to determine whether a sector group is protected or unprotected. See Autoselect Mode
on page 20 for details.
20 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
Table 7.7 S29AL016J Top Boot Device Sector/Sector Group Protection

Sector / Sector Block A19 A18 A17 A16 A15 A14 A13 A12 Sector / Sector Block Size
SA0-SA3 0 0 0 X X X X X 256 (4x64) Kbytes
SA28-SA29 1 1 1 0 X X X X 128 (2x64) Kbytes
SA30 1 1 1 1 0 X X X 64 Kbytes
SA31 1 1 1 1 1 0 X X 32 Kbytes
SA32 1 1 1 1 1 1 0 0 8 Kbytes
SA33 1 1 1 1 1 1 0 1 8 Kbytes
SA34 1 1 1 1 1 1 1 X 16 Kbytes
Table 7.8 S29AL016J Bottom Boot Device Sector/Sector Group Protection

Sector / Sector Block A19 A18 A17 A16 A15 A14 A13 A12 Sector / Sector Block Size
SA0 0 0 0 0 0 0 0 X 16 Kbytes
SA1 0 0 0 0 0 0 1 0 8 Kbytes
SA2 0 0 0 0 0 0 1 1 8 Kbytes
SA3 0 0 0 0 0 1 X X 32 Kbytes
SA4 0 0 0 0 1 X X X 64 (1x64) Kbytes
SA5-SA6 0 0 0 1 X X X X 128 (2x64) Kbytes
7.11 Temporary Sector Group Unprotect

This feature allows temporary unprotection of previously protected sector groups to change data in-system.
The Sector Group Unprotect mode is activated by setting the RESET# pin to VID. During this mode, formerly
protected sector groups can be programmed or erased by selecting the sector group addresses. Once VID is
removed from the RESET# pin, all the previously protected sector groups are protected again. Figure 7.1
shows the algorithm, and Figure 17.11 on page 50 shows the timing diagrams, for this feature.
April 12, 2012 S29AL016J_00_12 S29AL016J 21

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Figure 7.1 Temporary Sector Group Unprotect Operation
START
RESET# = VID
(Note 1)
Perform Erase or
Program Operations
RESET# = VIH
Temporary Sector Group

Unprotect Completed
(Note 2)
Notes
1. All protected sector unprotected. (If WP# = VIL, the highest or lowest address sector remains protected for uniform sector devices; the top
or bottom two address sectors remains protected for boot sector devices).
2. All previously protected sector groups are protected once again.
22 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
Figure 7.2 In-System Sector Group Protect/Unprotect Algorithms
START
Protect all sectors:

START The indicated portion PLSCNT = 1
of the sector group protect
PLSCNT = 1 algorithm must be RESET# = VID
performed for all
unprotected sector groups Wait 1 µs
RESET# = VID prior to issuing the
first sector group
Wait 1 µs unprotect address
First Write No
Temporary Sector
Cycle = 60h? Group Unprotect Mode
Temporary Sector No First Write
Group Unprotect Mode Cycle = 60h? Yes
Yes No All sectors

protected?
Set up sector
group address
Yes
Sector Group Protect: Set up first sector

Write 60h to sector group group address
address with
A6 = 0,
A3 = A2 = 0, Sector Group Unprotect:
A1 = 1, A0 = 0 Write 60h to sector
address with
A6 = 1,
Wait 150 µs A3 = A2 = 0,
A1 = 1, A0 = 0
Verify Sector Group
Protect: Write 40h Wait 1.5 ms
to sector group address
with A6 = 0, Verify Sector Group
A3 = A2 = 0, Unprotect: Write
Increment A1 = 1, A0 = 0 Reset 40h to sector group
PLSCNT PLSCNT = 1 address with
Read from A6 = 1,
sector group address A3 = A2 = 0,
with A6 = 0, Increment A1 = 1, A0 = 0
A3 = A2 = 0, PLSCNT
A1 = 1, A0 = 0
Read from
No sector group address
with A6 = 1,
No A3 = A2 = 0,
PLSCNT Data = 01h? A1 = 1, A0 = 0
= 25?
No
Set up
Yes next sector group
Yes No address
PLSCNT Data = 00h?
= 1000?
Yes
Protect another
Device failed sector group? Yes
Yes
No
Last sector No
Device failed group verified?
Remove VID
from RESET#
Yes
Write reset Remove VID

command Sector Group from RESET#
Unprotect Algorithm
Sector Group Sector Group Write reset
Protect Algorithm Protect complete command
Sector Group
Unprotect complete
April 12, 2012 S29AL016J_00_12 S29AL016J 23

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8. Secured Silicon Sector Flash Memory Region

The Secured Silicon Sector feature provides a 256-byte Flash memory region that enables permanent part
identification through an Electronic Serial Number (ESN). The Secured Silicon Sector uses a Secured Silicon
Sector Indicator Bit (DQ7) to indicate whether or not the Secured Silicon Sector is locked when shipped from
the factory. This bit is permanently set at the factory and cannot be changed, which prevents cloning of a
factory-locked part. This ensures the security of the ESN once the product is shipped to the field.
Spansion offers the device with the Secured Silicon Sector either factory-locked or customer-lockable. The
factory-locked version is always protected when shipped from the factory, and has the Secured Silicon Sector
Indicator Bit permanently set to a 1. The customer-lockable version is shipped with the Secured Silicon
Sector unprotected, allowing customers to utilize the that sector in any manner they choose. The customer-
lockable version has the Secured Silicon Sector Indicator Bit permanently set to a 0. Thus, the Secured
Silicon Sector Indicator Bit prevents customer-lockable devices from being used to replace devices that are
factory locked.
The system accesses the Secured Silicon Sector through a command sequence (see Enter/Exit Secured
Silicon Sector Command Sequence on page 30). After the system writes the Enter Secured Silicon Sector
command sequence, it may read the Secured Silicon Sector by using the addresses normally occupied by the
boot sectors. This mode of operation continues until the system issues the Exit Secured Silicon Sector
command sequence, or until power is removed from the device. On power-up, or following a hardware reset,
the device reverts to sending commands to the boot sectors.
8.1 Factory Locked: Secured Silicon Sector Programmed

and Protected at the Factory
In a factory locked device, the Secured Silicon Sector is protected when the device is shipped from the
factory. The Secured Silicon Sector cannot be modified in any way. The device is available pre-programmed
with one of the following:
 A random, secure ESN only.
 Customer code through the ExpressFlash service.
 Both a random, secure ESN and customer code through the ExpressFlash service.
In devices that have an ESN, a Bottom Boot device has the 16-byte (8-word) ESN in sector 0 at addresses
00000h–0000Fh in byte mode (or 00000h–00007h in word mode). In the Top Boot device, the ESN is in
sector 34 at addresses 1FFFF0h–1FFFFFh in byte mode (or FFFF8h–FFFFFh in word mode).
Customers may opt to have their code programmed by Spansion through the Spansion ExpressFlash
service. Spansion programs the customer’s code, with or without the random ESN. The devices are then
shipped from the Spansion factory with the Secured Silicon Sector permanently locked. Contact a Spansion
representative for details on using the Spansion ExpressFlash service.
8.2 Customer Lockable: Secured Silicon Sector NOT Programmed

or Protected at the Factory
The customer lockable version allows the Secured Silicon Sector to be programmed once, and then
permanently locked after it ships from Spansion. Note that the unlock bypass functions is not available when
programming the Secured Silicon Sector.
The Secured Silicon Sector area can be protected using the following procedures:
 Write the three-cycle Enter Secured Silicon Region command sequence, and then follow the in-system
sector group protect algorithm as shown in Figure 7.2 on page 23, substituting the sector group address
with the Secured Silicon Sector group address (A0=0, A1=1, A2=0, A3=1, A4=1, A5=0, A6=0, A7=0). Note
that this method is only applicable to the Secured Silicon Sector.
 To verify the protect/unprotect status of the Secured Silicon Sector, follow the algorithm shown in Figure
8.1 on page 25.
Once the Secured Silicon Sector is locked and verified, the system must write the Exit Secured Silicon Sector
Region command sequence to return to reading and writing the remainder of the array.
24 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
The Secured Silicon Sector protection must be used with caution since, once protected, there is no procedure
available for unprotecting the Secured Silicon Sector area, and none of the bits in the Secured Silicon Sector
memory space can be modified in any way.
Figure 8.1 Secured Silicon Sector Protect Verify
START
If data = 00h,
RESET# = VID SecSi Sector is
unprotected.
If data = 01h,
Wait 1 ms SecSi Sector is
protected.
Write 60h to
any address Remove VID
from RESET#
Write 40h to SecSi
Sector address
with A0=0, A1=1, Write reset
A2=0, A3=1, A4=1, command
A5=0, A6=0, A7=0
SecSi Sector
Read from SecSi Protect Verify
Sector address complete
with A0=0, A1=1,
A2=0, A3=1, A4=1,
A5=0, A6=0, A7=0
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9. Common Flash Memory Interface (CFI)

The Common Flash Interface (CFI) specification outlines device and host system software interrogation
handshake, which allows specific vendor-specified software algorithms to be used for entire families of
devices. Software support can then be device-independent, JEDEC ID-independent, and forward- and
backward-compatible for the specified flash device families. Flash vendors can standardize their existing
interfaces for long-term compatibility.
This device enters the CFI Query mode when the system writes the CFI Query command, 98h, to address
55h in word mode (or address AAh in byte mode), any time the device is ready to read array data. The system
can read CFI information at the addresses given in Table 9.1 to Table 9.4 on page 27. In word mode, the
upper address bits (A7–MSB) must be all zeros. To terminate reading CFI data, the system must write the
reset command.
The system can also write the CFI query command when the device is in the autoselect mode. The device
enters the CFI query mode, and the system can read CFI data at the addresses given in Table 9.1 to
Table 9.4 on page 27. The system must write the reset command to return the device to the autoselect mode.
Table 9.1 CFI Query Identification String

Addresses Addresses
(Word Mode) (Byte Mode) Data Description
10h 20h 0051h
11h 22h 0052h Query Unique ASCII string “QRY”
12h 24h 0059h
13h 26h 0002h
Primary OEM Command Set
14h 28h 0000h
15h 2Ah 0040h
Address for Primary Extended Table
16h 2Ch 0000h
17h 2Eh 0000h
Alternate OEM Command Set (00h = none exists)
18h 30h 0000h
19h 32h 0000h
Address for Alternate OEM Extended Table (00h = none exists)
1Ah 34h 0000h
Table 9.2 System Interface String

Addresses Addresses
VCC Min. (write/erase)
1Bh 36h 0027h
D7–D4: volt, D3–D0: 100 millivolt
VCC Max. (write/erase)
1Ch 38h 0036h
D7–D4: volt, D3–D0: 100 millivolt
1Dh 3Ah 0000h VPP Min. voltage (00h = no VPP pin present)
1Eh 3Ch 0000h VPP Max. voltage (00h = no VPP pin present)
1Fh 3Eh 0003h Typical timeout per single byte/word write 2N µs
20h 40h 0000h Typical timeout for Min. size buffer write 2N µs (00h = not supported)
21h 42h 0009h Typical timeout per individual block erase 2N ms
22h 44h 0000h Typical timeout for full chip erase 2N ms (00h = not supported)
23h 46h 0005h Max. timeout for byte/word write 2N times typical
24h 48h 0000h Max. timeout for buffer write 2N times typical
25h 4Ah 0004h Max. timeout per individual block erase 2N times typical
26h 4Ch 0000h Max. timeout for full chip erase 2N times typical (00h = not supported)
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Data She et
Table 9.3 Device Geometry Definition

Addresses Addresses
27h 4Eh 0015h Device Size = 2N byte
28h 50h 0002h
Flash Device Interface description (refer to CFI publication 100)
29h 52h 0000h
2Ah 54h 0000h Max. number of byte in multi-byte write = 2N
2Bh 56h 0000h (00h = not supported)
2Ch 58h 0004h Number of Erase Block Regions within device
2Dh 5Ah 0000h
2Eh 5Ch 0000h Erase Block Region 1 Information
2Fh 5Eh 0040h (refer to the CFI specification or CFI publication 100)
30h 60h 0000h
31h 62h 0001h
32h 64h 0000h
Erase Block Region 2 Information
33h 66h 0020h
34h 68h 0000h
35h 6Ah 0000h
36h 6Ch 0000h
37h 6Eh 0080h
38h 70h 0000h
39h 72h 001Eh
3Ah 74h 0000h
3Bh 76h 0000h
3Ch 78h 0001h
Table 9.4 Primary Vendor-Specific Extended Query (Sheet 1 of 2)

Addresses Addresses
40h 80h 0050h
41h 82h 0052h Query-unique ASCII string “PRI”
42h 84h 0049h
43h 86h 0031h Major version number, ASCII
44h 88h 0033h Minor version number, ASCII
Address Sensitive Unlock
0 = Required, 1 = Not Required
45h 8Ah 000Ch
Process Technology (Bits 5-2)
0011b = 0.11 µm Floating Gate NOR
Erase Suspend
46h 8Ch 0002h
0 = Not Supported, 1 = To Read Only, 2 = To Read & Write
Sector Group Protect
47h 8Eh 0001h
0 = Not Supported, X= Number of sectors in smallest sector group
Sector Group Temporary Unprotect
48h 90h 0001h
00 = Not Supported, 01 = Supported
Sector Group Protect/Unprotect scheme
49h 92h 0004h 01 = 29F040 mode, 02 = 29F016 mode,
03 = 29F400 mode, 04 = 29LV800A mode
Simultaneous Operation
4Ah 94h 0000h
Burst Mode Type
4Bh 96h 0000h
Page Mode Type
4Ch 98h 0000h
00 = Not Supported, 01 = 4 Word Page, 02 = 8 Word Page
ACC (Acceleration) Supply Minimum
4Dh 9Ah 0000h
00 = Not Supported, D7-D4: Volt, D3-D0: 100mV
ACC (Acceleration) Supply Maximum
4Eh 9Ch 0000h
00 = Not Supported, D7-D4: Volt, D3-D0: 100mV
April 12, 2012 S29AL016J_00_12 S29AL016J 27

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Table 9.4 Primary Vendor-Specific Extended Query (Sheet 2 of 2)

Addresses Addresses
WP# Protection
00 = Uniform Device without WP Protect
01 = Boot Device with TOP and Bottom WP Protect
4Fh 9Eh 00XXh 02 = Bottom Boot Device with WP Protect
03 = Top Boot Device with WP Protect
04 = Uniform Device with Bottom WP Protect
05 = Uniform Device with Top WP Protect
06 = Uniform Device with All Sectors WP Protect
Program Suspend
50h A0h 00XXh
9.1 Hardware Data Protection

The command sequence requirement of unlock cycles for programming or erasing provides data protection
against inadvertent writes (refer to Table 10.1 on page 34 for command definitions). In addition, the following
hardware data protection measures prevent accidental erasure or programming, which might otherwise be
caused by spurious system level signals during VCC power-up and power-down transitions, or from system
noise.
9.1.1 Low VCC Write Inhibit

When VCC is less than VLKO, the device does not accept any write cycles. This protects data during VCC
power-up and power-down. The command register and all internal program/erase circuits are disabled, and
the device resets. Subsequent writes are ignored until VCC is greater than VLKO. The system must provide the
proper signals to the control pins to prevent unintentional writes when VCC is greater than VLKO.
9.1.2 Write Pulse Glitch Protection

Noise pulses of less than 5 ns (typical) on OE#, CE# or WE# do not initiate a write cycle.
9.1.3 Logical Inhibit

Write cycles are inhibited by holding any one of OE# = VIL, CE# = VIH or WE# = VIH. To initiate a write cycle,
CE# and WE# must be a logical zero while OE# is a logical one.
9.1.4 Power-Up Write Inhibit

If WE# = CE# = VIL and OE# = VIH during power up, the device does not accept commands on the rising
edge of WE#. The internal state machine is automatically reset to reading array data on power-up.
28 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
10. Command Definitions

Writing specific address and data commands or sequences into the command register initiates device
operations. Table 10.1 on page 34 defines the valid register command sequences. Writing incorrect
address and data values or writing them in the improper sequence resets the device to reading array data.
All addresses are latched on the falling edge of WE# or CE#, whichever happens later. All data is latched on
the rising edge of WE# or CE#, whichever happens first. Refer to the appropriate timing diagrams in AC
Characteristics on page 43.
10.1 Reading Array Data

The device is automatically set to reading array data after device power-up. No commands are required to
retrieve data. The device is also ready to read array data after completing an Embedded Program or
Embedded Erase algorithm.
After the device accepts an Erase Suspend command, the device enters the Erase Suspend mode. The
system can read array data using the standard read timings, except that if it reads at an address within erase-
suspended sectors, the device outputs status data. After completing a programming operation in the Erase
Suspend mode, the system may once again read array data with the same exception. See Erase Suspend/
Erase Resume Commands on page 32 for more information on this mode.
The system must issue the reset command to re-enable the device for reading array data if DQ5 goes high, or
while in the autoselect mode. See Reset Command on page 29.
See also Requirements for Reading Array Data on page 15 for more information. The Read Operations
on page 43 provides the read parameters, and Figure 17.1 on page 43 shows the timing diagram.
10.2 Reset Command

Writing the reset command to the device resets the device to reading array data. Address bits are don’t care
for this command.
The reset command may be written between the sequence cycles in an erase command sequence before
erasing begins. This resets the device to reading array data. Once erasure begins, however, the device
ignores reset commands until the operation is complete.
The reset command may be written between the sequence cycles in a program command sequence before
programming begins. This resets the device to reading array data (also applies to programming in Erase
Suspend mode). Once programming begins, however, the device ignores reset commands until the operation
is complete.
The reset command may be written between the sequence cycles in an autoselect command sequence.
Once in the autoselect mode, the reset command must be written to return to reading array data (also applies
to autoselect during Erase Suspend).
If DQ5 goes high during a program or erase operation, writing the reset command returns the device to
reading array data (also applies during Erase Suspend).
10.3 Autoselect Command Sequence

The autoselect command sequence allows the host system to access the manufacturer and devices codes,
and determine whether or not a sector is protected. Table 10.1 on page 34 shows the address and data
requirements. This method is an alternative to that shown in Table 7.6 on page 20, which is intended for
PROM programmers and requires VID on address bit A9.
The autoselect command sequence is initiated by writing two unlock cycles, followed by the autoselect
command. The device then enters the autoselect mode, and the system may read at any address any
number of times, without initiating another command sequence.
A read cycle at address XX00h retrieves the manufacturer code. A read cycle at address XX01h returns the
device code. A read cycle containing a sector address (SA) and the address 02h in word mode (or 04h in byte
mode) returns 01h if that sector is protected, or 00h if it is unprotected. Refer to Table 7.2 on page 18 and
Table 7.4 on page 19 for valid sector addresses.
The system must write the reset command to exit the autoselect mode and return to reading array data.
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10.4 Enter/Exit Secured Silicon Sector Command Sequence

The Secured Silicon Sector region provides a secured data area containing a random, sixteen-byte electronic
serial number (ESN). The system can access the Secured Silicon Sector region by issuing the three-cycle
Enter Secured Silicon Sector command sequence. The device continues to access the Secured Silicon
Sector region until the system issues the four-cycle Exit Secured Silicon Sector command sequence. The Exit
Secured Silicon Sector command sequence returns the device to normal operation. Table 10.1 on page 34
shows the addresses and data requirements for both command sequences. Note that the unlock bypass
mode is not available when the device enters the Secured Silicon Sector. See also Secured Silicon Sector
Flash Memory Region on page 24 for further information.
10.5 Word/Byte Program Command Sequence

The system may program the device by word or byte, depending on the state of the BYTE# pin. Programming
is a four-bus-cycle operation. The program command sequence is initiated by writing two unlock write cycles,
followed by the program set-up command. The program address and data are written next, which in turn
initiate the Embedded Program algorithm. The system is not required to provide further controls or timings.
The device automatically generates the program pulses and verifies the programmed cell margin. Table 10.1
on page 34 shows the address and data requirements for the byte program command sequence.
When the Embedded Program algorithm is complete, the device then returns to reading array data and
addresses are no longer latched. The system can determine the status of the program operation by using
DQ7, DQ6, or RY/BY#. See Write Operation Status on page 35 for information on these status bits.
Any commands written to the device during the Embedded Program Algorithm are ignored. Note that a
hardware reset immediately terminates the programming operation. The Byte Program command sequence
should be reinitiated once the device has reset to reading array data, to ensure data integrity.
Programming is allowed in any sequence and across sector boundaries. A bit cannot be programmed from
a 0 back to a 1. Attempting to do so may halt the operation and set DQ5 to 1, or cause the Data# Polling
algorithm to indicate the operation was successful. However, a succeeding read will show that the data is still
0. Only erase operations can convert a 0 to a 1.
10.6 Unlock Bypass Command Sequence

The unlock bypass feature allows the system to program bytes or words to the device faster than using the
standard program command sequence. The unlock bypass command sequence is initiated by first writing two
unlock cycles. This is followed by a third write cycle containing the unlock bypass command, 20h. The device
then enters the unlock bypass mode. A two-cycle unlock bypass program command sequence is all that is
required to program in this mode. The first cycle in this sequence contains the unlock bypass program
command, A0h; the second cycle contains the program address and data. Additional data is programmed in
the same manner. This mode dispenses with the initial two unlock cycles required in the standard program
command sequence, resulting in faster total programming time. Table 10.1 on page 34 shows the
requirements for the command sequence.
During the unlock bypass mode, only the Unlock Bypass Program and Unlock Bypass Reset commands are
valid. To exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset command
sequence. The first cycle must contain the data 90h; the second cycle the data 00h. Addresses are don’t care
for both cycles. The device then returns to reading array data.
Figure 10.1 on page 31 illustrates the algorithm for the program operation. See Erase/Program Operations
on page 46 for parameters, and to Figure 17.5 on page 46 for timing diagrams.
30 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
Figure 10.1 Program Operation
START
Write Program
Command Sequence
Data Poll
from System
Embedded
Program
algorithm
in progress
Verify Data?
No
Yes
No
Increment Address Last Address?
Yes
Programming
Completed
Note
See Table 10.1 on page 34 for program command sequence.
10.7 Chip Erase Command Sequence

Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock
cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the chip erase
command, which in turn invokes the Embedded Erase algorithm. The device does not require the system to
preprogram prior to erase. The Embedded Erase algorithm automatically preprograms and verifies the entire
memory for an all zero data pattern prior to electrical erase. The system is not required to provide any
controls or timings during these operations. Table 10.1 on page 34 shows the address and data requirements
for the chip erase command sequence.
Any commands written to the chip during the Embedded Erase algorithm are ignored. Note that a hardware
reset during the chip erase operation immediately terminates the operation. The Chip Erase command
sequence should be reinitiated once the device has returned to reading array data, to ensure data integrity.
The system can determine the status of the erase operation by using DQ7, DQ6, DQ2, or RY/BY#. See Write
Operation Status on page 35 for information on these status bits. When the Embedded Erase algorithm is
complete, the device returns to reading array data and addresses are no longer latched.
Figure 10.2 on page 33 illustrates the algorithm for the erase operation. See Erase/Program Operations
on page 46 for parameters, and Figure 17.6 on page 47 for timing diagrams.
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10.8 Sector Erase Command Sequence

Sector erase is a six bus cycle operation. The sector erase command sequence is initiated by writing two
unlock cycles, followed by a set-up command. Two additional unlock write cycles are then followed by the
address of the sector to be erased, and the sector erase command. Table 10.1 on page 34 shows the
address and data requirements for the sector erase command sequence.
The device does not require the system to preprogram the memory prior to erase. The Embedded Erase
algorithm automatically programs and verifies the sector for an all zero data pattern prior to electrical erase.
The system is not required to provide any controls or timings during these operations.
After the command sequence is written, a sector erase time-out of 50 µs begins. During the time-out period,
additional sector addresses and sector erase commands may be written. However, these additional erase
commands are only one bus cycle long and should be identical to the sixth cycle of the standard erase
command explained above. Loading the sector erase buffer may be done in any sequence, and the number
of sectors may be from one sector to all sectors. The time between these additional cycles must be less than
50 µs, otherwise the last address and command might not be accepted, and erasure may begin. It is
recommended that processor interrupts be disabled during this time to ensure all commands are accepted.
The interrupts can be re-enabled after the last Sector Erase command is written. If the time between
additional sector erase commands can be assumed to be less than 50 µs, the system need not monitor DQ3.
Any command other than Sector Erase or Erase Suspend during the time-out period resets the device
to reading array data. The system must rewrite the command sequence and any additional sector
addresses and commands.
The system can monitor DQ3 to determine if the sector erase timer has timed out. (See DQ3: Sector Erase
Timer on page 39.) The time-out begins from the rising edge of the final WE# pulse in the command
sequence.
Once the sector erase operation has begun, only the Erase Suspend command is valid. All other commands
are ignored. Note that a hardware reset during the sector erase operation immediately terminates the
operation. The Sector Erase command sequence should be reinitiated once the device has returned to
reading array data, to ensure data integrity.
When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses
are no longer latched. The system can determine the status of the erase operation by using DQ7, DQ6, DQ2,
or RY/BY#. (Refer to Write Operation Status on page 35 for information on these status bits.)
Figure 10.2 on page 33 illustrates the algorithm for the erase operation. Refer to Erase/Program Operations
on page 46 for parameters, and to Figure 17.6 on page 47 for timing diagrams.
10.9 Erase Suspend/Erase Resume Commands

The Erase Suspend command allows the system to interrupt a sector erase operation and then read data
from, or program data to, any sector not selected for erasure. This command is valid only during the sector
erase operation, including the 50 µs time-out period during the sector erase command sequence. The Erase
Suspend command is ignored if written during the chip erase operation or Embedded Program algorithm.
Writing the Erase Suspend command during the Sector Erase time-out immediately terminates the time-out
period and suspends the erase operation. Addresses are don’t-cares when writing the Erase Suspend
command.
When the Erase Suspend command is written during a sector erase operation, the device requires a
maximum of 35 µs to suspend the erase operation. However, when the Erase Suspend command is written
during the sector erase time-out, the device immediately terminates the time-out period and suspends the
erase operation.
After the erase operation has been suspended, the system can read array data from or program data to any
sector not selected for erasure. (The device “erase suspends” all sectors selected for erasure.) Normal read
and write timings and command definitions apply. Reading at any address within erase-suspended sectors
produces status data on DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2 together, to determine if a
sector is actively erasing or is erase-suspended. See Write Operation Status on page 35 for information on
these status bits.
After an erase-suspended program operation is complete, the system can once again read array data within
non-suspended sectors. The system can determine the status of the program operation using the DQ7 or
32 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
DQ6 status bits, just as in the standard program operation. See Write Operation Status on page 35 for more
information.
The system may also write the autoselect command sequence when the device is in the Erase Suspend
mode. The device allows reading autoselect codes even at addresses within erasing sectors, since the codes
are not stored in the memory array. When the device exits the autoselect mode, the device reverts to the
Erase Suspend mode, and is ready for another valid operation. See Autoselect Command Sequence
on page 29 for more information.
The system must write the Erase Resume command (address bits are don’t care) to exit the erase suspend
mode and continue the sector erase operation. Further writes of the Resume command are ignored. Another
Erase Suspend command can be written after the device has resumed erasing.
Figure 10.2 Erase Operation
START
Write Erase
Command Sequence
Data Poll
from System
Embedded
Erase
algorithm
in progress
No
Data = FFh?
Yes
Erasure Completed
Notes
1. See Table 10.1 on page 34 for erase command sequence.
2. See DQ3: Sector Erase Timer on page 39 for more information.
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10.10 Command Definitions Table

Table 10.1 S29AL016J Command Definitions
Bus Cycles (Notes 2–5)
Cycles
Command
First Second Third Fourth Fifth Sixth
Sequence
(Note 1) Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data
Read (Note 6) 1 RA RD
Reset (Note 7) 1 XXX F0
Word 555 2AA 555
Manufacturer ID 4 AA 55 90 X00 01
Byte AAA 555 AAA
Device ID, Word 555 2AA 555 X01 22C4
Autoselect (Note 8)
4 AA 55 90
Top Boot Block Byte AAA 555 AAA X02 C4
Device ID, Word 555 2AA 555 X01 2249
4 AA 55 90
Bottom Boot Block Byte AAA 555 AAA X02 49
(SA) XX00
Word 555 2AA 555
X02 XX01
Sector Group Protect Verify
4 AA 55 90
(Note 9) (SA) 00
Byte AAA 555 AAA
X04 01
Word 555 2AA 555
Enter Secured Silicon Sector 3 AA 55 88
Byte AAA 555 AAA
Word 555 2AA 555
Exit Secured Silicon Sector 4 AA 55 90 XXX 00
Byte AAA 555 AAA
Word 55
CFI Query (Note 10) 1 98
Byte AA
Word 555 2AA 555
Program 4 AA 55 A0 PA PD
Byte AAA 555 AAA
Word 555 2AA 555
Unlock Bypass 3 AA 55 20
Byte AAA 555 AAA
Unlock Bypass Program (Note 11) 2 XXX A0 PA PD
Unlock Bypass Reset (Note 12) 2 XXX 90 XXX 00
Word 555 2AA 555 555 2AA 555
Chip Erase 6 AA 55 80 AA 55 10
Byte AAA 555 AAA AAA 555 AAA
Word 555 2AA 555 555 2AA
Sector Erase (Note 15) 6 AA 55 80 AA 55 SA 30
Byte AAA 555 AAA AAA 555
Erase Suspend (Note 13) 1 XXX B0
Erase Resume (Note 14) 1 XXX 30
Legend
X = Don’t care PD = Data to be programmed at location PA. Data latches on the rising edge of
RA = Address of the memory location to be read WE# or CE# pulse, whichever happens first.
RD = Data read from location RA during read operation. SA = Address of the sector to be verified (in autoselect mode) or erased.
PA = Address of the memory location to be programmed. Addresses latch on Address bits A19–A12 uniquely select any sector.
the falling edge of the WE# or CE# pulse, whichever happens later.
Notes
1. See Table 7.1 on page 15 for description of bus operations. 9. The data is 00h for an unprotected sector and 01h for a protected sector. See
2. All values are in hexadecimal. “Autoselect Command Sequence” for more information.
3. Except for the read cycle and the fourth cycle of the autoselect command 10. Command is valid when device is ready to read array data or when device is
sequence, all bus cycles are write cycles. in autoselect mode.
4. Data bits DQ15–DQ8 are don’t cares for unlock and command cycles. 11. The Unlock Bypass command is required prior to the Unlock Bypass Program
command.
5. Address bits A19–A11 are don’t cares for unlock and command cycles,
unless SA or PA required. 12. The Unlock Bypass Reset command is required to return to reading array
data when the device is in the unlock bypass mode. F0 is also acceptable.
6. No unlock or command cycles required when reading array data.
13. The system may read and program in non-erasing sectors, or enter the
7. The Reset command is required to return to reading array data when device
autoselect mode, when in the Erase Suspend mode. The Erase Suspend
is in the autoselect mode, or if DQ5 goes high (while the device is providing
command is valid only during a sector erase operation.
status data).
14. The Erase Resume command is valid only during the Erase Suspend mode.
8. The fourth cycle of the autoselect command sequence is a read cycle.
15. Additional sector erase commands during the time-out period after an initial
sector erase are one cycle long and identical to the sixth cycle of the sector
erase command sequence (SA / 30).
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11. Write Operation Status

The device provides several bits to determine the status of a write operation: DQ2, DQ3, DQ5, DQ6, DQ7,
and RY/BY#. Table 11.1 on page 39 and the following subsections describe the functions of these bits. DQ7,
RY/BY#, and DQ6 each offer a method for determining whether a program or erase operation is complete or
in progress. These three bits are discussed first.
11.1 DQ7: Data# Polling

The Data# Polling bit, DQ7, indicates to the host system whether an Embedded Algorithm is in progress or
completed, or whether the device is in Erase Suspend. Data# Polling is valid after the rising edge of the final
WE# pulse in the program or erase command sequence.
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum
programmed to DQ7. This DQ7 status also applies to programming during Erase Suspend. When the
Embedded Program algorithm is complete, the device outputs the datum programmed to DQ7. The system
must provide the program address to read valid status information on DQ7. If a program address falls within a
protected sector, Data# Polling on DQ7 is active for approximately 1 µs, then the device returns to reading
array data.
During the Embedded Erase algorithm, Data# Polling produces a 0 on DQ7. When the Embedded Erase
algorithm is complete, or if the device enters the Erase Suspend mode, Data# Polling produces a 1 on DQ7.
This is analogous to the complement/true datum output described for the Embedded Program algorithm: the
erase function changes all the bits in a sector to 1; prior to this, the device outputs the complement, or 0. The
system must provide an address within any of the sectors selected for erasure to read valid status information
on DQ7.
After an erase command sequence is written, if all sectors selected for erasing are protected, Data# Polling
on DQ7 is active for approximately 100 µs, then the device returns to reading array data. If not all selected
sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the
selected sectors that are protected.
When the system detects DQ7 has changed from the complement to true data, it can read valid data at DQ7–
DQ0 on the following read cycles. This is because DQ7 may change asynchronously with DQ0–DQ6 while
Output Enable (OE#) is asserted low. Figure 17.8 on page 48, illustrates this.
Table 11.1 on page 39 shows the outputs for Data# Polling on DQ7. Figure 11.2 on page 38 shows the Data#
Polling algorithm.
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Figure 11.1 Data# Polling Algorithm
START
Read DQ7–DQ0
Addr = VA
Yes
DQ7 = Data?
No
No DQ5 = 1?
Yes
Read DQ7–DQ0
Addr = VA
Yes
DQ7 = Data?
No
FAIL PASS
Notes
1. VA = Valid address for programming. During a sector erase operation, a valid address is an address within any sector selected for
erasure. During chip erase, a valid address is any non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = 1 because DQ7 may change simultaneously with DQ5.
11.2 RY/BY#: Ready/Busy#

The RY/BY# is a dedicated, open-drain output pin that indicates whether an Embedded Algorithm is in
progress or complete. The RY/BY# status is valid after the rising edge of the final WE# pulse in the command
sequence. Since RY/BY# is an open-drain output, several RY/BY# pins can be tied together in parallel with a
pull-up resistor to VCC.
If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the
Erase Suspend mode.) If the output is high (Ready), the device is ready to read array data (including during
the Erase Suspend mode), or is in the standby mode.
Table 11.1 on page 39 shows the outputs for RY/BY#. Figures Figure 17.1 on page 43, Figure 17.2
on page 44, Figure 17.5 on page 46 and Figure 17.6 on page 47 shows RY/BY# for read, reset, program,
and erase operations, respectively.
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11.3 DQ6: Toggle Bit I

Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete,
or whether the device has entered the Erase Suspend mode. Toggle Bit I may be read at any address, and is
valid after the rising edge of the final WE# pulse in the command sequence (prior to the program or erase
operation), and during the sector erase time-out.
During an Embedded Program or Erase algorithm operation, successive read cycles to any address cause
DQ6 to toggle. (The system may use either OE# or CE# to control the read cycles.) When the operation is
complete, DQ6 stops toggling.
After an erase command sequence is written, if all sectors selected for erasing are protected, DQ6 toggles for
approximately 100 µs, then returns to reading array data. If not all selected sectors are protected, the
Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are
protected.
The system can use DQ6 and DQ2 together to determine whether a sector is actively erasing or is erase-
suspended. When the device is actively erasing (that is, the Embedded Erase algorithm is in progress), DQ6
toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling. However, the system must
also use DQ2 to determine which sectors are erasing or erase-suspended. Alternatively, the system can use
DQ7 (see DQ7: Data# Polling on page 35).
If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program
command sequence is written, then returns to reading array data.
DQ6 also toggles during the erase-suspend-program mode, and stops toggling once the Embedded Program
algorithm is complete.
Table 11.1 on page 39 shows the outputs for Toggle Bit I on DQ6. Figure 11.2 on page 38 shows the toggle
bit algorithm in flowchart form, and Reading Toggle Bits DQ6/DQ2 on page 38 explains the algorithm.
Figure 17.9 on page 48 shows the toggle bit timing diagrams. Figure 17.10 on page 49 shows the differences
between DQ2 and DQ6 in graphical form. See also the subsection on DQ2: Toggle Bit II on page 37.
11.4 DQ2: Toggle Bit II

The “Toggle Bit II” on DQ2, when used with DQ6, indicates whether a particular sector is actively erasing (that
is, the Embedded Erase algorithm is in progress), or whether that sector is erase-suspended. Toggle Bit II is
valid after the rising edge of the final WE# pulse in the command sequence.
DQ2 toggles when the system reads at addresses within those sectors that have been selected for erasure.
(The system may use either OE# or CE# to control the read cycles.) But DQ2 cannot distinguish whether the
sector is actively erasing or is erase-suspended. DQ6, by comparison, indicates whether the device is
actively erasing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus,
both status bits are required for sector and mode information. Refer to Table 11.1 on page 39 to compare
outputs for DQ2 and DQ6.
Figure 11.2 on page 38 shows the toggle bit algorithm in flowchart form, and the section Reading Toggle Bits
DQ6/DQ2 on page 38 explains the algorithm. See also the DQ6: Toggle Bit I on page 37 subsection.
Figure 17.9 on page 48 shows the toggle bit timing diagram. Figure 17.10 on page 49 shows the differences
between DQ2 and DQ6 in graphical form.
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11.5 Reading Toggle Bits DQ6/DQ2

Refer to Figure 11.2 on page 38 for the following discussion. Whenever the system initially begins reading
toggle bit status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling.
Typically, the system would note and store the value of the toggle bit after the first read. After the second
read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling,
the device has completed the program or erase operation. The system can read array data on DQ7–DQ0 on
the following read cycle.
However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the
system also should note whether the value of DQ5 is high (see the section on DQ5). If it is, the system should
then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as
DQ5 went high. If the toggle bit is no longer toggling, the device has successfully completed the program or
erase operation. If it is still toggling, the device did not complete the operation successfully, and the system
must write the reset command to return to reading array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not
gone high. The system may continue to monitor the toggle bit and DQ5 through successive read cycles,
determining the status as described in the previous paragraph. Alternatively, it may choose to perform other
system tasks. In this case, the system must start at the beginning of the algorithm when it returns to
determine the status of the operation (top of Figure 11.2 on page 38).
Figure 11.2 Toggle Bit Algorithm
START
(Note 1)
Read DQ7–DQ0
Read DQ7–DQ0
Toggle Bit No
= Toggle?
Yes
No DQ5 = 1?
Yes
(Notes 1, 2) Read DQ7–DQ0

Twice
Toggle Bit No
= Toggle?
Yes
Program/Erase
Operation Not Program/Erase
Complete, Write Operation Complete
Reset Command
Notes
1. Read toggle bit twice to determine whether or not it is toggling. See text.
2. Recheck toggle bit because it may stop toggling as DQ5 changes to 1. See text.
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Data She et
11.6 DQ5: Exceeded Timing Limits

DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under
these conditions DQ5 produces a 1. This is a failure condition that indicates the program or erase cycle was
not successfully completed.
The DQ5 failure condition may appear if the system tries to program a 1 to a location that is previously
programmed to 0. Only an erase operation can change a 0 back to a 1. Under this condition, the device
halts the operation, and when the operation has exceeded the timing limits, DQ5 produces a 1.
Under both these conditions, the system must issue the reset command to return the device to reading array
data.
11.7 DQ3: Sector Erase Timer

After writing a sector erase command sequence, the system may read DQ3 to determine whether or not an
erase operation has begun. (The sector erase timer does not apply to the chip erase command.) If additional
sectors are selected for erasure, the entire time-out also applies after each additional sector erase command.
When the time-out is complete, DQ3 switches from 0 to 1. The system may ignore DQ3 if the system can
guarantee that the time between additional sector erase commands will always be less than 50 μs. See
also Sector Erase Command Sequence on page 32.
After the sector erase command sequence is written, the system should read the status on DQ7 (Data#
Polling) or DQ6 (Toggle Bit I) to ensure the device has accepted the command sequence, and then read
DQ3. If DQ3 is 1, the internally controlled erase cycle has begun; all further commands (other than Erase
Suspend) are ignored until the erase operation is complete. If DQ3 is 0, the device will accept additional
sector erase commands. To ensure the command has been accepted, the system software should check the
status of DQ3 prior to and following each subsequent sector erase command. If DQ3 is high on the second
status check, the last command might not have been accepted. Table 11.1 shows the outputs for DQ3.
Table 11.1 Write Operation Status

DQ7 DQ5 DQ2
Operation (Note 2) DQ6 (Note 1) DQ3 (Note 2) RY/BY#
Standard Embedded Program Algorithm DQ7# Toggle 0 N/A No toggle 0

Mode Embedded Erase Algorithm 0 Toggle 0 1 Toggle 0
Reading within Erase
1 No toggle 0 N/A Toggle 1
Suspended Sector
Erase
Suspend Reading within Non-Erase
Data Data Data Data Data 1
Mode Suspended Sector
Erase-Suspend-Program DQ7# Toggle 0 N/A N/A 0
Notes
1. DQ5 switches to 1 when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. See DQ5:
Exceeded Timing Limits on page 39 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
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12. Absolute Maximum Ratings

Parameter Rating
Storage Temperature Plastic Packages –65° C to +150° C
Ambient Temperature with Power Applied –65° C to +125° C
Voltage with Respect to Ground
VCC (Note 1) –0.5 V to +4.0 V
A9, OE#, and RESET# (Note 2) –0.5 V to +12.5 V
All other pins (Note 1) –0.5 V to VCC+0.5 V
Output Short Circuit Current (Note 3) 200 mA
Notes
1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage transitions, input or I/O pins may overshoot VSS to –2.0 V for periods of
up to 20 ns. See Figure 13.1 on page 40. Maximum DC voltage on input or I/O pins is VCC +0.5 V. During voltage transitions, input or I/O
pins may overshoot to VCC +2.0 V for periods up to 20 ns. See Figure 13.2 on page 40.
2. Minimum DC input voltage on pins A9, OE#, and RESET# is -0.5 V. During voltage transitions, A9, OE#, and RESET# may overshoot VSS
to –2.0 V for periods of up to 20 ns. See Figure 13.1 on page 40. Maximum DC input voltage on pin A9 is +12.5 V which may overshoot to
14.0 V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time. Duration of the short circuit should not be greater than one second.
4. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability.
13. Operating Ranges

Parameter Range
Ambient Temperature Industrial (I) Devices –40° C to +85° C
Extended (N) Devices –40°C to +125°C
VCC Supply Voltages Full 2.7 V to 3.6 V
Regulated 3.0 V to 3.6 V
Note
Operating ranges define those limits between which the functionality of the device is guaranteed.
Figure 13.1 Maximum Negative Overshoot Waveform
20 ns 20 ns
+0.8 V
–0.5 V
–2.0 V
20 ns
Figure 13.2 Maximum Positive Overshoot Waveform
20 ns
VCC
+2.0 V
VCC
+0.5 V
2.0 V
20 ns
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Data She et
14. DC Characteristics
14.1 CMOS Compatible

Parameter Description Test Conditions Min Typ Max Unit
Input Load Current VIN = VSS to VCC, VCC = VCC max ±1.0
ILI
WP# Input Load Current VCC = VCC max, WP# = VSS to VCC ±25
ILIT A9 Input Load Current VCC = VCC max; A9 = 12.5 V 35 µA
VOUT = VSS to VCC,

ILO Output Leakage Current ±1.0
VCC = VCC max
CE# = VIL, OE# = VIH, 5 MHz 7 12

VCC = VCC max, Byte Mode 1 MHz 2 4
VCC Active Read Current
ICC1 mA
(Note 1) 5 MHz 7 12
CE# = VIL, OE# = VIH,,
VCC = VCC max, Word Mode 1 MHz 2 4
VCC Active Erase/Program Current CE# = VIL, OE# = VIH,

ICC2 20 30 mA
(Notes 2, 3, 4) VCC = VCC max
OE# = VIH,
CE#, RESET# = VCC + 0.3 V/-0.1V,
ICC3 VCC Standby Current (Note 4) 0.2 5 µA
WP# = VCC or open, VCC = VCC max
(Note 5)
VCC = VCC max;
VCC Standby Current During Reset
ICC4 RESET# = VSS + 0.3 V/-0.1V 0.2 5 µA
(Note 4)
WP# = VCC or open, (Note 5)
VCC = VCC max, VIH = VCC + 0.3 V,
Automatic Sleep Mode
ICC5 VIL = VSS + 0.3 V/-0.1 V, 0.2 5 µA
(Notes 3, 4)
WP# = VCC or open, (Note 5)
VIL Input Low Voltage -0.1 0.8
VIH Input High Voltage 0.7 x VCC VCC + 0.3
Voltage for Autoselect and Temporary
VID VCC = 2.7–3.6 V 8.5 12.5
Sector Unprotect
V
VOL Output Low Voltage IOL = 4.0 mA, VCC = VCC min 0.45
VOH1 IOH = -2.0 mA, VCC = VCC min 0.85 x VCC
Output High Voltage
VOH2 IOH = -100 µA, VCC = VCC min VCC–0.4
VLKO Low VCC Lock-Out Voltage 2.1 2.5
Notes
1. The ICC current listed is typically less than 2 mA/MHz, with OE# at VIH. Typical VCC is 3.0 V.
2. ICC active while Embedded Erase or Embedded Program is in progress.
3. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 30 ns.
4. Not 100% tested.
5. When the device is operated in Extended Temperature range, the currents are as follows:
ICC3 = 0.2 µA (typ), 10 µA (max)
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15. Test Conditions

Figure 15.1 Test Setup
3.3 V
2.7 kΩ
Device
Under
Test
CL 6.2 kΩ
Note
Diodes are IN3064 or equivalent.
Table 15.1 Test Specifications

Test Condition 70 55 Unit
Output Load 1 TTL gate
Output Load Capacitance, CL
30 pF
(including jig capacitance)
Input Rise and Fall Times 5 ns
Input Pulse Levels 0.0 or VCC
Input timing measurement reference levels 0.5 VCC V
Output timing measurement reference levels 0.5 VCC
16. Key to Switching Waveforms

Waveform Inputs Outputs
Steady
Changing from H to L
Changing from L to H
Don’t Care, Any Change Permitted Changing, State Unknown
Does Not Apply Center Line is High Impedance State (High Z)
Figure 16.1 Input Waveforms and Measurement Levels
VCC
Input 0.5 VCC Measurement Level 0.5 VCC Output
0.0 V
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17. AC Characteristics
17.1 Read Operations

Parameter Speed Options
JEDEC Std Description Test Setup 70 55 Unit
tAVAV tRC Read Cycle Time (Note 1) Min 70 55
CE# = VIL
tAVQV tACC Address to Output Delay Max 70 55
OE# = VIL
tELQV tCE Chip Enable to Output Delay OE# = VIL Max 70 55
tGLQV tOE Output Enable to Output Delay Max 30 30
tEHQZ tDF Chip Enable to Output High Z (Note 1) Max 16
tGHQZ tDF Output Enable to Output High Z (Note 1) Max 16 ns
tSR/W Latency Between Read and Write Operations Min 20

Read Min 0
Output Enable
tOEH Toggle and
Hold Time (Note 1) Min 10
Data# Polling
Output Hold Time From Addresses, CE# or OE#,
tAXQX tOH Min 0
Whichever Occurs First (Note 1)
Notes
1. Not 100% tested.
2. See Figure 15.1 on page 42 and Table 15.1 on page 42 for test specifications.
Figure 17.1 Read Operations Timings
tRC
Addresses Addresses Stable
tACC
CE#
tDF
tOE
OE# tSR/W
tOEH
WE# tCE
tOH
HIGH Z HIGH Z
Outputs Output Valid
RESET#
RY/BY#
0V
April 12, 2012 S29AL016J_00_12 S29AL016J 43

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17.2 Hardware Reset (RESET#)

Parameter
JEDEC Std Description Test Setup All Speed Options Unit
RESET# Pin Low (During Embedded Algorithms) to
tREADY Max 35 µs
Read or Write (See Note)
RESET# Pin Low (NOT During Embedded Algorithms) to
tREADY Max 500
Read or Write (See Note)
ns
tRP RESET# Pulse Width 500
tRH RESET# High Time Before Read (See Note) 50
Min
tRPD RESET# Low to Standby Mode 35 µs
tRB RY/BY# Recovery Time 0 ns
Note
Not 100% tested.
Figure 17.2 RESET# Timings

RY/BY#
CE#, OE#
tRH
RESET#
tRP
tReady
Reset Timings NOT during Embedded Algorithms (Note 1)
Reset Timings during Embedded Algorithms
tReady
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Note
1. CE# should only go low after RESET# has gone high. Keeping CE# low from power up through the first read could cause the first read to
retrieve erroneous data.
44 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
17.3 Word/Byte Configuration (BYTE#)

JEDEC Std Description 70 55 Unit
tELFL/tELFH CE# to BYTE# Switching Low or High Max 5
tFLQZ BYTE# Switching Low to Output HIGH Z Max 16 ns
tFHQV BYTE# Switching High to Output Active Min 70 55
Figure 17.3 BYTE# Timings for Read Operations
CE#
OE#
BYTE#
tELFL
BYTE# DQ0–DQ14 Data Output Data Output
Switching (DQ0–DQ14) (DQ0–DQ7)
from word
to byte
mode DQ15/A-1 DQ15 Address
Output Input
tFLQZ
tELFH
BYTE#
BYTE#
Switching
from byte to DQ0–DQ14 Data Output Data Output
word mode (DQ0–DQ7) (DQ0–DQ14)
DQ15/A-1 Address DQ15

Input Output
tFHQV
Figure 17.4 BYTE# Timings for Write Operations
CE#
The falling edge of the last WE# signal

WE#
BYTE#
tSET
(tAS)
tHOLD (tAH)
Note
Refer to the Erase/Program Operations table for tAS and tAH specifications.
April 12, 2012 S29AL016J_00_12 S29AL016J 45

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17.4 Erase/Program Operations

tAVAV tWC Write Cycle Time (Note 1) Min 70 55 ns
tAVWL tAS Address Setup Time Min 0 ns
tWLAX tAH Address Hold Time Min 45 ns
tDVWH tDS Data Setup Time Min 35 35 ns
tWHDX tDH Data Hold Time Min 0 ns
tOES Output Enable Setup Time Min 0 ns
Read Recovery Time Before Write
tGHWL tGHWL Min 0 ns
(OE# High to WE# Low)
tELWL tCS CE# Setup Time Min 0 ns
tWHEH tCH CE# Hold Time Min 0 ns
tWLWH tWP Write Pulse Width Min 35 35 ns
tWHWL tWPH Write Pulse Width High Min 25 ns
tSR/W Latency Between Read and Write Operations Min 20 ns
Byte Typ 6
tWHWH1 tWHWH1 Programming Operation (Note 2) µs
Word Typ 6
tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ 0.5 sec
tVCS VCC Setup Time (Note 1) Min 50 µs
tRB Recovery Time from RY/BY# Min 0
ns
tBUSY Program/Erase Valid to RY/BY# Delay Max 90
Notes
1. Not 100% tested.
2. See Erase and Programming Performance on page 52 for more information.
Figure 17.5 Program Operation Timings

Program Command Sequence (last two cycles) Read Status Data (last two cycles)
tWC tAS
Addresses 555h PA PA PA
tAH
CE#
tCH
OE#
tWP tWHWH1
WE#
tWPH
tCS
tDS
tDH
Data A0h PD Status DOUT
tBUSY tRB
RY/BY#
tVCS
VCC
Notes
1. PA = program address, PD = program data, DOUT is the true data at the program address.
2. Illustration shows device in word mode.
46 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
Figure 17.6 Chip/Sector Erase Operation Timings
Erase Command Sequence (last two cycles) Read Status Data
tWC tAS
Addresses 2AAh SA VA VA
555h for chip erase
tAH
CE#
OE# tCH
tWP
WE#
tWPH tWHWH2
tCS
tDS
tDH
In
Data 55h 30h Progress Complete
10 for Chip Erase
tBUSY tRB
RY/BY#
tVCS
VCC
Notes
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see Write Operation Status on page 35).
2. Illustration shows device in word mode.
Figure 17.7 Back to Back Read/Write Cycle Timing
tWC tRC tWC tWC
Addresses Valid PA Valid RA Valid PA Valid PA

tAH
tACC tCPH
tCE
CE#
tCP
tOE
OE#
tOEH tGHWL
tWP
WE#
tDF
tWPH tDS
tDH tOH
Valid Valid Valid Valid
Data
In Out In In
tSR/W
WE# Controlled Write Cycle Read Cycle CE# Controlled Write Cycles
April 12, 2012 S29AL016J_00_12 S29AL016J 47

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Figure 17.8 Data# Polling Timings (During Embedded Algorithms)
tRC
Addresses VA VA VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH tDF
WE#
tOH
High Z
DQ7 Complement Complement True Valid Data
High Z
DQ0–DQ6 Status Data Status Data True Valid Data
tBUSY
RY/BY#
Note
VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle.
Figure 17.9 Toggle Bit Timings (During Embedded Algorithms)

tRC
Addresses VA VA VA VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH tDF
WE#
tOH
High Z
DQ6/DQ2 Valid Status Valid Status Valid Status Valid Data
(first read) (second read) (stops toggling)
tBUSY
RY/BY#
Note
VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and array
data read cycle.
48 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
Figure 17.10 DQ2 vs. DQ6 for Erase and Erase Suspend Operations
Enter
Embedded Erase Enter Erase Erase
Erasing Suspend Suspend Program Resume
WE# Erase Erase Suspend Erase Erase Suspend Erase Erase
Read Suspend Read Complete
Program
DQ6
DQ2
Note
The system may use CE# or OE# to toggle DQ2 and DQ6. DQ2 toggles only when read at an address within an erase-suspended sector.
April 12, 2012 S29AL016J_00_12 S29AL016J 49

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17.5 Temporary Sector Group Unprotect

Parameter
JEDEC Std Description All Speed Options Unit
tVIDR VID Rise and Fall Time (See Note) Min 500 ns
tRSP RESET# Setup Time for Temporary Sector Unprotect Min 4 µs
RESET# Hold Time from RY/BY# High for Temporary
tRRB Min 4 µs
Sector Unprotect
Note
Not 100% tested.
Figure 17.11 Temporary Sector Group Unprotect/Timing Diagram

12V
RESET#
0 or 3V
tVIDR tVIDR
Program or Erase Command Sequence
CE#
WE#
tRSP tRRB
RY/BY#
Figure 17.12 Sector Group Protect/Unprotect Timing Diagram

VID
VIH
RESET#
SA, A6, A3, A2

Valid* Valid* Valid*
A1, A0
Sector Group Protect/Unprotect Verify
Data 60h 60h 40h Status
Sector Group Protect: 150 µs

1 µs Sector Group Unprotect: 1.5 ms
CE#
WE#
OE#
Note
For sector group protect, A6 = 0, A3 = A2 = 0, A1 = 1, A0 = 0. For sector group unprotect, A6 = 1, A3 = A2 = 0, A1 = 1, A0 = 0.
50 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
17.6 Alternate CE# Controlled Erase/Program Operations

tAVAV tWC Write Cycle Time (Note 1) Min 70 55 ns
tAVEL tAS Address Setup Time Min 0 ns
tELAX tAH Address Hold Time Min 45 ns
tDVEH tDS Data Setup Time Min 35 35 ns
tEHDX tDH Data Hold Time Min 0 ns
tOES Output Enable Setup Time Min 0 ns
Read Recovery Time Before Write
tGHEL tGHEL Min 0 ns
(OE# High to WE# Low)
tWLEL tWS WE# Setup Time Min 0 ns
tEHWH tWH WE# Hold Time Min 0 ns
tELEH tCP CE# Pulse Width Min 35 35 ns
tEHEL tCPH CE# Pulse Width High Min 25 ns
tSR/W Latency Between Read and Write Operations Min 20 ns
Byte Typ 6
tWHWH1 tWHWH1 Programming Operation (Note 2) µs
Word Typ 6
tWHWH2 tWHWH2 Sector Erase Operation (Note 2) Typ 0.5 sec
Notes
1. Not 100% tested.
2. See Erase and Programming Performance on page 52 for more information.
Figure 17.13 Alternate CE# Controlled Write Operation Timings

555 for program PA for program
2AA for erase SA for sector erase
555 for chip erase
Data# Polling
Addresses PA
tWC tAS
tAH
tWH
WE#
tGHEL
OE#
tCP tWHWH1 or 2
CE#
tWS tCPH
tBUSY
tDS
tDH
DQ7# DOUT
Data
tRH A0 for program PD for program
55 for erase 30 for sector erase
10 for chip erase
RESET#
RY/BY#
Notes
1. PA = program address, PD = program data, DQ7# = complement of the data written to the device, DOUT = data written to the device.
2. Figure indicates the last two bus cycles of the command sequence.
3. Word mode address used as an example.
April 12, 2012 S29AL016J_00_12 S29AL016J 51

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18. Erase and Programming Performance

Parameter Typ (Note 1) Max (Note 2) Unit Comments
Sector Erase Time 0.5 10 s Excludes 00h programming
Chip Erase Time 16 s prior to erasure (Note 4)
Byte Programming Time 6 150 µs

Word Programming Time 6 150 µs Excludes system level
Byte Mode 21.6 160 s overhead (Note 5)
Chip Programming Time
(Note 3) Word Mode 6.3 120 s
Notes
1. Typical program and erase times assume the following conditions: 25° C, VCC = 3.0 V, 100,000 cycles, checkerboard data pattern.
2. Under worst case conditions of 90°C, VCC = 2.7 V, 1,000,000 cycles.
3. The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster
than the maximum program times listed.
4. In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 10.1
on page 34 for further information on command definitions.
6. The device has a minimum erase and program cycle endurance of 100,000 cycles per sector.
19. TSOP and BGA Pin Capacitance

Parameter Symbol Parameter Description Test Setup Package Typ Max Unit
TSOP 4 6
CIN Input Capacitance VIN = 0
BGA 4 6
TSOP 4.5 5.5
COUT Output Capacitance VOUT = 0
BGA 4.5 5.5
pF
TSOP 5 6.5
CIN2 Control Pin Capacitance VIN = 0
BGA 5 6.5
TSOP 8.5 10
CIN3 WP# Pin Capacitance VIN = 0
BGA 8.5 10
Notes
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
52 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
20. Physical Dimensions
20.1 TS 048—48-Pin Standard TSOP
NOTES:
PACKAGE TS/TSR 48
JEDEC MO-142 (D) DD 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y14.5M-1982)
SYMBOL MIN NOM MAX
2. PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
A --- --- 1.20
3. PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN): INK OR LASER MARK.
A1 0.05 --- 0.15
4. TO BE DETERMINED AT THE SEATING PLANE -C- . THE SEATING PLANE IS
A2 0.95 1.00 1.05
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE LEADS
b1 0.17 0.20 0.23 ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
b 0.17 0.22 0.27 5. DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD
PROTUSION IS 0.15mm (.0059") PER SIDE.
c1 0.10 --- 0.16
6. DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR
c 0.10 --- 0.21
PROTUSION SHALL BE 0.08mm (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX.
D 19.80 20.00 20.20 MATERIAL CONDITION. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT
LEAD TO BE 0.07mm (0.0028").
D1 18.30 18.40 18.50
7. THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
E 11.90 12.00 12.10
0.10mm (.0039") AND 0.25mm (0.0098") FROM THE LEAD TIP.
e 0.50 BASIC
8. LEAD COPLANARITY SHALL BE WITHIN 0.10mm (0.004") AS MEASURED FROM
L 0.50 0.60 0.70 THE SEATING PLANE.
Θ 0˚ --- 8 9. DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
R 0.08 --- 0.20
N 48
3664 \ f16-038.10 \ 11.6.7
Note
For reference only. BSC is an ANSI standard for Basic Space Centering.
April 12, 2012 S29AL016J_00_12 S29AL016J 53

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20.2 VBK048—48-Ball Fine-Pitch Ball Grid Array (BGA) 8.15 mm x 6.15 mm

0.10 (4X)
D A D1
5
e 7
4
SE
E E1
3
H G F E D C B A
INDEX MARK 6
PIN A1 B
φb SD 7 A1 CORNER
CORNER
10 φ 0.08 M C
TOP VIEW φ 0.15 M C A B
BOTTOM VIEW
0.10 C
A A2
SEATING PLANE C 0.08 C

A1
SIDE VIEW
NOTES:
PACKAGE VBK 048
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
JEDEC N/A
2. ALL DIMENSIONS ARE IN MILLIMETERS.
8.15 mm x 6.15 mm NOM 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
PACKAGE AS NOTED).
SYMBOL MIN NOM MAX NOTE 4. e REPRESENTS THE SOLDER BALL GRID PITCH.
A --- --- 1.00 OVERALL THICKNESS 5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
A1 0.18 --- --- BALL HEIGHT "D" DIRECTION.
A2 0.62 --- 0.76 BODY THICKNESS SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
D 8.15 BSC. BODY SIZE
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E 6.15 BSC. BODY SIZE
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
D1 5.60 BSC. BALL FOOTPRINT DIAMETER IN A PLANE PARALLEL TO DATUM C.
E1 4.00 BSC. BALL FOOTPRINT 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
MD 8 ROW MATRIX SIZE D DIRECTION A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ME 6 ROW MATRIX SIZE E DIRECTION
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
N 48 TOTAL BALL COUNT THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
φb 0.35 --- 0.43 BALL DIAMETER RESPECTIVELY, SD OR SE = 0.000.
e 0.80 BSC. BALL PITCH WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
SD / SE 0.40 BSC. SOLDER BALL PLACEMENT
8. NOT USED.
--- DEPOPULATED SOLDER BALLS
9. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3338 \ 16-038.25b
54 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
20.3 LAE064–64-Ball Fortified Ball Grid Array (BGA) 9 mm x 9 mm
NOTES:
PACKAGE LAE 064
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
JEDEC N/A
2. ALL DIMENSIONS ARE IN MILLIMETERS.
9.00 mm x 9.00 mm 3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010
PACKAGE EXCEPT AS NOTED).
SYMBOL MIN NOM MAX NOTE 4. e REPRESENTS THE SOLDER BALL GRID PITCH.
A --- --- 1.40 PROFILE HEIGHT 5. SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
A1 0.40 --- --- STANDOFF "D" DIRECTION.
A2 0.60 --- --- BODY THICKNESS SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
D 9.00 BSC. BODY SIZE
N IS THE TOTAL NUMBER OF SOLDER BALLS.
E 9.00 BSC. BODY SIZE
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
D1 7.00 BSC. MATRIX FOOTPRINT DIAMETER IN A PLANE PARALLEL TO DATUM C.
E1 7.00 BSC. MATRIX FOOTPRINT 7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
MD 8 MATRIX SIZE D DIRECTION A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
ME 8 MATRIX SIZE E DIRECTION
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
N 64 BALL COUNT THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
φb 0.50 0.60 0.70 BALL DIAMETER RESPECTIVELY, SD OR SE = 0.000.
eD 1.00 BSC. BALL PITCH - D DIRECTION WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
eE 1.00 BSC. BALL PITCH - E DIRECTION
8. NOT USED.
SD / SE 0.50 BSC. SOLDER BALL PLACEMENT
9. "+" INDICATES THE THEORETICAL CENTER OF
NONE DEPOPULATED SOLDER BALLS DEPOPULATED BALLS.
3623 \ 16-038.12 \ 1.16.07
April 12, 2012 S29AL016J_00_12 S29AL016J 55

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21. Revision History

Section Description
Revision 01 (April 10, 2007)
Initial release.
Revision 02 (May 17, 2007)
Global Deleted references to ACC input.
General Description Corrected ball count for Fortified BGA package.
Product Selector Guide Changed maximum tOE for 45 ns option.
Autoselect Codes (High Voltage
Changed address bits A19–A10 for Sector Protection Verification to SA.
Method) table
Secured Silicon Sector Flash Memory Factory Locked: Secured Silicon Sector Programmed and Protected at the Factory: Changed top
Region boot sector number and addresses for ESN. Deleted reference to uniform sector device.
Common Flash Memory Interface (CFI) Primary Vendor-Specific Extended Query table: Added entries for addresses 4Dh–50h (x8 mode).
DC Characteristics CMOS Compatible table: Modified test conditions for ICC3, ICC4, ICC5
AC Characteristics table Read Operations table: Changed tOE specification for 45 and 55 ns options.
Revision 03 (October 29, 2007)
Global Removed 44-pin SOP package
Ordering Information Removed all leaded package offerings
S29AL016J Device Bus Operations Table Under Note 3: Removed the line “If WP# = VHH, all sectors will be unprotected.”
CFI Query Identification String Table Updated the data for CFI addresses 2C hex
S29AL016J Command Definitions Table The 2nd cycle data for the “Unlock Bypass Reset” command was updated from 'F0' to '00'.
Absolute Maximum Ratings Updated VCC Absolute Maximum Rating
Updated ICC3 Standby current test condition
CMOS Compatible Table Updated maximum value of VOL
Updated minimum value of VLKO
Figure Back to Back Read/Write Cycle Timing Corrected the tSR/W duration
Revision 04 (March 25, 2008)

Reset #: Hardware Reset Pin Updated current consumption during RESET# pulse
Updated maximum value of ILI
Updated test condition, typical and maximum value of ICC3
CMOS Compatible Table
Updated minimum value of VIL
Added Note 5
Updated valid combination
Ordering Information
Removed 45 ns, added 70 ns
Revision 05 (May 23, 2008)
Corrected model number 02 and 04 to bottom boot
Added the Regulated Voltage option
Added the Extended Temperature Range
Updated the Valid Combination table
Pin Configuration Updated Pin Configuration table
Device Bus Operation Updated the S29AL016J Device Bus Operation table and modified Note 3
Added Extended Temperature Range information
Operating Ranges
Added Regulated Voltage
56 S29AL016J S29AL016J_00_12 April 12, 2012

Data She et
Section Description
Revision 06 (August 12, 2008)
Title changed to Sector Group Protection and Unprotection
Sector Protection/Unprotection
Section amended and restated to Sector Group Protection and Unprotection
Title changed to Temporary Sector Group Unprotect
Temporary Sector Unprotect Figure 7.2; Title changed to Temporary Sector Group Unprotect Operation
Figure 7.3; Title changed to In-System Sector Protect/Unprotect Algorithms
Title changed to Temporary Sector Group Unprotect
Temporary Sector Unprotect Figure 17.11; Title changed to Temporary Sector Group Unprotect/Timing Diagram
Figure 17.12; Sector Group Protect/Unprotect Timing Diagram
Reading Toggle Bits DQ6/DQ2 Updated Figure 11.2
Added SSOP56 package option
Updated the Valid Combination table
Connection Diagrams Added 56-pin Shrink Small Outline Package (SSOP56)
Physical Dimensions Added 56-pin Shrink Small Outline Package (SSOP56)
Alternate CE# Controlled Erase/Program
TDS value changed from 45 ns to 35 ns
Operations
Erase/Program Operation Added figure Toggle Bit Timing (During Embedded Algorithm)
Product Selector Guide Updated Table
Revision 07 (October 27, 2008)
Customer Lockable: Secured Silicon Modified first bullet
Sector Programmed and Protected at
the Factory Updated figure Secured Silicon Sector Protect Verify
TSOP and Pin Capacitance Updated Table

Revision 08 (February 3, 2009)
Ordering Information Updated the Valid Combination table
Updated Table
Erase/Program Operation
Removed Figure Toggle Bit Timing (During Embedded Algorithm)
Revision 09 (July 9, 2009)
Physical Dimensions Updated TS048
Customer Lockable: Secured Silicon
Sector NOT Programmed and Protected Modified first bullet
at the Factory
Erase and Programming Performance Updated Table
Revision 10 (February 18, 2010)
Sector Erase Command Sequence Added clarification regarding additional sector erase commads during time-out period.
Command Definitions Table Added Note 15 to clarify additional sector erase commands during time-out period.
Revision 11 (December 9, 2011)
Ordering Information Added Low-Halogen 48-ball BGA ordering option
RESET#: Hardware Reset Pin Added sentence regarding use of CE# with RESET#
RESET# Timings Figure Added note
Revision 12 (April 12, 2012)
Global Removed SSOP-56
April 12, 2012 S29AL016J_00_12 S29AL016J 57

D at a S hee t
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as
contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to
you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal
operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,
the prior authorization by the respective government entity will be required for export of those products.
Trademarks and Notice

The contents of this document are subject to change without notice. This document may contain information on a Spansion product under
development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this
document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,
merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any
damages of any kind arising out of the use of the information in this document.
Copyright © 2007-2012 Spansion Inc. All rights reserved. Spansion®, the Spansion logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™ and
combinations thereof, are trademarks and registered trademarks of Spansion LLC in the United States and other countries. Other names used
are for informational purposes only and may be trademarks of their respective owners.
58 S29AL016J S29AL016J_00_12 April 12, 2012

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S29AL016J

16 Megabit (2 M x 8-Bit/1 M x 16-Bit)

Publication Number S29AL016J_00 Revision 12 Issue Date April 12, 2012

Notice On Data Sheet Designations

Full Production (No Designation on Document)

2 S29AL016J S29AL016J_00_12 April 12, 2012

Publication Number S29AL016J_00 Revision 12 Issue Date April 12, 2012

4 S29AL016J S29AL016J_00_12 April 12, 2012

April 12, 2012 S29AL016J_00_12 S29AL016J 5

15. Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42

6 S29AL016J S29AL016J_00_12 April 12, 2012

April 12, 2012 S29AL016J_00_12 S29AL016J 7

8 S29AL016J S29AL016J_00_12 April 12, 2012

1. Product Selector Guide

Erase Voltage Input/Output

VCC Detector Timer

X-Decoder Cell Matrix

April 12, 2012 S29AL016J_00_12 S29AL016J 9

Figure 3.2 48-ball Fine-pitch BGA (VBK048)

(Top View, Balls Facing Down)

A13 A12 A14 A15 A16 BYTE# DQ15/A-1 VSS

10 S29AL016J S29AL016J_00_12 April 12, 2012

Figure 3.3 64-ball Fortified BGA

A13 A12 A14 A15 A16 BYTE# DQ15/A-1 VSS

A9 A8 A10 A11 DQ7 DQ14 DQ13 DQ6

WE# RESET# NC A19 DQ5 DQ12 VCC DQ4

RY/BY# WP# A18 NC DQ2 DQ10 DQ11 DQ3

A7 A17 A6 A5 DQ0 DQ8 DQ9 DQ1

3.1 Special Handling Instructions

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6.1 S29AL016J Standard Products

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S29AL016J Valid Combination

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7. Device Bus Operations

Table 7.1 S29AL016J Device Bus Operations

7.1 Word/Byte Configuration

7.2 Requirements for Reading Array Data

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7.3 Writing Commands/Command Sequences

7.4 Program and Erase Operation Status

7.5 Standby Mode

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7.6 Automatic Sleep Mode

7.7 RESET#: Hardware Reset Pin

7.8 Output Disable Mode

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Table 7.2 Sector Address Tables (Top Boot Device)

Table 7.3 Secured Silicon Sector Addresses (Top Boot)

Sector Size (bytes/words) x8 Address Range x16 Address Range

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Table 7.4 Sector Address Tables (Bottom Boot Device)

Table 7.5 Secured Silicon Sector Addresses (Bottom Boot)

Sector Size (bytes/words) x8 Address Range x16 Address Range

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7.9 Autoselect Mode

Table 7.6 S29AL016J Autoselect Codes (High Voltage Method)

A19 A8 A5 A3 DQ8 DQ7