ACS711 Datasheet PDF
ACS711 Datasheet PDF
ACS711 Datasheet PDF
Not to scale
Typical Application
+3.3 V
DESCRIPTION (CONTINUED)
5× overcurrent conditions. assembly processes. Internally, the device is Pb-free, except for
The ACS711 is provided in small, surface-mount packages: SOIC8 flip-chip high-temperature Pb‑based solder balls, currently exempt
and QFN12. The leadframe is plated with 100% matte tin, which from RoHS. The device is fully calibrated prior to shipment from
is compatible with standard lead (Pb) free printed circuit board the factory.
SELECTION GUIDE
Optimized Accuracy Sensitivity [2],
TA
Part Number Range, IP Sens (Typ) Package Packing [1]
(°C)
(A) (mV/A)
ACS711ELCTR-12AB-T –40 to 85
±12.5 110
ACS711KLCTR-12AB-T –40 to 125
8-pin SOICN 3000 pieces/reel
ACS711ELCTR-25AB-T –40 to 85
±25 55
ACS711KLCTR-25AB-T –40 to 125
ACS711EEXLT-31AB-T [3][4] –40 to 85
±31 45
ACS711KEXLT-31AB-T [3] –40 to 125 12-contact QFN with
1500 pieces/reel
ACS711EEXLT-15AB-T [3][4] –40 to 85 fused current loop
±15.5 90
ACS711KEXLT-15AB-T [3] –40 to 125
VCC
VCC RPU
CBYP
FAULT
Master Current To all subcircuits Current Fault
Supply Comparator
D
Power-on 240 kΩ
Reset
Reset
Hall Current
Drive Sensitivity
IP+ Temperature
Coefficient Trim
IP+
Dynamic Offset
Cancellation
VIOUT
Signal
Recovery
CLOAD
IP−
Sensitivity
Trim
IP− 0 Ampere
Offset Adjust
GND
PINOUT DIAGRAMS
VIOUT
VCC
12
11
EX Package LC Package
COMMON OPERATING CHARACTERISTICS: Valid across the full range of TA for the LC package and at TA = 25°C for the EX package,
VCC = 3.3 V, unless otherwise specified
Characteristic Symbol Test Conditions Min. Typ. Max. Units
ELECTRICAL CHARACTERISTICS
Supply Voltage [1] VCC 3 3.3 5.5 V
Supply Current ICC VCC = 3.3 V, output open – 4 5.5 mA
Output Capacitance Load CLOAD VIOUT to GND – – 1 nF
Output Resistive Load RLOAD VIOUT to GND 15 – – kΩ
EX package – 0.6 – mΩ
Primary Conductor Resistance RIP
LC package, TA = 25°C – 1.2 – mΩ
VIOUT Rise Time tr IP = IPMAX, TA = 25°C, COUT = open – 3.5 – μs
Propagation Delay Time tPROP IP = IP(max), TA = 25°C, COUT = open – 1.2 – µs
Response Time tRESPONSE IP = IP(max), TA = 25°C, COUT = open – 4.6 – µs
Internal Bandwidth [2] BWI –3 dB, TA = 25°C – 100 – kHz
Nonlinearity ELIN Over full range of IP – ±1 – %
Symmetry ESYM Apply full scale IP – 100 – %
VIOH VCC – 0.3 – – V
VIOUT Saturation Voltages
VIOL – – 0.3 V
Quiescent Output Voltage VIOUT(Q) IP = 0 A, TA = 25°C – VCC / 2 – V
Output reaches 90% of steady-state level, TA = 25°C,
Power-On Time tPO – 35 – μs
20 A present on primary conductor
¯ Ā
F̄ Ū¯L̄¯ T̄¯ PIN CHARACTERISTICS
F̄¯ Ā
Ū¯L̄¯ T̄¯ Operating Point IFAULT – ±1 × IP – A
¯ Ā
F̄ Ū¯L̄¯ T̄¯ Output Pullup
RPU 1 – – kΩ
Resistor
VCC –
VOH – – V
¯ Ā
F̄ Ū¯L̄¯ T̄¯ Output Voltage 0.3
VOL RPU = 1 kΩ – 0.3 – V
F̄¯ Ā
Ū¯L̄¯ T̄¯ Response Time tFAULT Measured from | IP | > | IFAULT | to VFAULT ≤ VOL – 1.3 – µs
VCC Off Voltage Level for
VCCFR – – 200 mV
Fault Reset [3]
VCC Off Duration for
tCCFR 100 – – µs
Fault Reset [3]
[1] Devices are programmed for maximum accuracy at 3.3 V VCC levels. The device contains ratiometry circuits that accurately alter the 0 A Output
Voltage and Sensitivity level of the device in proportion to the applied VCC level. However, as a result of minor nonlinearities in the ratiometry
circuit additional output error will result when VCC varies from the 3.3 V VCC level. Customers that plan to operate the device from a 5 V regulated
supply should contact their local Allegro sales representative regarding expected device accuracy levels under these bias conditions.
[2] Calculated using the formula BW = 0.35 / t .
I r
¯ Ā
[3] After the F̄ Ū¯L̄
¯ T̄¯ pin is latched low, the only way to reset it is through a power-off and power-on cycle on the VCC pin. For fault reset, VCC must
stay below VCCFR for a period greater than tCCFR before settling to the normal operation voltage (3 to 5.5 V).
[1] See Characteristic Performance Data for parameter distributions over temperature.
[2] ±3sigma noise voltage.
[3] Percentage of I , with I = ±12.5 A.
P P
[1] See Characteristic Performance Data for parameter distributions over temperature.
[2] ±3sigma noise voltage.
[3] Percentage of I , with I = ±12.5 A.
P P
[1] See Characteristic Performance Data for parameter distributions across the full temperature range.
[2] ±3sigma noise voltage.
[3] Percentage of I , with I = ±15.5 A.
P P
[1] See Characteristic Performance Data for parameter distributions over temperature.
[2] ±3sigma noise voltage.
[3] Percentage of I , with I = ±25 A.
P P
[1] See Characteristic Performance Data for parameter distributions over temperature.
[2] ±3sigma noise voltage.
[3] Percentage of I , with I = ±25 A.
P P
[1] See Characteristic Performance Data for parameter distributions across the full temperature range.
[2] ±3sigma noise voltage.
[3] Percentage of I , with I = ±31 A.
P P
THERMAL CHARACTERISTICS
Characteristic Symbol Test Conditions [1] Value Units
Package Thermal Resistance, LC package, mounted on Allegro ASEK 711 evalua-
RθJL 5 °C/W
Junction to Lead tion board
LC package, mounted on Allegro 85-0404 evaluation
23 °C/W
Package Thermal Resistance, board, includes the power consumed by the board
RθJA
Junction to Ambient [2] EX package, mounted on Allegro 85-0528 evaluation
24 °C/W
board, includes the power consumed by the board
[1] Additional
thermal information available on the Allegro website.
[2] The Allegro
evaluation board has 1500 mm2 of 2 oz. copper on each side, connected to pins 1 and 2, and to pins 3 and 4, with thermal
vias connecting the layers. Performance values include the power consumed by the PCB. Further details on the board are available
from the Frequently Asked Questions document on our website.
1700 40
1680
20
QVO (mV)
VOE (mV)
1660
0
1640
-20
1620
1600 -40
1580 -60
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
2
90
0
ETOT (%)
88 -2
-4
86
-6
84
-8
82 -10
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
ELIN (%)
100.1
0.2
100
0.1
99.9
99.8 0
99.7 -0.1
99.6 -0.2
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
VOE (mV)
QVO(mV)
1660 10
1650 0
1640 -10
1630 -20
1620 -30
1610 -40
1600 -50
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
47 5
ETOT(%)
46
45 0
44
43 -5
42 -10
41
40 -15
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
ELIN(%)
100.2 0.2
100 0
99.8 -0.2
99.6 -0.4
99.4 -0.6
99.2 -0.8
99 -1
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
Accuracy Data
Electrical Offset Voltage versus Ambient Temperature Sensitivity versus Ambient Temperature
80 114
60 113
Sens (mV/A)
40 112
VOE (mV)
20 111
0 110
-20 109
-40 108
-60 107
–60 –40 –20 0 20 40 60 80 100 120 140 –60 –40 –20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
1.5 101.0
1.0
100.5
ESYM (%)
ELIN (%)
0.5
100.0
0
99.5
-0.5
-1.0 99.0
-1.5 98.5
–60 –40 –20 0 20 40 60 80 100 120 140 –60 –40 –20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
Total Output Error versus Ambient Temperature Fault Operating Point versus Ambient Temperature
8 16
6 14
4 12
10
2
IFAULT(A)
ETOT (%)
8
0
6
-2
4
-4 2
-6 0
–60 –40 –20 0 20 40 60 80 100 120 140
–60 –40 –20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
Accuracy Data
Electrical Offset Voltage versus Ambient Temperature Sensitivity versus Ambient Temperature
40 57.0
30 56.5
20
Sens (mV/A)
56.0
10
VOE (mV)
55.5
0
55.0
-10
54.5
-20
-30 54.0
-40 53.5
–60 –40 –20 0 20 40 60 80 100 120 140 –60 –40 –20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
100.0
0
99.8
-0.5 99.6
99.4
-1.0
99.2
-1.5 99.0
–60 –40 –20 0 20 40 60 80 100 120 140 –60 –40 –20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
Total Output Error versus Ambient Temperature Fault Operating Point versus Ambient Temperature
5 30
4
25
3
2 20
1
IFAULT (A)
ETOT (%)
15
0
-1 10
-2
5
-3
-4 0
–60 –40 –20 0 20 40 60 80 100 120 140
–60 –40 –20 0 20 40 60 80 100 120 140
TA (°C) TA (°C)
Timing Data
3.47 µs 1.24 µs
t (2 µs/div.) t (2 µs/div.)
IP (10 A/div.)
IP (10 A/div.)
1.28 µs
4.62 µs
Fault (2 V/div.)
t (2 µs/div.) t (2 µs/div.)
VIOUT(Q)VCC / VIOUT(Q)3.3V
Linearity (ELIN). The degree to which the voltage output from 100
the sensor varies in direct proportion to the primary current VCC / 3.3 V
through its full-scale amplitude. Nonlinearity in the output can be
attributed to the saturation of the flux concentrator approaching
the full-scale current. The following equation is used to derive the SensVCC / Sens3.3V
linearity: 100
{ [ [{
VCC / 3.3 V
∆ gain × % sat ( VIOUT_full-scale amperes – VIOUT(Q) )
100 1–
2 (VIOUT_half-scale amperes – VIOUT(Q) ) Output Voltage versus Sensed Current
Accuracy at 0 A and at Full-Scale Current
where VIOUT_full-scale amperes = the output voltage (V) when the
sensed current approximates full-scale ±IP . Increasing VIOUT(V)
Accuracy
Over ∆Temp erature
Symmetry (ESYM). The degree to which the absolute voltage
output from the sensor varies in proportion to either a positive Accuracy
25°C Only
or negative full-scale primary current. The following formula is
used to derive symmetry: Average
VIOUT
Accuracy
100 Over ∆Temp erature
VIOUT(Q) – VIOUT_–full-scale amperes
Accuracy
Quiescent output voltage (VIOUT(Q)). The output of the sensor IP(min)
25°C Only
Full Scale
into VIOUT(Q) = 1.65 V. Variation in VIOUT(Q) can be attributed to IP(max)
Decreasing VIOUT(V)
Rise time (tr). The time interval between a) when the sensor I (%) Primary Current
reaches 10% of its full scale value, and b) when it reaches 90% 90
of its full scale value. The rise time to a step response is used to
derive the bandwidth of the current sensor, in which ƒ(–3 dB) =
0.35 / tr. Both tr and tRESPONSE are detrimentally affected by eddy 10
Transducer Output
APPLICATION INFORMATION
Layout • The two solder pads at the ends of the exposed pad loop should
be placed directly on the copper trace that conducts the primary
To optimize thermal and electrical performance, the following current.
features should be included in the printed circuit board:
• When using vias under exposed pads, such as with the EX pack-
• The primary leads should be connected to as much copper area age, using plugged vias prevents wicking of the solder from the
as is available. pad into the via during reflow. Whether or not to use plugged
• The copper should be 2 oz. or heavier. vias should be evaluated in the application.
• Additional layers of the board should be used for conducting the
primary current if possible, and should be connected using the
arrangement of vias shown below.
Solder pads
Signal traces
EX package
footprint
Via
4.90 ±0.10
8°
0° 8 1.27
0.65
8
1.75
0.25
0.17
1 2 1 2
1.27
0.40
For Reference Only; not for tooling use (reference MS-012AA) N = Device part number
Dimensions in millimeters T = Device temperature range
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions P = Package Designator
Exact case and lead configuration at supplier discretion within limits shown A = Amperage
L = Lot number
A Terminal #1 mark area Belly Brand = Country of Origin
B Branding scale and appearance at supplier discretion
C Reference land pattern layout (reference IPC7351
D SOIC127P600X175-8M); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances
1 A 1
2
3.00 BSC 1.00 2.90
0.80
MIN
Branded Face
0.50
9X D C 0.70
SEATING
0.08 C PLANE 2.05 REF
+0.05
0.25 –0.07
1
NNNN
B 0.40±0.10 YYWW
0.20 LLLL
1.79
2
1 Standard Branding Reference View
E
For reference only, not for tooling use (reference JEDEC MO-220WEED C Reference land pattern layout (reference IPC7351
except for fused current path) QFN50P300X300X80-17W4M);
Dimensions in millimeters All pads a minimum of 0.20 mm from all adjacent pads; adjust as
Exact case and lead configuration at supplier discretion within limits shown necessary to meet application process requirements and PCB layout
tolerances; when mounting on a multilayer PCB, thermal vias at the
A Terminal #1 mark area
exposed thermal pad land can improve thermal dissipation (reference
B Fused sensed current path EIA/JEDEC Standard JESD51-5)
D Coplanarity includes exposed current path and terminals
Revision History
Number Date Description
2 July 18, 2013 Update characteristics tables references
3 February 6, 2015 Revised NC description in Terminal List Table
Added ACS711KEX-15A and ACS711KEX-31AB characteristic performance data plots;
4 June 23, 2017 Revised product status of ACS711EEXLT-15AB-T and ACS711EEXLT-31AB-T variants to
Pre-End-of-Life.