Prospect for the memory

Packaging technology

Nam-Seog Kim, Ph.D.

Vice President,
P&T Technology Group
SK hynix Inc.
Agenda

1. Electronic Packaging Trend

2. Memory Packaging Roadmap
3. Innovative Packaging Technology
- Package
- Process
- Material

4. Conclusion
Electronic Packaging Development Trend
Packaging technology is developing to compensate the technology
gap between Si and PCB tech.

[Source] Yole Development

○ Bridging the gap between Si and PCB process capabilities

 High I/O & speed : PGA  FBGA  Flip Chip  WLP/TSV

○ Improvement by the high functionality of IT application

 High Density & Functionality, High thermal dissipation.

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Memory Packaging Roadmap
Flip chip and TSV/WLCSP are promising technologies to satisfy faster
speed, wider bandwidth and smaller/thinner package
Past Present Near Future

PC/Notebook Smart Phone/Tablet PC IoT (Wearable Device, Smart Car, Cloud(Big Data)
/Smart Device Smart Home and so on)
Device
Market

DRAM
TSV
High Performance
BOC & Density
Flip Chip 3D SiP
2.5D SiP*** Optical
TSOP RDL DDP/QDP Interconnection

Memory Thin Profile

PoP FOWLP** Flexible Package
Package
NAND Flash eMCP

High Performance
SSD
& Density
eMMC UFS
(with Controller) BGA SSD NAND TSV
EMI* Shield

*EMI: Electro Magnetic Interference

**FOWLP: Fan-out Wafer Level Package
***SiP: System in Package
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Innovative Packaging Technology - Package
① Package Stack
AP & Memory package stack is widely being used.
PoP (Package on Package)

 Mobile Application: AP + Memory

 Top/Bottom PKG Warpage Control

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Innovative Packaging Technology - Package
② Chip Stack (Planar)

Planar chip stack is driven by low cost and high density requirement
2.5D SiP is a suitable solution to place memory dies near SoC
Planar Stack Package 2.5D SiP

 BOC/Flip chip planar DDP(Dual Die Package)  SoC + 2/4/8 HBMs(High Bandwidth Memory)
on interposer
 Various structures : CoCoS, CoWoS (TSMC),
EMIB (Intel)
HBM
Interposer

Substrate
 Pinwheel package
- Thin Profile HBM
- Improve Signal Integrity

Source : AMD

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Innovative Packaging Technology - Package
② Chip Stack (Vertical)

Conventional chip stack using wiring and TSV chip stack are implemented
Wire Interconnection TSV Interconnection

 MCP (Multi Chip Package)  3DS

 UFS (Universal Flash Storage)

 HBM (High Bandwidth Memory)

 CoC (Chip on Chip)

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Innovative Packaging Technology - Package
③ Fan out package

FOWLP is a promising solution, but cost reduction is needed.

Market Driver for Fan-out Fan-out Packaging for SiP

 PoP Bottom Package with Logic (Mobile AP)

- TSMC InFO1

Form - Amkor SLIM2 & SWIFT3

Factor - SPIL SLIT4

Cost

Performance
*Source: http://gigglehd.com/zbxe/14078384

1InFO (Integrated Fan Out Wafer Level PKG), 2SLIM (siliconless integrated module),
3SWIFT (Silicon Wafer Integrated Fan-out Tech.), 4SLIT (Silicon-less Interconnect Tech.)

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Innovative Packaging Technology - Package
③ Fan out package

FOWLP is a promising solution, but cost reduction is needed.

Cost Reduction Challenges for FOWLP Hurdle of FOPLP

 High Packaging Cost  Yield

 Cost Reduction by Panel Level Packaging ⁻ Warpage Control
⁻ Die Bonding Accuracy
⁻ Panel Handling
Unit Cost
 Infra Investment

Infra

YIELD
fBGA FOWLP FOPLP

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 Conclusion
SK hynix is leading new and advanced memory package development
against diverse and rapidly changing circumstances of semiconductor industry
2GB DDR2 Wafer Level
Package Memory Module
24Stack 1.4T NAND -World Wide 1st (2007.1)
-World Wide 1st
(M/S, 2007.9)
Flexible
2007
4GB DDR2 Wafer Level 2008 Package Optical
Package Memory Module 8Stack NAND
-World Wide 1st (2008.12) -World Wide 1st Interconnection
(C/S, 2008.12)
2Stack Wafer level
Package using TSV 2010

World Wide 1st

-World Wide 1st
(E/S, 2010.3) Wafer to
40 nm 2Gb DDR3 2011 Wafer Bonding
8stack using TSV Panel Level
-World Wide 1st
(E/S, 2011.3)
2012 Package
WIO1 4KGSD 2013
-World Wide 1st 2014
(E/S, 2012.11)
16mKGSD using TSV
-World Wide 1st
2015 2016
(M/S, 2013.09 ) 29 nm HBM1
5mKGSD using TSV
-World Wide 1st
(C/S, 2014.9)

WLCSP 0.37T
- World Wide 1st
(E/S, 2013.9) 128GB LRDIMM 3DS for 64GB/128GB
128GB DDR4 WIO2 Mobile DRAM Module using TSV RDIMM
Module using TSV (4x Faster) using TSV -World Wide 1st
-World Wide 1 st st
-World Wide 1 (2014.9) (Validated 2015.11)
Conventional PKG (2014.3) 16Stack NAND 0.9T
64GB DDR4
Wafer Level PKG (WLP, TSV) Module using TSV using 15um Chip
-World Wide 1st
-World Wide 1st
(E/S, 2014.9)
(2013.9)
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Thanks for Your Time