MT6329A

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MT6329 PMIC Data Sheet
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Version: 0.4
Release date: 2012/01/20
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© 2011 MediaTek Inc.


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This document contains information that is proprietary to MediaTek Inc.


Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

Specifications are subject to change without notice.


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Document Revision History

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Revision Date Author Description
0.1 2011/09/30 Trevor Chou Initial
0.2 2011/12/16 Trevor Chou 1. Update Package Dimensions
2. Update Electrical Characteristics

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3. Update Register table

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0.3 2011/12/28 Trevor Chou 1. Modify VRF LDO functional description
2. Update Buck Converter Un-Use application note
0.4 2012/01/20 Trevor Chou 1. Modify Figure 3: Power-on/off control sequence

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Table of Contents

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Document Revision History .................................................................................................................. 2

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Table of Contents ................................................................................................................................... 3
1 Overview........................................................................................................................................ 5

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1.1 Features................................................................................................................................ 6
1.2 Applications .......................................................................................................................... 6

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1.3 General Descriptions ............................................................................................................ 6
1.4 Ordering Information............................................................................................................. 7
1.5 Top Marking Definition.......................................................................................................... 7
1.6 Pin Assignments and Descriptions ....................................................................................... 8
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Electrical Characteristics .......................................................................................................... 13
2.1 Absolute Maximum Ratings over Operating Free-Air Temperature Range ....................... 13
2.2 Thermal Characteristic ....................................................................................................... 13
2.3 Pin Voltage Rating (TBD) ................................................................................................... 13
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2.4 Recommended Operating Range ....................................................................................... 13
2.5 Electrical Characteristics .................................................................................................... 14
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2.6 Regulator Output ................................................................................................................ 15


2.7 Class AB/D Audio Amplifier ................................................................................................ 20
2.8 Battery Charger .................................................................................................................. 22
2.9 Driver .................................................................................................................................. 23
2.10 Analog Switch ..................................................................................................................... 23
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2.11 BC1.1 .................................................................................................................................. 23


2.12 Down Load Without Battery ................................................................................................ 24
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2.13 Fuel Gauge ......................................................................................................................... 24


3 Functional Descriptions ............................................................................................................ 25
3.1 General Descriptions .......................................................................................................... 25
3.2 PMIC Functional Blocks ..................................................................................................... 25
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3.2.1 Power-On/Off Sequence .................................................................................... 26


Power on/off sequence................................................................................................................. 26
3.2.2 The Battery Charger (Charger Controller) ......................................................... 28
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3.2.3 Buck Converter................................................................................................... 32


3.2.4 DVFS Control (Dynamic Voltage Frequency Scaling) ....................................... 33
3.2.5 Low Dropout Regulator (LDOs) and Reference ................................................. 35
3.2.6 Drivers ................................................................................................................ 39
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3.2.7 Analog Switch..................................................................................................... 43


3.2.8 Class-AB/D Audio Amplifier ............................................................................... 43
3.2.9 Fuel Gauge......................................................................................................... 44
3.2.10 I2C Interface ....................................................................................................... 48
3.3 Register Table and Descriptions ........................................................................................ 50
3.3.1 Bank 0 ................................................................................................................ 50
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3.3.2 Bank 1 ................................................................................................................ 76


3.4 Connection to Baseband .................................................................................................... 93

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4 Application Notes ....................................................................................................................... 94
4.1 Hardware External Shutdown ............................................................................................. 94

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4.2 Buck Converter (VRF18) with LDO Mode .......................................................................... 94
4.3 Buck Converter Un-Use Configuration ............................................................................... 95
5 MT6329 Packaging ..................................................................................................................... 96

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5.1 Package Dimensions .......................................................................................................... 96

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Appendix ............................................................................................................................................... 97

Lists of Figures
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Figure 1: MT6329 TFBGA 155 (7.6x7.6mm) pin assignment ................................................................. 8
Figure 2: MT6329 block diagram…………………………………………………………………………….27
Figure 3: Power-on/off control sequence by pressing PWRKEY .......................................................... 26
Figure 4: PCHR block diagram ............................................................................................................. 28
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Figure 5: Charging states diagram ........................................................................................................ 30
Figure 6: LDO block diagram ................................................................................................................ 35
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Figure 7: Configuration for parallel BL LED drivers .............................................................................. 40


Figure 8: Configuration for serial BL LED drivers ................................................................................. 40
Figure 9: Configuration for flash light LED driver .................................................................................. 41
Figure 11: Block diagram of class-AB/D ............................................................................................... 44
Figure 12: Fuel gauge block diagram and external connection ............................................................ 45
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Figure 13: Watchdog ............................................................................................................................. 48


Figure 14: Connection to BB ................................................................................................................. 93
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Figure 15: Hardware external shut-down function ................................................................................ 94


Figure 16: DC/DC and LDO mode HW setting application note ........................................................... 95

Lists of Tables
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Table 1: MT6329 pin descriptions……………………………………………………………………………..8


Table 2: Absolute maximum ratings ...................................................................................................... 13
Table 3: Operation condition ................................................................................................................. 13
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Table 4: General electrical specifications .............................................................................................. 14


Table 5: Regulator specifications .......................................................................................................... 15
Table 6: Power switch specifications.......................................................Error! Bookmark not defined.
Table 7: Class AB/D audio amplifier specifications ............................................................................... 20
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Table 8: Charger specifications ............................................................................................................. 22


Table 9: Driver specifications ................................................................................................................ 23
Table 10: Analog switch specifications .................................................................................................. 23
Table 11: LDO types and brief specifications ........................................................................................ 35
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1 Overview

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phones, especially those based on the


1.1 Features MediaTek MT6575 system solution. MT6329

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contains 15 buck converters and 21 LDOs,

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 Handles all 2G/3G/smart phone baseband
which are optimized for specific 2G/3G/smart
power management

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phone subsystems.
 Input range: 3.4 ~ 4.3V
 Charger input of up to 10V
MT6329 provides dual-channel, 0.7W into 8Ω,
 5 buck converters and 21 LDOs optimized
high efficiency Class AB/D audio amplifiers and

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for specific 2G/3G/smart phone
flexibility for various applications of backlight
subsystems

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LED drivers. It supports up to 6 WLEDs in
 Dual-channel, 3.7V 0.7W into 8Ω Class
parallel or alternative series 10WLED
AB/D audio amplifiers
configurations. Flexible control keeps high
 Flexibility for various configurations of
power efficiency while supporting multiple
backlight LED drivers: 6ISINK/10WLED



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boost controller
I2C interface
Pre-charge indication
drivers.

Sophisticated controls are available for power-


up, battery charging and the RTC alarm.
 Li-ion battery charging function
MT6329 is optimized for maximum battery life.
 Multi-purpose pins support either current
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The selectable 1-step or 2-step RTC LDO
sinks or analog switches
design makes MT6329 suitable for different
 Multi-purpose pins support either an RGB
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RTC modules in BB chips. It allows the RTC


LED driver or an audio receiver
circuit to stay alive without a battery for several
 VPROC with DVFS control
hours. The battery charger in MT6329 supports
 Over-current and thermal overload
lithium- ion (Li-ion) battery and provides pre-
protection
charge indication. The charger input voltage
 Programmable under voltage lockout
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can be up to 10V and allows USB charging, too.


protection
 Watchdog timer
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Some multi-purpose pins enable MT6329 to be


 Flexibility hardware PMIC reset function
configured in various applications. MT6329
 Power-on reset and start-up timer
implements dedicate analog switches, KPLED
 Precision voltage, temperature, and
and 450mA FLASH LED driver.
current measurement fuel gauge
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 155-pin TFBGA package


MT6329 adopts I2C interface to control buck
converters (dedicate 2 pins DVFS control and 3
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pins PA_SEL control), LDOs, Class AB/D,


1.2 Applications
various drivers and charger. Besides, it provides
Ideal for power management of 2G, 3G, smart enhanced safety control and protocol for
phones and other portable systems. handshaking with BB.
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MT6329 is available in a 155-pin TFBGA


MT6329 for MediaTek 3G smart phone platform, package. The operating temperature ranges
MT6575. from -25 to +85°C.

1.3 General Descriptions


MT6329 is a power management system chip
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optimized for 2G/3G handsets and smart


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1.4 Ordering Information

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Order # Marking Temp. range Package

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MT6329A -25 ~ +85°C TFBGA - 155L

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1.5 Top Marking Definition

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MT6329A

MEDIATEK
MT6329A rld FID
DDDD-BG&H
C$$$$$
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DDDD: Date code


$$$$$: LOT No.
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1.6 Pin Assignments and Descriptions

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Figure 1: MT6329 TFBGA 155 (7.1x7.1mm) pin assignment


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Table 2: MT6329 pin descriptions

Ball Symbol I/O Description


A1 BGA_NC-A1 I/O NC
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A2 SRCLKEN I Source clock enabling signal


A3 BL_PWM I External backlight CABC PWM control input signal
A4 FSOURCE I Connects to AVDD18_DIG in normal mode
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A5 VCAM_IO O LDO output used for camera IO


A7 VCAM_AF O LDO output used for camera auto-focus
A8 VSIM O LDO output used for SIM card
A10 VM12_1 O LDO output used for 1.2V DRAM
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A11 VMCH O LDO output for SD 3.0 memory card


A13 VIO18_FB I VIO18 feedback input
A14 VBAT_VPROC PWR VBAT for VPROC
B1 PA_SEL2 I PA output voltage selection
B2 PA_SEL0 I PA output voltage selection
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Ball Symbol I/O Description


B3 INT O Interrupt output

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B4 SYSRSTB I External system reset input pin (active low)
B5 VCAMD O LDO output used for camera digital

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B6 VIBR O LDO output used for vibrator
B7 VGP O LDO output reserved for further system use
B8 VUSB O LDO output used for USB

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B9 VIO28 O LDO output used for 2.8V IO
B10 VM12_INT O LDO output used for 1.2V SRAM

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B11 VGP2 O LDO output reserved for further system use
B12 VCORE_FB I VCORE feedback input
B13 VBAT_VPROC PWR VBAT for VPROC
B14 VBAT_VPROC PWR VBAT for VPROC
C1
C3
C4
rld FID
DVS1
PA_SEL1
DVS2
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VPROC output voltage selection
PA output voltage selection
VPROC output voltage selection
VBAT for VIBR, VCAM_IO, VCAMD, VRTC and
C5 VBAT_LDO3 PWR
IBIAS_DLDO1
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VBAT for VIBR, VCAM_IO, VCAMD, VRTC and


C6 VBAT_LDO3 PWR
IBIAS_DLDO1
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VBAT for VIO28, VSIM, VSIM2, VUSB, VGP and


C7 VBAT_LDO2 PWR
VCAM_AF
C8 VSIM2 O LDO output used for 2nd SIM card
C9 VM12_2 O LDO output for 1.2V DRAM or AST3002
C10 VMC O LDO output for memory card
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C11 VBAT_LDO4 PWR VBAT for VMC, VMCH, VGP2 and IBIAS_DLDO2
C12 VPA_FB I VPA feedback input
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C13 VBAT_VPROC PWR VBAT for VPROC


C14 VPROC O VPROC switching output
VBAT for VA1, VA2, VCAMA, VTCXO, VRF28
D1 VBAT_LDO5 PWR
and IBIAS_ALDO
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D2 SDA I I2C serial data


D3 SCK I I2C serial clock
D12 VRF18_FB I VRF18 feedback input
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D13 VPROC O VPROC switching output


D14 VPROC O VPROC switching output
E1 VRF28 O LDO output for RF
VBAT for VA1, VA2, VCAMA, VTCXO, VRF28
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E2 VBAT_LDO5 PWR
and IBIAS_ALDO
E3 VA1 O LDO output for analog baseband
E5 AVDD18_DIG O LDO output bypass pin
E6 HOMEKEY I Homekey
E7 VRTC O LDO output for RTC
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Ball Symbol I/O Description


VBAT for VIO28, VSIM, VSIM2, VUSB, VGP and

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E8 VBAT_LDO2 PWR
VCAM_AF

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1.8V power input for VM12_1, VM12_2 and
E9 AVDD18 PWR
VM12_INT

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E10 VPROC_FB I VPROC feedback input
E12 VCORE O VCORE switching output
E13 VBAT_VCORE PWR VBAT for VCORE

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E14 VBAT_VCORE PWR VBAT for VCORE
F2 VCAMA O LDO output for camaera analog

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F3 VCAMA_S I Sense input for VCAMA LDO
F5 VTCXO O LDO output for TCXO
F6 AVDD18_IO PWR 1.8V IO power input for internal GPIO
F7
F8
F9
rld FID
GND_LDO
GND_VPROC
GND_VPROC
GND
GND
GND
GND for LDO
GND for VPROC
GND for VPROC
F10 GND_VPROC GND GND for VPROC
F12 VCORE O VCORE switching output
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F13 VCORE O VCORE switching output
G1 CS+ I Fuel gauge positive current sense point
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G2 CS- I Fuel gauge negative current sense point


G3 VA2 O LDO output for analog baseband
G5 VA2_BUF O LDO output for analog baseband
G6 GND_LDO GND GND for LDO
G7 GND_LDO GND GND for LDO
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G8 GND_VCORE GND GND for VCORE


G9 GND_VCORE GND GND for VCORE
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G10 GND_VCORE GND GND for VCORE


G12 VIO18 O VIO18 switching output
G13 VIO18 O VIO18 switching output
G14 VBAT_VIO18 PWR VBAT for VIO18
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H1 ISENSE I Charging current sense input


H2 BATSNS I Battery voltage sense input
H3 CHG_DM I USB D- for BC1.1 standard
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H5 CHR_LDO O Charger LDO output bypass pin


H6 GND_LDO GND GND for LDO
H7 GND_LDO GND GND for LDO
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H8 GND_VCORE GND GND for VCORE


H9 GND_VIO18 GND GND for VIO18
H10 GND_VIO18 GND GND for VIO18
H12 VRF18 O VRF18 switching output
H13 VBAT_VRF18 PWR VBAT for VRF18
H14 VBAT_VIO18 PWR VBAT for VIO18
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Ball Symbol I/O Description


J2 VREF O Internal reference bypass

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J3 TREF O Battery thermal detection reference voltage
J5 CHG_DP I USB D+ for BC1.1 standard

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J6 GND_LDO GND GND for LDO
J7 GND_LDO GND GND for LDO
J8 GND_VIO18 GND GND for VIO18

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J9 GND_VRF18 GND GND for VRF18
J10 GND_VRF18 GND GND for VRF18

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J12 GND_VPA GND GND for VPA
J13 VPA O VPA switching output
J14 VBAT_VPA PWR VBAT for VPA
K1 BATON I Battery thermal detection input
K2
K3
K5
rld FID
GND_VREF
USB_DLN
32K_IN
GND
I
I
GND for reference
USB download key
RTC 32K input used for fuel gauge operation
K6 GND_LDO GND GND for LDO
K7 GND_SPK2 GND GND for speaker channel 2
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K8 GND_LDO GND GND for LDO


K9 BST_GDRV O Boost controller gate drvie output
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K10 GND_ISINK GND GND for ISINK


K12 GND_VPA GND GND for VPA
K13 VPA O VPA switching output
K14 VBAT_VPA PWR VBAT for VPA
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L1 VDRV O Charger current drive output


L2 RESETB O Reset output
L3 USB_DLP I USB download key
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L12 GND_DRV GND GND for flashligh and keypad LDO drivers
L13 FLASH O Flashlight open drain output
L14 KPLED O Keypad LED open drain output
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M2 PCH_DET O Charging indicator current sink output


M3 PWRBB I Power on RTC domain latch signal
Test mode input (normal function should tie to
M4 PMU_TESTMODE I
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GND)
M5 BYPASS O SPK common mode voltage bypass
M6 GND_LDO GND GND for LDO
M7 GND_SPK2 GND GND for speaker channel 2
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M8 GND_SPK1 GND GND for speaker channel 1


M9 GND_SPK1 GND GND for speaker channel 1
M10 ISINK4 O Current sink channel 4 output
M11 GND_ISINK GND GND for ISINK
M12 GND_DRV GND GND for flashligh and keypad LDO drivers
M13 ISINK0 O Current sink channel 0 output
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Ball Symbol I/O Description


N1 VCDT I Ratioed charger input voltage

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N2 PWRKEY I Power key
N3 AUD1_P I Audio channel 1 differential input (positive)

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N4 AUD1_N I Audio channel 1 differential input (negative)
N5 VBI_N I Voice differential input (negative)
N6 ASW_OUT O Analog switch output

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N7 ASW_IN1 I Analog switch input 1
N8 ASW_IN2 I Analog switch input 2

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N9 VBAT_MISC PWR VBAT for buck, driver and speaker controller
N11 ISINK5 O Current sink channel 5 output
N12 ISINK3 O Current sink channel 4 output
N13 ISINK2 O Current sink channel 3 output
N14
P1
P2
rld FID
ISINK1
BGA_NC-P1
AUD2_P
O
I/O
I
Current sink channel 1 output
NC
Audio channel 2 differential input (positive)
P3 AUD2_N I Audio channel 2 differential input (negative)
P5 VBI_P I Voice differential input (positive)
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P7 VBAT_SPK2 PWR VBAT for speaker channel 2


P8 VBAT_SPK1 PWR VBAT for speaker channel 1
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P10 SPK2_P O Speaker channel 2 differential output (positive)


P11 SPK2_N O Speaker channel 2 differential output (negative)
P12 SPK1_N O Speaker channel 1 differential output (negative)
P13 SPK1_P O Speaker channel 1 differential output (positive)
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P14 BGA_NC-P14 I/O NC


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2 Electrical Characteristics

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2.1 Absolute Maximum Ratings over Operating Free-Air

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Temperature Range
Stresses beyond those listed under Table 3 may cause permanent damage to the device. These

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numbers are stress ratings only, and functional operation of the device at these or any other

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conditions beyond those indicated in the operational sections of specifications is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.

Table 3: Absolute maximum ratings

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Parameter
Free-air temperature range
Conditions Min.
-40
Typical Max.
85
Unit
°C
Storage temperature range -65 150 °C
Battery input voltage range 4.3 V
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ESD robustness HBM 2,000 V
Charger input withstand 10 V
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2.2 Thermal Characteristic


Parameter Conditions Min. Typical Max. Unit
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Thermal resistance from


In free air 39.8[1] °C/W
junction to ambient
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Note: The device is mounted on a 4-metal-layer PCB and modeled per JEDEC51-9 condition.
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2.3 Pin Voltage Rating (TBD)


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2.4 Recommended Operating Range


Table 4: Operation condition

Parameter Conditions Min. Typical Max. Unit


Operating temperature range -25 85 °C
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2.5 Electrical Characteristics

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VBAT = 3.4 ~ 4.2V, minimum loads applied on all outputs, unless otherwise noted.

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Typical values are at TA = 25°C.

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Table 5: General electrical specifications

Parameter Conditions Min. Typical Max. Unit

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Switch-off mode: supply current
VBAT < 2.4 V RTC LDO OFF 85 μA

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2.4 V < VBAT < 3.2 V 35 μA
3.2 V < VBAT 60 μA
Operation ground current
Standby Low-power mode 300 μA
rld FID
Under voltage (UV)
Under voltage falling threshold 1 UV_SEL[1:0] = 00 2.8 2.9 3.0 V
Under voltage falling threshold 2 UV_SEL[1:0] = 01 2.75 V
Under voltage falling threshold 3 UV_SEL[1:0] = 10 2.6 V
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Under voltage falling threshold 4 UV_SEL[1:0] = 11 2.5 V
Under voltage rising threshold UV_SEL[1:0] = xx 3.1 3.2 3.3 V
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Reset generator
Output high VIO-0.4 V
Output low 0.2 V
Output current (Ioh) Vo > VIO-0.4V 1 mA
Delay Time from switched-on to
100 200 400 ms
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RESETB release
Interrupt
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Output high VIO-0.4 V


Output low 0.2 V
Power key input
High voltage 0.7*VBAT V
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Low voltage 0.3*VBAT V


De-bounce time 25 50 200
Control input voltage
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PWRBB input high 2.1 V


PWRBB input low 0.54 V
Other control input high
2.0 V
(SRCLKEN, PA_SEL)
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Other control input low


0.5 V
(SRCLKEN, PA_SEL)
Thermal shut-down
PMIC shut-down threshold 150 degree
SW high power latch threshold 125 degree
Interrupt threshold 110 degree
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Parameter Conditions Min. Typical Max. Unit


LDO enable response time 250 μs

EO
US L
cn IA
2.6 Regulator Output
Table 6: Regulator specifications

m. T
Parameter Conditions Min. Typical Max. Unit
Boost controller

.co EN
Vin = 3.8V, 20mA, Vout =
Efficiency 80 %
35V
Switch on max. duty cycle 93 %
Regulated feedback voltage
0.28 0.3 0.32 V
(int.)
rld FID
Turn-on rise time
OVP on threshold 1.1 1.2
1
1.3
ms
V
OVP off threshold 1 V
Buck - VCORE
wo N
Output voltage 1.1 V
Output current 1,000 mA
ter CO

Turn-on overshoot 10 %
Load regulation -10 10 %
Buck - VPROC
Output voltage 1.25 V
Output current 1,500 mA
wa K

Turn-on overshoot 10 %
Load regulation -6 6 %
@ TE

Buck - VIO18
Output voltage 1.8 V
Output current 1,000 mA
Turn-on overshoot 10 %
xin IA

Buck - VRF18
Output voltage 1.825 V
Output current 250 mA
zli ED

Turn-on overshoot 10 %
R M
FO

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Parameter Conditions Min. Typical Max. Unit


Buck - VPA

EO
US L
Output voltage 0.9 3.4 V
Output current VOUT=3.4V 800 mA

cn IA
Turn-on overshoot 10 %
ALDO - VRF28
Output voltage 2.7 2.85 3 V

m. T
Output current 200 mA
Freq = 10 Hz to 80 kHz
Output noise 90 uVrms

.co EN
Iout = 0.01Imax ~ full load
100 Hz < freq < 3 kHz
65 dB
Iout = 0.01Imax/0.5Imax
PSRR
3 kHz < freq < 30 kHz
45

ALDO - VTCXO
rld FID
Turn-on rise time
Iout = 0.01Imax/0.5Imax
No load 240 us

Output voltage 2.7 2.8 2.9 V


Output current 40 mA
wo N
Freq = 10 Hz to 80 kHz
Output noise 90 uVrms
Iout = 0.01Imax ~ full load
ter CO

100 Hz < freq < 3 kHz


65 dB
Iout = 0.01Imax/0.5Imax
PSRR
3 kHz < freq < 30 kHz
45
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 240 us
wa K

ALDO - VA1
Output voltage 2.35 2.5 2.65 V
@ TE

Output current 100 mA


Freq = 10 Hz to 80 kHz
Output noise 90 uVrms
Iout = 0.01Imax ~ full load
100 Hz < freq < 3 kHz
65 dB
xin IA

Iout = 0.01Imax/0.5Imax
PSRR
3 kHz < freq < 30 kHz
45
Iout = 0.01Imax/0.5Imax
zli ED

Turn-on rise time No load 360 us


ALDO - VA2
Output voltage 2.35 2.5 2.65 V
Output current 100 mA
M

Freq = 10 Hz to 80 kHz
Output Noise 90 uVrms
Iout = 0.01Imax ~ full load
100 Hz < freq < 3 kHz
65 dB
Iout = 0.01Imax/0.5Imax
PSRR
3 kHz < freq < 30 kHz
45
Iout = 0.01Imax/0.5Imax
R
FO

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Parameter Conditions Min. Typical Max. Unit


Turn-on rise time No load 360 us

EO
US L
ALDO - VCAMA
VCAMA_SEL = 00 1.4 1.5 1.6 V

cn IA
VCAMA _SEL = 01 1.7 1.8 1.9 V
Output voltage
VCAMA _SEL = 10 2.35 2.5 2.65 V
VCAMA _SEL = 11 2.65 2.8 2.95 V

m. T
Output current 200 mA
Freq = 10 Hz to 80 kHz
Output noise 40 uVrms

.co EN
Iout = 0.01Imax ~ full load
100 Hz < freq < 3 kHz
65 dB
Iout = 0.01Imax/0.5Imax
PSRR
3 kHz < freq < 30 kHz
45
rld FID
Turn-on rise time

Load transient response


Iout = 0.01Imax/0.5Imax
No load
IOUT = 1mA to full Load
1,000

40
us

mV
(15mA/usec)
DLDO - VM12_1
wo N
Output voltage 1.1 1.2 1.3 V
Output current 300 mA
ter CO

Freq = 217 Hz
PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - VM12_2
Output voltage 1.1 1.2 1.3 V
wa K

Output current 300 mA


Freq = 217 Hz
PSRR 40 dB
@ TE

Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - VM12_INT
Output voltage 1.1 1.2 1.3 V
xin IA

Output current 360 mA


Freq = 217 Hz
PSRR 40 dB
Iout = 0.01Imax/0.5Imax
zli ED

Turn-on rise Time No load 360 us


DLDO - VIO28
Output voltage 2.65 2.8 2.95 V
Output current 100 mA
M

Freq = 217 Hz
PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - USB
Output voltage 3.1 3.3 3.5 V
Output current 100 mA
R
FO

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Parameter Conditions Min. Typical Max. Unit


Freq = 217 Hz

EO
PSRR 40 dB
Iout = 0.01Imax/0.5Imax

US L
Turn-on rise time No load 360 us

cn IA
DLDO - SIM1
VSIM1_SEL = 0 1.7 1.8 1.9 V
Output voltage
VSIM1_SEL = 1 2.85 3.0 3.15 V

m. T
Output current 100 mA
Freq = 217 Hz
PSRR 40 dB

.co EN
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - SIM2
VSIM2_SEL = 000 1.2 1.3 1.4 V

Output voltage
rld FID VSIM2_SEL = 001
VSIM2_SEL = 010
VSIM2_SEL = 011
1.4
1.7
2.35
1.5
1.8
2.5
1.6
1.9
2.65
V
V
V
VSIM2_SEL = 100 2.65 2.8 2.95 V
VSIM2_SEL = 101 2.85 3.0 3.15 V
wo N
VSIM2_SEL = 110 3.1 3.3 3.5 V
Output current 100 mA
ter CO

Freq = 217 Hz
PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - VCAMD
VCAMD_SEL = 000 1.2 1.3 1.4 V
wa K

VCAMD_SEL = 001 1.4 1.5 1.6 V


VCAMD_SEL = 010 1.7 1.8 1.9 V
@ TE

VCAMD_SEL = 011 2.35 2.5 2.65 V


Output voltage
VCAMD_SEL = 100 2.65 2.8 2.95 V
VCAMD_SEL = 101 2.85 3.0 3.15 V
VCAMD_SEL = 110 3.1 3.3 3.5 V
xin IA

VCAMD_SEL = 1111 1.1 1.2 1.3


Output current 300 mA
Freq = 217 Hz
zli ED

PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - VCAM_IO
VCAM_IO_SEL = 000 1.2 1.3 1.4 V
M

VCAM_IO_SEL = 001 1.4 1.5 1.6 V


VCAM_IO_SEL = 010 1.7 1.8 1.9 V
Output voltage
VCAM_IO_SEL = 011 2.35 2.5 2.65 V
VCAM_IO_SEL = 100 2.65 2.8 2.95 V
VCAM_IO_SEL = 101 2.85 3.0 3.15 V
R
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Parameter Conditions Min. Typical Max. Unit


VCAM_IO_SEL = 110 3.1 3.3 3.5 V

EO
US L
Output current 100 mA
Freq = 217 Hz
PSRR 40 dB

cn IA
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - VCAM_AF

m. T
VCAM_AF_SEL = 000 1.2 1.3 1.4 V
VCAM_AF_SEL = 001 1.4 1.5 1.6 V

.co EN
VCAM_AF_SEL = 010 1.7 1.8 1.9 V
Output voltage VCAM_AF_SEL = 011 2.35 2.5 2.65 V
VCAM_AF_SEL = 100 2.65 2.8 2.95 V
VCAM_AF_SEL = 101 2.85 3.0 3.15 V

Output current
rld FID VCAM_AF_SEL = 110

Freq = 217 Hz
3.1 3.3
200
3.5 V
mA

PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
wo N
DLDO - VMC
VMC_SEL = 000 1.2 1.3 1.4 V
ter CO

VMC_SEL = 001 1.4 1.5 1.6 V


VMC_SEL = 010 1.7 1.8 1.9 V
Output voltage VMC_SEL = 011 2.35 2.5 2.65 V
VMC_SEL = 100 2.65 2.8 2.95 V
VMC_SEL = 101 2.85 3.0 3.15 V
wa K

VMC_SEL = 110 3.1 3.3 3.5 V


Output current 200 mA
@ TE

Freq = 217 Hz
PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 40 us
DLDO - VMCH
xin IA

VMCH_SEL = 000 1.2 1.3 1.4 V


VMCH_SEL = 001 1.4 1.5 1.6 V
VMCH_SEL = 010 1.7 1.8 1.9 V
zli ED

Output voltage VMCH_SEL = 011 2.35 2.5 2.65 V


VMCH_SEL = 100 2.65 2.8 2.95 V
VMCH_SEL = 101 2.85 3.0 3.15 V
M

VMCH_SEL = 110 3.1 3.3 3.5 V


Output current 400 mA
Freq = 217 Hz
PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 40 us
DLDO - VGP1
R
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Parameter Conditions Min. Typical Max. Unit


VGP1_SEL = 000 1.2 1.3 1.4 V

EO
US L
VGP1_SEL = 001 1.4 1.5 1.6 V
VGP1_SEL = 010 1.7 1.8 1.9 V

cn IA
Output voltage VGP1_SEL = 011 2.35 2.5 2.65 V
VGP1_SEL = 100 2.65 2.8 2.95 V
VGP1_SEL = 101 2.85 3.0 3.15 V

m. T
VGP1_SEL = 110 3.1 3.3 3.5 V
Output current 200 mA

.co EN
Freq = 217 Hz
PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - VGP2

rld FID VGP2_SEL = 000


VGP2_SEL = 001
VGP2_SEL = 010
1.2
1.4
1.7
1.3
1.5
1.8
1.4
1.6
1.9
V
V
V
Output voltage VGP2_SEL = 011 2.35 2.5 2.65 V
VGP2_SEL = 100 2.65 2.8 2.95 V
wo N
VGP2_SEL = 101 2.85 3.0 3.15 V
VGP2_SEL = 110 3.1 3.3 3.5 V
ter CO

Output current 100 mA


Freq = 217 Hz
PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
DLDO - VIBR
wa K

VIBR_SEL = 000 1.2 1.3 1.4 V


VIBR_SEL = 001 1.4 1.5 1.6 V
@ TE

VIBR_SEL = 010 1.7 1.8 1.9 V


Output voltage VIBR_SEL = 011 2.35 2.5 2.65 V
VIBR_SEL = 100 2.65 2.8 2.95 V
xin IA

VIBR_SEL = 101 2.85 3.0 3.15 V


VIBR_SEL = 110 3.1 3.3 3.5 V
Output current 100 mA
Freq = 217 Hz
zli ED

PSRR 40 dB
Iout = 0.01Imax/0.5Imax
Turn-on rise time No load 360 us
M

2.7 Class AB/D Audio Amplifier


Table 7: Class AB/D audio amplifier specifications

Class AB parameter Conditions Min. Typical Max. Unit


R
FO

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Class AB parameter Conditions Min. Typical Max. Unit


8Ω load, VBAT = 4.2 V

EO
850 mW
THD + N = 1%

US L
8Ω load, VBAT = 3.7 V
RMS power 700 mW

cn IA
THD + N = 1%
8Ω load, VBAT = 3.4 V
600 mW
THD + N = 1%
THD+N 1 kHz, Po = 0.5Wrms, 4.2V 0.05 0.2 %

m. T
217 Hz, Vin = 200mVpk-pk
75 85 dB
Input AC to ground

.co EN
1 kHz, Vin = 200mVpk-pk
75 85 dB
Input AC to ground
PSRR
4 kHz, Vin = 200mVpk-pk
75 85 dB
Input AC to ground
rld FID 20 kHz, Vin = 200mVpk-pk
Input AC to ground
VBAT = 3.3V 0dB gain
50 dB

Noise level 25 70 μV
8Ω, A-weighted
VBAT = 4.2V 0dB Gain
wo N
25 70 uV
8Ω, A-weighted
Gain adjustment 3 21 dB
ter CO

Gain adjustment steps 3 dB


Quiescent current No load 3 6 mA
VBAT=3.4/3.8/4.2V
CMRR 49 60 Ω
f=1kHz, Vin=200mVpk-pk
wa K

Class D parameter Conditions Min. Typical Max. Unit


8Ω load, VBAT = 4.2 V
@ TE

RMS power 900 mW


THD + N = 1%
8Ω load, VBAT = 3.7 V
700 mW
THD + N = 1%
8Ω load, VBAT = 3.4V
xin IA

600 mW
THD + N = 1%
THD+N 1 kHz, Po = 0.5Wrms, 4.2V 0.2 %
217 Hz, Vin = 200mVpk-pk
zli ED

PSRR 65 75 dB
Input AC to ground
1 kHz, Vin = 200mVpk-pk
65 75 dB
Input AC to ground
4 kHz, Vin = 200mVpk-pk
65 75 dB
M

Input AC to ground
20 kHz, Vin = 200mVpk-pk
50 dB
Input AC to ground
VBAT = 3.3V 0dB gain
Noise level 25 70 μV
8Ω, A-weighted
VBAT = 4.2V 0dB gain 25 70 uV
R
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Class D parameter Conditions Min. Typical Max. Unit


8Ω, A-weighted

EO
US L
VBAT = 4.2V
Efficiency 80 90 %
0.8W, 8Ω with 68uH, 1 kHz

cn IA
Gain adjustment Mute 21 dB
Gain adjustment steps 3 dB
Quiescent current No load 4 6 mA

m. T
VBAT = 3.4/3.8/4.2V
CMRR 49 60 Ω
f=1 kHz, Vin = 200mVpk-pk

.co EN
2.8 Battery Charger
Table 8: Charger specifications

CHRIN voltage
rld FID
Parameter Conditions Min.
4.3
Typical
5
Max.
7
Unit
V
Operation range VCGRIN 3.2 5 8 V
OTG detection 0.8 2.4 4 V
wo N
VCDT CHRIN detection VCDT_VTHL[3:0] = 0000 ~
4.2 10.5 V
threshold 1111
ter CO

HV adaptive current @ VCDT switch threshold


6 V
pre_charge (200mA => 70mA)
Vchg = 3.3/5V
Pre-charging indicator 1000 mV
4.5mA VISINK drop
VBAT CC 3.15 3.3 3.45 V
wa K

VBAT CV 4.15 4.2 4.25 V


@ TE

VBAT OV 4.25 4.3 4.35 V


CS_VTH = 1111 14/Rsense mA
CS_VTH = 1110 40/Rsense mA
xin IA

CS_VTH = 1101 80/Rsense mA


CS_VTH = 1100 90/Rsense mA
CS_VTH = 1011 110/Rsense mA
CS_VTH = 1010 130/Rsense mA
zli ED

CS_VTH = 1001 140/Rsense mA


CC mode charging current CS_VTH = 1000 160/Rsense mA
CS_VTH = 0111 180/Rsense mA
M

CS_VTH = 0110 200/Rsense mA


CS_VTH = 0101 220/Rsense mA
CS_VTH = 0100 240/Rsense mA
CS_VTH = 0011 260/Rsense mA
CS_VTH = 0010 280/Rsense mA
CS_VTH = 0001 300/Rsense mA
R
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Parameter Conditions Min. Typical Max. Unit


CS_VTH = 0000 320/Rsense mA

EO
US L
VTHH 3.2 V
UVLO
VTHL 2.9 V

cn IA
VTHH 2.7 V
DDLO
VTHL 2.5 V

m. T
2.9 Driver

.co EN
Table 9: Driver specifications

Parameter Conditions Min. Typical Max. Unit


Flash dropout voltage VFlash @ ISINK = 450mA 0.5 V

rld FID
Flash soft start time
KPLED dropout voltage
KPLED soft start time
VFlash @ ISINK = 300mA
KPLED @ ISINK = 150mA
KPLED @ ISINK = 150mA
1
0.5
1
ms
V
ms
VISINK = 0.3 ~ 2.5V
ISINK current matching -5 5 %
4/24mA, 5 LEDs
wo N

ISINK LED sink current ISINK_SEL = 000 4 mA


ISINK_SEL = 001 8
ter CO

ISINK_SEL = 010 12
ISINK_SEL = 011 16
ISINK_SEL = 100 20
ISINK_SEL = 101 24
wa K

4 ~ 20mA
ISINK dropout voltage 150 250 mV
VISINK drop
ISINK rise/fall time VISINK > 0.3V 3.33 uS
@ TE

2.10 Analog Switch


xin IA

Table 10: Analog switch specifications

Parameter Conditions Min. Typical Max. Unit


zli ED

Analog switch turn-on


VBAT = 3.3/4.2V 3 Ω
resistance
VBAT = 3.4/4.2V
Analog switch turn-on THD 1k ~ 8 kHz, 200mVpp 70 dB
10kΩ
M

2.11 BC1.1
Parameter Conditions Min. Typical Max. Unit
BC11 Charging Port Standard down-string port 35 70 94 mA
R
FO

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Parameter Conditions Min. Typical Max. Unit


Detection Standard charging down-

EO
35 70 94 mA
string port

US L
DP, DM short 140 200 260 mA

cn IA
DP, DM floating 140 200 260 mA
IPU_DP, IPU_DM 9.6 uA
IPD_DP, IPD_DM 96 uA

m. T
VSRC on DP, DM 630 mV
Current pulse value under
70 mA
2.2V

.co EN
BC11 Characteristics
Current pulse periode
550 ms
under 2.2V
OSC1M, timer 5 min
RTC, timer 35 min
rld FID BC1.1 flow on threshold 2.2 V

2.12 Down Load Without Battery


wo N

Parameter Conditions Min. Typical Max. Unit


Duration 8.0 s
ter CO

USBDL
Current 550 mA

2.13 Fuel Gauge


wa K

Parameter Conditions Min. Typical Max. Unit


Output resolution 16 Bit
@ TE

Conversion time 1/2^15 s


FG current characteristics
Over-sampling ratio 2^11 2^13
Auto-calibration time 0.25 4.96 s
xin IA

Input voltage range -50 50 mV


Supply 2.5 V
Current 60 uA
ADC characteristics
zli ED

Gain error -2 2 %
Accuracy 0.03 %
Noise 5 uV
R M
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3 Functional Descriptions

EO
US L
3.1 General Descriptions

cn IA
MT6329 is a fully integrated PMIC target for smart phone power provider. See Figure 2 the block
diagram for the whole picture of MT6329 PMIC.

m. T
.co EN
rld FID
wo N
ter CO
wa K
@ TE

Figure 2: MT6329 block diagram


xin IA

3.2 PMIC Functional Blocks


MT6329 manages the power supply of the whole chip, such as the baseband, processor, memory,
zli ED

SIM cards, camera, vibrator, etc. MT6329 includes the following analog functions for the use on smart
phone platforms.

 LDO and BUCK: Provide regulated lower output voltage level from Li-Ion battery
M

 Keypad/Flash LED driver (KPLED/FLASHLED) and current sink (ISINK) driver: Sink current for
keypad LED and LCM module
 Controller: Generates power-on/off sequence, system reset and exceptional handling function
 Charger controller: Controls/Protects battery charging procedure
 Class-AB/D audio amplifier: Supports high-power/quality audio amplifier
 Fuel gauge: Supports accurate battery capacity monitor
R
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More detailed descriptions of each sub-block are explained in the following sections.

EO
US L
3.2.1 Power-On/Off Sequence

cn IA
PMIC handles the powe-on and -off of the handset. If the battery voltage is neither in the UVLO state
(VBAT ≥ 3.4V) nor in the thermal condition, there are three methods to power on the handset system:

m. T
1) Pulling PWRKEY low (the user pushes PWRKEY), 2) Pulling PWRBB high (baseband BB_WakeUp)
and 3) Valid charger plug-in.

.co EN
According to different battery voltage (VBAT) and phone state, control signals and regulators will have
different responses.

rld FID
Power on/off sequence
The power-on/off sequence controlled by the “control” and “reset generator” is shown in the figure
below.
wo N
< 100ms

VBAT
ter CO

DDLO

VRTC

UVLO

PWRKEY
wa K

PWRBB
de-bounce
@ TE

50ms

PWRON

2ms
VCORE
2ms
xin IA

VPROC
2ms
VIO18
2ms
VIO28 / VM12_INT
zli ED

VA1 / VA2
2ms

VM12_1 / VM12_2
2ms

VUSB / VTCXO
2ms
M

VMC / VMCH
150ms
RESETB

Figure 3: Power-on/off control sequence by pressing PWRKEY


R
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EO
US L
Note that the figure above only shows one power-on/off. MT6329 handles the powe-on and -off of the
handset. The following three different ways methods switch on the handset (when VBAT ≥ 3.4V):

cn IA
1. Pushing PWRKEY (pulling the PWRKEY pin to low level)
Pulling PWRKEY low is typical method to turn on the handset. The VCORE and VPROC buck

m. T
converters will be turned on first then VIO18 and VIO28 LDOs are turned on sequentially. The
supplies for the baseband are ready, and the system reset ends at the moment when all the

.co EN
default-on regulators are fully turned on to ensure correct timing and function. After that, the
baseband sends the PWRBB signal back to PMIC for acknowledgement. To successfully power
on the handset, PWRKEY should be kept low until PMIC receives PWRBB from the baseband.

rld FID
2. RTC module generates PWRBB to wake up the system
If the RTC module is scheduled to wake up the handset at some time, the PWRBB signal will be
directly sent to PMIC. In this case, PWRBB becomes high at specific moment and allows PMIC
power-on as the sequence described above. This is called the RTC alarm.
wo N

3. Valid charger plug-in (CHRIN voltage within valid range)


The charger plug-in will also turn on the handset if the charger is valid (no OVP takes place).
ter CO

However, if the battery voltage is too low to power on the handset (UVLO state), the system will
not be turned on by any of the three methods. In this case, the charger will charge the battery first,
and the handset will be powered on automatically as long as the battery voltage is high enough.

Under-voltage lockout (UVLO)


wa K

The UVLO state in PMIC prevents start-up if the initial voltage of the main battery is below the 3.2V
threshold. It ensures that the handset is powered on with the battery in good condition. The UVLO
@ TE

function is performed by a hysteretic comparator which ensures smooth power-on sequence. In


addition, when the battery voltage is getting lower, it will enter the UVLO stat,e and PMIC will be
turned off by itself, except for VRTC LDO, to prevent further discharging. Once PMIC enters the
UVLO state, it will draw low quiescent current. RTC LDO will still be working until DDLO disables it.
xin IA

Deep discharge lockout (DDLO)


PMIC will enter the deep discharge lockout (DDLO) state when the battery voltage drops below 2.5V.
zli ED

In this state, VRTC LDO will be shut down. Otherwise, it will draw very low quiescent current to
prevent further discharging or even damage to the cells.

Reset
M

PMIC contains a reset control circuit which takes effect at both power-up and power-down. The
RESETB pin is held low in the beginning of power-up and returns to high after the pre-determined
delay time. The delay time is controlled by a large counter, which uses the clock from the internal ring-
oscillator. At power-off, the RESETB pin will return to low immediately without any delay.

Over-temperature protection
R
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If the die temperature of PMIC exceeds 150°C, PMIC will automatically disable all LDOs except for
VRTC. Once the over-temperature state is resolved, a new power-on sequence will be required to

EO
enable the LDOs.

US L
cn IA
3.2.2 The Battery Charger (Charger Controller)
The charger controller senses the charger input voltage from either a standard AC-DC adaptor or an

m. T
USB charger. When the charger input voltage is within a pre-determined range, the charging process
will be activated. This detector resists higher input voltages than other parts of PMIC.

.co EN
3.2.2.1 Block Descriptions
Charger block diagram

Off Chip
rld FID ON Chip
CHRIN

DXT790AP5

CHRIN
CHRLDO 2.8V NTR4503N
VBAT
3.3K
CHRLDO28 DRV
wo N
1u
VBAT_DDLO_DET 8V LDMOS
CSDAC_EN

VBAT_DDLO_VTH<1:0>

CSDAC_DAT<7:0>
ter CO

VBAT_UVLO_DET

VREF VBAT_UVLO_VTH<1:0>
1u
VBAT
Voltage VBAT_CC_DET ISENSE
divider VBAT_CC_VTH[1:0]

CS_DET Current in2


in1
Sensing vr set Rsense
VBAT_CV_DET EN

CS_EN VREF
VBAT_CV_VTH[1:0]
CS_VTH[3:0]
gain BATSNS
VBAT
VBAT_OV_DET CHR_LDO_DET (VBAT)
wa K

VBAT_OV_VTH[1:0]

Charger Core
TREF And
Digital Controller
@ TE

24k
BATON
Interface To BB
COMP BATON_UNDET

RNTC
OTG/BATON VREF GEN

COMP OTG_BVALID_DET
BC1.1
Controller
xin IA

CHRIN
VCDT UpTo 10.5V
OTG_BVAILD_EN

330k
VCDT
COMP VCDT_DET
VCDT VREF GEN MUX
39k 10uF
CCHRLDO_DET_CMP
zli ED

VCDT_VTH[3:0]
VTH CGRLDOGOOD
CHR_LDO_DET COMP
VBGR

Figure 4: PCHR block diagram


M

3.2.2.1.1 Charger Detection

Whenever an invalid charging source is detected (> 7.0V), the charger detector will stop the charging
process immediately to avoid burning out the chip or even the phone. Furthermore, if the charger-in
R
FO

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level is not high enough (< 4.3V), the charger will also be disabled to avoid improper charging
behavior.

EO
US L
3.2.2.1.2 Charging Control

cn IA
When the charger is active, the charger controller will manage the charging phase according to the
battery status. During the charging period, the battery voltage is constantly monitored. The battery
charger supports pre-charge mode (VBAT < 3.2V, PMIC power-off state), CC mode (constant current

m. T
mode or fast charging mode at the range of 3.2V < VBAT < 4.2V) and CV mode (constant voltage
mode) to optimize the charging procedure for Li-ion battery. See the figure below for the charging

.co EN
states diagram.

rld FID
wo N
ter CO
wa K
@ TE
xin IA
zli ED
R M
FO

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NON- CHARGING

EO
US L
Dead Battery
VBAT<2.2V YES
45 min timeout

cn IA
NO

CHRIN > 4.3V


CHRIN DET

m. T
CHRIN
YES

.co EN
YES
VBAT > 3.3V

NO

rld FID Charger OFF


YES
VBAT < 3.3V
45 min timeout

NO
CC Mode

VBAT > 4.1V NO


PreCC
wo N

CV Mode
ter CO

YES

FULL

VBAT > 4.2V NO


More than N times
wa K

YES
@ TE

Charger OFF

NO
VBAT < 4.35V
xin IA

YES

Figure 5: Charging states diagram


zli ED

Pre-charge mode
When the battery voltage is in the UVLO state, the charger will operate in the pre-charge mode. There
M

are two steps in this mode. While the battery voltage is deeply discharged below 2.2V, PRECC0
trickle charging current is applied to the battery.

The PRECC1 trickle charging current is about 56mA continuous current when VBAT is under 2.2V.
R
FO

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When the battery voltage exceeds 2.2V, i.e. the PRECC2 stage, the closed-loop pre-charge will be
enabled. The voltage drop across the external RSENSE is kept around 40mV (AC charger) or 14mV

EO
(USB host). The closed-loop pre-charge current can be calculated:

US L
cn IA
V SENSE 40mV
IPRECC2, AC adapter
 
Rsense Rsense
V SENSE 14mV
IPRECC2,  

m. T
USB HOST
Rsense Rsense

.co EN
Constant current mode
As the battery is charged up and over 3.3V, it can switch to the CC mode. (CHR_EN should be high)
In the CC mode, several charging currents can be set by programming registers or the external
RSENSE resistor. The charging current can be determined by CS_VTH/RSENSE, where CS_VTH is

rld FID
programmed by registers. For example, if RSENSE is selected as 0.2ohm, the CC mode charging
current can be set from 70 to 800mA. It can accommodate the battery charger to various charger
inputs with different current capability.

Constant-voltage mode and over-voltage protection (OV)


wo N
While the battery voltage reaches about 4.2V, a constant current with much shorter period is used for
charging. It allows more often full battery detection in non-charging period. This is called the full-
ter CO

voltage charging mode or constant-voltage charging mode in correspondence to a linear charger.


While the battery voltage actually reaches 4.2V, more than the pre-setting times within the limited
charging cycles, the end-of-charging process starts. It may prolong the charging and detecting period
for acquiring optimized full charging volume. The end of charging process is fully controlled by the
baseband and can be easily optimized for different battery packs. Once the battery voltage exceeds
wa K

4.35V, a hardware OV protection should be activated and turn off the charger immediately.
@ TE

3.2.2.1.3 BC1.1 Dead-Battery Support of China Standard


MT6255 also support dead-battery condition from China standard (BC1.1). These specifications
protect dead-battery charging by timer and trickle current. Once the battery voltage is below 2.2V, a
xin IA

period (TUNIT) of trickle current (IUNIT) will be applied to the battery.

If the battery voltage is still below 2.2V after applying the trickle current, the charger will be disabled.
zli ED

On the other hand, once if the battery voltage rises up to above 2.2V, the charger will enter the
PRECC1 stage, and the charging current will be 70mA or 200mA depending on the type of the
charging port.
M

Under the condition of battery voltage from 2.2V to 3.3V, the charger will charge the battery with the
PRECC1 current.

A dedicated 5 mins. (T1) timer will be timed out and disable the charger if the battery voltage is always
below 2.7V under charging. Another 35 mins. (T2) timer will also be timed out and disable the charger
if the battery voltage is always kept between 2.7V and 3.3V under charging.
R
FO

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The trickle current (IUNIT) and two dedicated timers protect the charging action if the battery is dead.

EO
US L
3.2.3 Buck Converter

cn IA
There are 5 buck converters in MT6329 to efficiently generate regulated power for processor, digital
core, 3G power amplifier, memory IO and RF circuit. The block diagram is shown in Figure 10. The

m. T
buck converters operate with typically 2 MHz fixed frequency pulse width modulation (PWM) mode at
moderate to heavy load currents. At light load currents, the converter automatically enters pulse

.co EN
frequency modulation (PFM) mode to save power and improve light load efficiency. It also has a force-
PWM mode option to allow the converter to remain in the PWM mode regardless of the load current,
so that the noise spectrum of the converter can be minimized for certain highly-noise-sensitive
handset applications. The buck converters also have an internal over-current protection (OCP) circuit

rld FID
to limit the maximum high-side power FET current in over-load conditions. It has an internal soft start
circuit to control the ramp-up rate of the output voltage during start-up.

Table 10: Buck converter brief specifications


wo N
BUCK name Vout (Volt) Imax (mA) Application
VCORE 0.75 ~ 1.3 (25mV/step) 1,000 Digital CORE
ter CO

VPROC/Vcore2 0.75 ~ 1.3 (25mV/step) 1,500 Processor


VIO18 1.8 1,000 IO
VRF_1V8 1.825 250 RF chip
V3GPA 0.9 ~ 3.4 (0.1V/step) 800 3G power amplifier
wa K

1. Processor power, VPROC


VPROC is a high-current buck converter to provide a highly-efficient power supply for the handset
@ TE

processor. Powering from a Li-ion battery, VPROC steps down the input voltage from 3.4 ~ 4.3V
to the typical output voltage of 1.2V with a maximum load current capability of 1.2A. The output
voltage can be adjusted between 0.7V and 1.3V. In order to optimize the overall system efficiency
for the processor, VPROC features a Dynamic Voltage Frequency Scaling (DVFS) function which
xin IA

allows it to dynamically adjust its output voltage between 0.9V and 1.2V under different voltage
supply demands from the processor. For more details, refer to the “Dynamic Voltage Frequency
Scaling (DVFS)” section.
zli ED

2. Digital CORE power, VCORE


VCORE is a high-current buck converter to provide a highly-efficient power supply for the handset
digital core. Powering from a Li-ion battery, VCORE steps down the input voltage from 3.4 ~ 4.3V
M

to the typical output voltage of 1.1V with a maximum load current capability of 1.0A. The output
voltage can be adjusted between 0.7V and 1.3V. In order to optimize the overall system efficiency
for digital core, VCORE features a Dynamic Voltage Frequency Scaling (DVFS) function which
allows it to dynamically adjust its output voltage between 0.9V and 1.1V under different voltage
supply demands from the digital core circuit. For more details, refer to the “Dynamic Voltage
Frequency Scaling (DVFS)” section.
R
FO

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3. IO & memory power, VIO18

EO
VIO18 is a high-current buck converter to provide a highly-efficient power supply for the handset

US L
I/O power. Powering from a Li-ion battery, VIO18 steps down the input voltage from 3.4 ~ 4.3V to

cn IA
the typical output voltage of 1.8V with a maximum load current capability of 1.0A.

4. 3G PA power, VPA
VPA regulator is a DC-DC step-down converter which provides 0.9V to 3.4V programmable output

m. T
voltage (0.1V per step) and sources 800mA current at 3.4V and 150mA at 0.9V. In addition, its

.co EN
output voltage can be configured at 1.35V by register settings. It provide 600mA current at 1.35V
and 1.5V output voltage to support DDRIII applications.

5. RF power, VRF18

rld FID
VRF18 is a buck converter to provide a highly-efficient power supply for the handset RF power.
Powering from a Li-ion battery, VRF18 steps down the input voltage from 3.4 ~ 4.3V to the typical
output voltage of 1.825V with a maximum load current capability of 0.25A.
wo N
3.2.4 DVFS Control (Dynamic Voltage Frequency Scaling)
VCORE1, VPROC and VM12_INT have DVFS control respectively. There are two DVS modes: 1)
ter CO

One-shot mode: If DVFS is issued, the voltage will directly jump to the target one. 2) Soft-change
mode: If DVFS is issued, the voltage will be switched step by step. See the figure below for the
VCORE DVFS voltage control logic:

RG_VCORE_VOSEL_SFCHG_EN
wa K

Default:0
RG_VCORE_VOSEL

RG_VCORE_VOSEL 0
@ TE

0
1 QI_VCORE_VOSEL[4:0]
0 1
SOFT_CHG
RG_VCORE_VOSEL_CON1 1
RG_VCORE_CTRL
Default:0
xin IA

SRCLKEN

There are two control modes:


zli ED

1. Direct control by register (when @RG_VCORE_CTRL = 0)


2. Auto switch between normal operation mode and sleep mode voltage (when
@RG_VCORE_CTRL = 1)
M

See the figure below for the VPROC DVFS voltage control logic:
R
FO

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RG_VPROC_VOSEL_SFCHG_EN
Default:0

EO
RG_VPROC_VOSEL[4:0] 00
VPROC_VOSEL_PRE[4:0]

US L
01 0
VPROC_VOSEL_SRCLKEN1[4:0] 1 QI_VPROC_VOSEL[4:0]
1x 1
0
SOFT_CHG sfchg_out

cn IA
RG_VPROC_CTRL[1:0]
VPROC_VOSEL_SRCLKEN0[4:0] SRCLKEN
Default:2`b00

VPROC_VOSEL_DVS00[4:0] 00 1

m. T
VPROC_VOSEL_DVS01[4:0] 01

VPROC_VOSEL_DVS10[4:0] 10

.co EN
VPROC_VOSEL_DVS11[4:0] 11

DVS1/0

rld FID
There are three control modes:
1. Direct control by register (when @RG_VPROC_CTRL[1:0] = 00)
2. Auto switch between normal operation mode and sleep mode voltage (when
@RG_VPROC_CTRL[1:0] = 01)
3. Voltage control by dedicated pins DVS1 and DVS0. There are 4 dedicated registers for 4 DVS1,0
wo N
combinations. This mode enables fast voltage change to achieve better power and performance.
In addition, auto switch between normal operation and sleep mode voltage is still supported in the
ter CO

mode. (when @RG_VPROC_CTRL[1:0] = 1x)

See the figure below for the VM12_INT DVFS voltage control logic:

RG_VM12_INT_CAL_SFCHG_EN
wa K

Default:0
RG_VM12_INT_CAL[4:0] 0
0
1 QI_VM12_INT_CAL[4:0]
@ TE

VM12_INT_SLEEP[4:0] 0 SOFT CHG 1

VPROC_VOSEL[4:0] 0 1
VM12_INT_CTRL_SEL
VM12_INT_LOW_BOUND[4:0] 1 Default :0

SRCLKEN
xin IA

VPROC_VOSEL[4:0] <=
zli ED

There are two control modes:


1. Direct control by register (when @RG_VM12_INT_CTRL_SEL = 0)
2. Auto switch between normal operation mode and sleep mode voltage (when @
RG_VM12_INT_CTRL_SEL = 1). Note that due to VM12_INT is for CPU internal SRAM power
M

which needs to track the VPROC voltage, the hardware auto tracking logic is implemented in this
mode. However, it has lower bound during operation to achieve normally access, there is
hardware auto low-voltage limit for this control logic.
R
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3.2.5 Low Dropout Regulator (LDOs) and Reference

EO
MT6329 integrates 21 LDOs optimized for their given functions by balancing quiescent current,

US L
dropout voltage, line/load regulation, ripple rejection and output noise.

cn IA
A low-dropout regulator (LDO) is capable of maintaining its specified output voltage over a wide range
of load current and input voltage, down to a very small difference between input and output voltages.

m. T
There are several features in the design of LDO, including discharge control, soft start and current
limit. Before LDO is enabled, the output pin of LDO should be discharged first to avoid voltage

.co EN
accumulation on the capacitance. Soft-start limits inrush current and controls output-voltage rise time
during power-up. Current limit is the current protection to limit LDO’s output current and power
dissipation.

rld FID
There are three types of LDOs in the MT6329 PMIC. The analog LDO is optimized for low-frequency
ripple rejection in order to reject the ripple coming from the burst of RF power amplifier. The digital IO
LDO is a linear regulator optimized for very low quiescent current. The single-step RTC LDO is a
linear regulator that can charge up a capacitor-type backup coin cell, which also supplies the RTC
module even at the absence of the main battery. The single-step LDO features the reverse current
wo N

protection and is optimized for ultra-low quiescent current while sustaining the RTC function as long
as possible.
ter CO

AVDD43_VXX

Current
wa K

Limit
VREF
@ TE

VOUT VOUT

R1
VOUT
xin IA

Discharge
R2 Control
zli ED

GND

Figure 6: LDO block diagram


M

Table 11: LDO types and brief specifications

Type LDO name Vout (Volt) Imax (mA) Application


ALDO VRF/VRF28 2.85 200 RF chip
ALDO VTCXO 2.8 40 13/26 MHz reference clock
R
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Type LDO name Vout (Volt) Imax (mA) Application


ALDO VA1 1.8/2.0/2.1/2.5 100 Analog baseband

EO
US L
ALDO VA2 2.5/2.8 100 Analog baseband
ALDO VCAMA 1.5/1.8/2.5/2.8 200 Analog power for camera module

cn IA
DLDO VM12_1 1.2 300 DRAM
DLDO VM12_2 1.2/1.1/1.0/0.9 300 DRAM or AST3001
DLDO VM12_INT 1.2 360 SRAM

m. T
DLDO VIO28 2.8 100 Digital IO
DLDO VSIM1 1.8/3.0 100 1st SIM card

.co EN
1.3/1.5/1.8/2.5
DLDO VSIM2 100 2nd SIM card
2.8/3.0/3.3
DLDO VUSB 3.3 100 USB
1.3/1.5/1.8/2.5
DLDO VCAMD 300 Digital power for camera module

DLDO
rld FID
VCAM_IO
2.8/3.0/3.3
1.3/1.5/1.8/2.5
2.8/3.0/3.3
100 IO power for camera module

1.3/1.5/1.8/2.5
DLDO VCAM_AF 200 Auto-focus power for camera module
2.8/3.0/3.3
wo N
1.3/1.5/1.8/2.5
DLDO VMC 200 Memory card
2.8/3.0/3.3
1.3/1.5/1.8/2.5
ter CO

DLDO VMCH 400 SD3.0 memory card


2.8/3.0/3.3
1.3/1.5/1.8/2.5
DLDO VGP1 100 1st general-purpose LDO
2.8/3.0/3.3
1.3/1.5/1.8/2.5
DLDO VGP2 100 2nd general-purpose LDO
2.8/3.0/3.3
wa K

1.3/1.5/1.8/2.5
DLDO VIBR 200 Vibrator
2.8/3.0/3.3
@ TE

RTCLDO VRTC 1.8/2.0/2.1/2.8 2 Real-time clock

1. Digital IO LDO (VIO28)


The digital IO LDO is a regulator that sources 100 mA (max.) with fixed 2.8V output voltage. The
xin IA

LDO supplies the BB circuitry in the handset and is optimized for a very low quiescent current.
The VIO28 LDO is powered on as soon as the system enters the switched-on/stand-by mode.
Besides, the output voltage/current will fold-back as over-current/hard-short occurs.
zli ED

2. Digital camera LDO (VCAMD)


The digital camera LDO is a regulator that sources 300 mA (max.) with programmable output
voltage. The LDO supplies the camera circuitry in the handset and is optimized for a low-
M

quiescent current. VCAMD LDO can be enabled through the I2C interface. Besides, the folded-
back OC protection is also available.

3. Digital camera auto focus LDO (VCAM_AF)


The digital camera auto focus LDO is a regulator that sources 200 mA (max.) with programmable
output voltage. The LDO supplies the camera auto focus circuitry in the handset and is optimized
R
FO

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for a low-quiescent current. VCAM_AF LDO can be enabled through the I2C interface. Besides,
the folded-back OC protection is also available.

EO
US L
4. Digital camera IO power LDO (VCAM_IO)

cn IA
The digital camera IO power LDO is a regulator that sources 100 mA (max.) with programmable
output voltage. The LDO supplies the camera IO circuitry in the handset and is optimized for a
low-quiescent current. VCAM_IO LDO can be enabled through the I2C interface. Besides, the
folded-back OC protection is also available.

m. T
.co EN
5. Vibrator power LDO (VIBR)
The vibrator power LDO is a regulator that sources 200 mA (max.) with programmable output
voltage. The LDO supplies the vibrator circuitry in the handset and is optimized for a low-
quiescent current. VIBR LDO can be enabled through the I2C interface. Besides, the folded-back

rld FID
OC protection is also available.

6. Memory card power LDO (VMC)


The memory card power LDO is a regulator that sources 200 mA (max.) with programmable
output voltage. The LDO supplies the memory card circuitry in the handset and is optimized for a
wo N
low-quiescent current. VMC LDO can be enabled through the I2C interface. Besides, the folded-
back OC protection is also available.
ter CO

7. SD3.0 memory card power LDO (VMCH)


The SD3.0 memory card power LDO is a regulator that sources 400 mA (max.) with
programmable output voltage. The LDO supplies the SD3.0 memory card circuitry in the handset
and is optimized for a low-quiescent current. VMCH LDO can be enabled through the I2C
wa K

interface. Besides, the folded-back OC protection is also available.


@ TE

8. SIM LDO (VSIM1)


The SIM LDO is a regulator that sources 100 mA (max.) with 1.8 V or 3.0 V output voltages based
on the supply specs of subscriber identity module (SIM) card. The VSIM1 LDO supplies the SIMs
in the handset and is controlled independently of the other LDOs. Besides, the folded-back OC
xin IA

protection is also available.

9. 2nd SIM LDO (VSIM2)


zli ED

The SIM LDO is a regulator that sources 100 mA (max.) with programmable output voltages
based on the supply specs of subscriber identity module (SIM) card. The VSIM2 LDO supplies the
second SIM card in the handset and is controlled independently of the other LDOs. Besides, the
folded-back OC protection is also available.
M

10. Memory 1.2V LDO (VM12_1)


The memory 1.2V LDO is a regulator that sources 300 mA (max.) with fixed 1.2V output voltage.
The LDO supplies 1.2V to memory circuitry in the handset and is optimized for a low-quiescent
current. The VM12_1 LDO can be enabled through the I2C interface. Besides, the folded-back
OC protection is also available.
R
FO

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11. Reserve 1.2V power LDO (VM12_2)

EO
The reserved 1.2V power LDO is a regulator that sources 300 mA (max.) with programmable

US L
output voltage. The LDO supplies the reserved 1.2V power for AST3001 core circuitry in the

cn IA
handset and is optimized for a low-quiescent current. VM12_2 LDO can be enabled through the
I2C interface. Besides, the folded-back OC protection is also available.

12. SRAM 1.2V power LDO (VM12_INT)

m. T
The SRAM 1.2V power LDO is a regulator that sources 360 mA (max.) with programmable output

.co EN
voltage. The LDO supplies the SRAM circuitry in the handset and is optimized for a low-quiescent
current. VM12_INT LDO can be enabled through the I2C interface. Besides, the folded-back OC
protection is also available.

rld FID
13. Analog camera LDO (VCAMA)
The analog camera LDO is a regulator that sources 200 mA (max.) with programmable
1.5/1.8/2.5/2.8V output voltage. The LDO supplies the camera circuitry in the handset and is
optimized for a very low frequency ripple rejection in order to reject the ripple coming from the
burst of RF power amplifier at 217 Hz. VCAMA LDO can be enabled through the I2C interface.
wo N
Besides, the folded-back OC protection is also available.
ter CO

14. Analog LDO (VA1)


The analog LDO is a regulator that sources 200 mA (max.) with fixed 2.5V output voltage. The
LDO supplies the analog sections of the BB chipsets and is optimized for low-frequency ripple
rejection in order to reject the ripple coming from the burst of RF power amplifier at 217 Hz. VA
LDO is powered on as soon as the system enters the switched-on/stand-by mode. Besides, the
wa K

output voltage/current will fold-back as over-current/hard-short occurs.


@ TE

15. Analog LDO (VA2)


The analog LDO2 is a regulator that sources 100 mA (max.) with fixed 2.5V output voltage. The
LDO supplies the analog sections of the BB chipsets and is optimized for low-frequency ripple
rejection in order to reject the ripple coming from the burst of RF power amplifier at 217 Hz. VA2
xin IA

LDO is powered on as soon as the system enters the switched-on/stand-by mode. Besides, the
output voltage/current will fold-back as over-current/hard-short occurs.
zli ED

16. TCXO LDO (VTCXO)


TCXO LDO is a regulator that sources 40 mA (max.) with a 2.8V output voltage. The LDO supplies the
temperature compensated crystal oscillator, which needs its own ultra-low noise supply and very good
ripple rejection ratio.
M

17. RF LDO (VRF)


The analog LDO is a regulator that sources 200 mA (max.) with fixed 2.85V output voltage. The
LDO supplies the RF circuitry in the handset and is optimized for low-frequency ripple rejection in
order to reject the ripple coming from the burst of RF power amplifier at 217 Hz.
R
FO

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18. General-purpose LDO (VGP1)


The general-purpose LDO is a regulator that sources 100 mA (max.) with programmable output

EO
voltage. The LDO supplies the camera circuitry in the handset and is optimized for a very low

US L
quiescent current. VGP LDO can be enabled through the I2C interface. Besides, the folded-back

cn IA
OC protection is also available.

19. General-purpose LDO2 (VGP2)


The general-purpose LDO2 is a regulator that sources 100 mA (max.) with programmable output

m. T
voltage. The LDO supplies the camera circuitry in the handset and is optimized for a very low

.co EN
quiescent current. VGP2 LDO can be enabled through the I2C interface. Besides, the folded-back
OC protection is also available.

20. USB LDO (VUSB)

rld FID
The digital IO LDO is a regulator that sources 100 mA (max.) with fixed 3.3V output voltage. The
LDO supplies the BB circuitry in the handset and is optimized for a very low quiescent current.
VIO LDO is powered on as soon as the system enters the switched-on/stand-by mode. Besides,
the output voltage/current will fold-back as over-current/hard-short occurs.
wo N
21. RTC LDO (VRTC)
PMIC features a 2-step RTC that keeps RTC alive for a long time after the battery has been
ter CO

removed. The first LDO charges a backup battery on the BAT_BACKUP pin to ~ 2.8V. In addition,
when the battery is removed, the first stage prevents the backup battery from leaking back to
VBAT. The second LDO regulates the 2.8V supply to a 1.5V/1.2V optional RTC voltage. The RTC
voltage can be set by the VCORE_SEL pin while BB is alive. The setting is retained while BB is
powered down. When the backup battery is fully charged, the high backup battery voltage, low
wa K

reverse current leakage and the low second LDO operating current sustain the RTC block for
even tens of hours with the absence of the main battery.
@ TE

22. Reference voltage output (VREF)


The reference voltage output is a low-noise, high-PSRR and high-precision reference with a
guaranteed accuracy of 1.5% over temperature. The output is used as the system’s reference for
xin IA

MT6329 internally. For accurate regulator and charger output voltage, DO NOT load the reference
voltage. Bypass it to GND with a minimum 100nF external capacitor.
zli ED

3.2.6 Drivers
MT6329 supports backlight LED drivers both in parallel and in series configurations by pin sharing
ISINK and boost controller circuits. Besides, it provides the drivers for keypad LED and Flash light
M

LED. The following two figures depict two major applications for backlight LEDs and other drivers.
R
FO

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VBAT

EO
US L
cn IA
m. T
ISINK0

.co EN
ISINK1

ISINK2
ISINK3
ISINK4

rld FID
Dimming Controlled
By PWM1,2 or 3
ISINK5

Figure 7: Configuration for parallel BL LED drivers


wo N
ter CO
wa K
@ TE
xin IA
zli ED

Figure 8: Configuration for serial BL LED drivers


M

3.2.6.1 Backlight (B.L.) LED Driver


For parallel configuration, MT6329 supports up to 6 LEDs in parallel with 6-step programmable
current in each channel. The B.L. LEDs are supplied by the battery voltage. The LED current are
R
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controlled by the current sinks in MT6329. The brightness of the B.L. LEDs can be controlled by
tuning the current for current sinks or switching on/off the current sinks through dimming control. The

EO
dimming frequency and duty can be programmed by registers through the I2C interface. For more

US L
details, refer to the “Dimming Control” section.

cn IA
For series configuration, MT6329 internal boost controller supports 20mA for up to 10 LEDs in series.
External ballast resistor is necessary and serially connected between the LED string and ground. The
voltage across the external ballast resistor is used to feedback the BL LED current information to the

m. T
boost controller of MT6329. The BL LED current is regulated by the negative feedback loop formed in

.co EN
the boost controller. In addition, the brightness of the B.L. LEDs can be controlled by changing the
external ballast resistors, tuning the feedback voltage (analog dimming) or switching on/off the boost
controller through dimming control (digital dimming). The analog/digital dimming selection, dimming
frequency and duty can be programmed by registers through the I2C interface. For more details on

rld FID
digital dimming, refer to the “Dimming Control” section.

3.2.6.2 Flash Light LED Driver


The flash light LED driver is a low Ron switch which allows up to 500mA current. The brightness of the
wo N
flash light LED can be controlled by changing the external series ballast resistor.
ter CO

FLASH DRIVER
wa K

RG_FLASH_EN PAD_FLASH
@ TE

RG_FLASH_STEP[2:0]
xin IA

Figure 9: Configuration for flash light LED driver


zli ED

3.2.6.3 Keypad LED Driver


The keypad LED driver is a low Ron switch which allows up to 150mA current. The brightness of the
keypad LED can be controlled by changing the external series ballast resistor.
R M
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KPLED DRIVER

EO
US L
cn IA
RG_KPLED_EN PAD_KPLED

m. T
RG_KPLED_STEP[2:0]

.co EN
Figure 10: Configuration for KP LED driver

3.2.6.4 rld FID


Dimming Control
The intensity of the backlight WLED, flash light LED, keypad LED and vibrator can be adjusted by
dimming control. Although they can be controlled separately, the concepts are the same. It can be
wo N
controlled by programming some internal registers to change the on/offF pulse duty cycle and
frequency.
ter CO

3.2.6.4.1 Pulse Duty Cycle

For all drivers, the output duty cycle is adjusted by selecting the corresponding driver’s PWM_DUTY
value according to the following relationship:
wa K

(VIBR/KP/FLASH/BL) PWM duty cycle = (PWM_DUTY + 1) high’s , and 32 - (PWM_DUTY +1) low’s
@ TE

, where PWM_DUTY ranges from 0 to 31.


xin IA

3.2.6.4.2 Frequency

For all drivers, the output frequency is changed by adjusting the corresponding driver’s PWM_DIV
value according to the following relationship:
zli ED

(VIBR/KP/FLASH/BL) PWM frequency = 1.4M/25/(PWM_DIV + 1)/32

, where PWM_DIV ranges from 0 to15.


M

For FLASH/BL, the output frequency is changed by adjusting PWM_DIV and BYPASS. The output
frequency is governed by:

When bypass = 0,
(FLASH/BL) PWM frequency = 1.4M/25/(PWM_DIV + 1)/32
R
FO

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When bypass = 1,

EO
(FLASH/BL) PWM frequency = 1.4M/(PWM_DIV + 1)/32

US L
cn IA
, where PWM_DIV ranges from 0 to 15.

3.2.6.4.3 Summary

m. T
The features of each driver are listed in the table below. All drivers can be enabled, and their duty and

.co EN
frequency can be adjusted. For FLASH and BL, the fixed divisor, 25, can be bypassed.

Driver Enable Duty Div Bypass


VIBR ○ ○ ○

rld FID KP
FLASH
BL











wo N
3.2.7 Analog Switch
MT6239 has a built-in 2-to-1 analog switch with less than 3 ohm turn-on resistance supporting both
ter CO

microphone input and video line-out operation. THD is up to 70dB for microphone and good PSRR
which is around 75dB across the voice band. The low turn-on resistance ensures linearity of the video
playback.
wa K

3.2.8 Class-AB/D Audio Amplifier


@ TE

MT6329 has built-in dual channel high efficiency class AB/D audio power amplifier capable of
delivering 1 watt of power to an 8 ohm (each channel, stereo) BTL load and up to 2 watts onto parallel
equivalent 4-ohm load (mono in two channels) from a 4.2V battery supply. The THD performance is
74/76dB for class-D/AB mode respectively. The input must be AC-coupled. Over-current protection is
xin IA

integrated. MT6329 also has built-in receiver bypass function for 2-in-1 loudspeaker. This built–in
receiver bypass supports multi-purpose loudspeaker without any extra BOM cost. The output power
can reach 97mW onto 8 ohm speaker load. The block diagram is shown in Error! Reference source
zli ED

not found..
R M
FO

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Speaker Amplifier

EO
US L
Voice input
SPKL_P
-

cn IA
Class ABD
SPKL_N

Input MUX
Audio_L input +

m. T
SPKR_P
-
Audio_R input Class ABD

.co EN
SPKR_N
+

rld FID Figure 11: Block diagram of class-AB/D

3.2.9 Fuel Gauge


wo N
The fuel gauging system includes a dedicated ADC for Li-Ion battery current measurement and
utilizes the measurement ADC (AUXADC) for battery voltage and temperature measurement. The
ter CO

battery state-of-charge (SOC) estimation is performed by the software using the three measuring
methods and the accumulated current measurement. The application diagram of the fuel gauging
system is shown in the figure below, where an external resistor is used to converter the current drawn
from the battery into a voltage which is then measured by FG ADC. The value of the external resistor
must be chosen so that the maximum current during charging or discharging will not cause ADC to
wa K

exceed its input voltage range.


@ TE

The principle of operation of the fuel gauge relies on a combination of Coulomb counting and light
load battery voltage measurement. Coulomb counting provides an estimate of the charge that has
been withdrawn or delivered to the battery, while battery voltage measurement proves a good
estimate of the battery SOC under low-load conditions. The battery voltage measurement
xin IA

compensates for error accumulation during the current integration inherent in Coulomb counting. The
hardware also includes necessary modes to allow for simultaneous current and voltage measurement
which can be utilized to estimate the battery impedance.
zli ED
R M
FO

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EO
US L
cn IA
m. T
.co EN
rld FID
wo N

Figure 12: Fuel gauge block diagram and external connection


ter CO

3.2.9.1 Over-Current and Interrupt


There are 7 groups of interrupts for MT6329 to inform BB IC:
wa K

1. Key pressed and released interrupt


@ TE

 PWRKEY: Interrupt is issued when PWRKEY is pressed (and released, set by the register).
After receiving the interrupt, the software will read the PWRKEY_DEB status to see if it is
pressed or released.
 HOMEKEY: Interrupt is issued when HOMEKEY is pressed (and released, set by the register).
xin IA

After receiving the interrupt, the software will read the HOMEKEY_DEB status to see if it is
pressed or released.
zli ED

2. Thermal interrupt
MT6329 issues THR_H interrupt for the software high power latch if PMIC die temperature is over
125c and issues THR_L for software latch release if PMIC die temperature goes from 125c back
to under 110c.
R M
FO

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EO
US L
cn IA
m. T
.co EN
rld FID
3. Charger related interrupt
There are several interrupts supported for charger control:
CHRDET
wo N
OV
WATCHDOG
ter CO

OTG_BVALID
VBATON_UNDET

4. Battery voltage/current H/L interrupt


There are two groups of VBAT detection interrupt.
wa K

1) VBAT detected by AUXADC


If VBAT is higher than the threshold specified by an register setting, the HIGHBATTERY
interrupt will be issued. If VBAT is lower than the threshold specified by another register
@ TE

setting, the LOWBATTERY interrupt will be issued.

2) VBAT detected by fuel gauge


xin IA

If VBAT is higher than the threshold specified by an register setting, the VBAT_H interrupt will
be issued. If VBAT is lower than the threshold specified by another register setting, the
VBAT_L interrupt will be issued.
zli ED

5. Speaker OC interrupt
MT6329 supports speaker OC interrupt generation which uses PWM detection method.
M

6. BUCK OC interrupt
MT6329 supports VPA and VRF18 OC interrupt generation which uses PWM detection method.

7. LDO OC interrupt
MT6329 supports LDO OC interrupt generation. It will be issued if any one of the LDOs has OC
condition.
R
FO

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MT6329 interrupt tables:

EO
US L
Module name Interrupt Signal Name enable status Level/Edge
STRUP PWRKEY_DEB_INT_FLAG RG_PWRKEY_INT_EN bank0, 0x16, bit 1 RG_PWRKEY_INT_STATUS bank0, 0x19, bit1 edge(rising & falling)
STRUP HOMEKEY_DEB_INT_FLAG RG_HOMEKEY_INT_EN bank0, 0x18, bit 5 RG_HOMEKEY_INT_STATUS bank0, 0x1B, bit5 edge(rising & falling)
STRUP THR_H_INT_FLAG RG_THR_H_INT_EN bank0, 0x16, bit 3 RG_THR_H_INT_STATUS bank0, 0x19, bit3 edge(rising)

cn IA
STRUP THR_L_INT_FLAG RG_THR_L_INT_EN bank0, 0x16, bit 2 RG_THR_L_INT_STATUS bank0, 0x19, bit2 edge(falling)
Charger CHRDET_INT_FLAG RG_CHRDET_INT_EN bank0, 0x16, bit 6 RG_CHRDET_INT_STATUS bank0, 0x19, bit6 edge(rising & falling)
Charger OV_INT_FLAG RG_OV_INT_EN bank0, 0x16, bit 7 RG_OV_INT_STATUS bank0, 0x19, bit7 edge(rising)
Charger WATCHDOG_INT_FLAG RG_WATCHDOG_INT_EN bank0, 0x16, bit 0 RG_WATCHDOG_INT_STATUS bank0, 0x19, bit0 level
Charger OTG_BVALID RG_BVALID_DET_INT_EN bank0, 0x16, bit 5 RG_BVALID_DET_INT_STATUS bank0, 0x19, bit5 level
Charger VBATON_UNDET RG_VBATON_UNDET_INT_EN bank0, 0x16, bit 4 RG_VBATON_UNDET_INT_STATUS bank0, 0x19, bit4 level

m. T
Auxadc HIGHBATTERY_INT_FLAG RG_HIGH_BAT_INT_EN bank0, 0x17, bit 5 RG_HIGH_BAT_INT_STATUS bank0, 0x1A, bit5 level
Auxadc LOWBATTERY_INT_FLAG RG_LOW_BAT_INT_EN bank0, 0x17, bit 4 RG_LOW_BAT_INT_STATUS bank0, 0x1A, bit4 level
FGADC VBAT_H_INT_FLAG RG_FG_BAT_H_INT_EN bank0, 0x17, bit 7 RG_FG_BAT_H_INT_STATUS bank0, 0x1A, bit7 level
FGADC VBAT_L_INT_FLAG RG_FG_BAT_L_INT_EN bank0, 0x17, bit 6 RG_FG_BAT_L_INT_STATUS bank0, 0x1A, bit6 level

.co EN
Speaker SPKR_D_OC_FLAG RG_SPKR_D_OC_INT_EN bank0, 0x17, bit 3 RG_SPKR_D_OC_INT_STATUS bank0, 0x1A, bit3 level
Speaker SPKL_D_OC_FLAG RG_SPKL_D_OC_INT_EN bank0, 0x17, bit 2 RG_SPKL_D_OC_INT_STATUS bank0, 0x1A, bit2 level
Speaker SPKR_AB_OC_FLAG RG_SPKR_AB_OC_INT_EN bank0, 0x17, bit 1 RG_SPKR_AB_OC_INT_STATUS bank0, 0x1A, bit1 level
Speaker SPKL_AB_OC_FLAG RG_SPKL_AB_OC_INT_EN bank0, 0x17, bit 0 RG_SPKL_AB_OC_INT_STATUS bank0, 0x1A, bit0 level
Regulator VRF18_OC_FLAG RG_VRF18_OC_INT_EN bank0, 0x18, bit 4 RG_VRF18_OC_INT_STATUS bank0, 0x1B, bit4 level
Regulator VPA_OC_FLAG RG_VPA_OC_INT_EN bank0, 0x18, bit 3 RG_VPA_OC_INT_STATUS bank0, 0x1B, bit3 level
Regulator LDO_OC_FLAG RG_LDO_OC_INT_EN bank0, 0x18, bit 2 RG_LDO_OC_INT_STATUS bank0, 0x1B, bit2 level

rld FID Interrupt Signal Name


PWRKEY_DEB_INT_FLAG
HOMEKEY_DEB_INT_FLAG
default en?
1
0
de-bounce time
50ms (in STRUP)
50ms (in STRUP)
Status Clear
Condition
Write 1 Clear
Write 1 Clear
THR_H_INT_FLAG 0 40ms (in STRUP) Write 1 Clear
THR_L_INT_FLAG 0 40ms (in STRUP) Write 1 Clear
CHRDET_INT_FLAG 1 50ms (in STRUP) Read Clear
OV_INT_FLAG 1 4us (in PCHR_DIG) Read Clear
wo N
WATCHDOG_INT_FLAG 1 No Write 1 Clear
OTG_BVALID 1 0/100/200/400us (in INT_CTRL) Write 1 Clear
VBATON_UNDET 1 4us (in PCHR_DIG) Write 1 Clear
HIGHBATTERY_INT_FLAG 0 V (in AUXADC) Write 1 Clear
ter CO

LOWBATTERY_INT_FLAG 0 V (in AUXADC) Write 1 Clear


VBAT_H_INT_FLAG 0 V (in FGADC) Write 1 Clear
VBAT_L_INT_FLAG 0 V (in FGADC) Write 1 Clear
SPKR_D_OC_FLAG 0 V (in SPK) Write 1 Clear
SPKL_D_OC_FLAG 0 V (in SPK) Write 1 Clear
SPKR_AB_OC_FLAG 0 V (in SPK) Write 1 Clear
SPKL_AB_OC_FLAG 0 V (in SPK) Write 1 Clear
VRF18_OC_FLAG 0 PMW deb (in INT_CTRL) Write 1 Clear
VPA_OC_FLAG 0 PMW deb (in INT_CTRL) Write 1 Clear
100/200/400/800us
LDO_OC_FLAG 1 Write 1 Clear
wa K

(in INT_CTRL)
@ TE

3.2.9.2 Watchdog
Watchdog is used to monitor whether the baseband is still awake while charging. The user can set up
the time-out threshold by TIMEOUT_GEAR. They are 4s, 8s, 16s, and 32s respectively. The figure
xin IA

below is the state diagram of watchdog. Watchdog timer starts to count when the charger enabling
register is set. If the software does not write the specific register within designated time, the watchdog
will time out and issue interrupts. It means that the watchdog is also one type of interrupt source in
zli ED

addition to those described in 4.3.10.1. The software can select a proper time-out value by setting up
the time-out gear register. Like most of the interrupt mechanism mentioned above, the watchdog
interrupt is write-clear.
M

PMIC can start to charge only when the charger is detected, charger enabling register is set, and
watchdog is not timed-out. If one of the three conditions is false, the charging will be prohibited.
R
FO

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CHARGER related

EO
US L
Never write RG_WATCHDOG_INT_FLAG_STATUS within 4/8/16/32 sec
&& RG_CHR_EN =1
Watchdog: IDLE TIMEOUT

cn IA
Wr =1
ite US
R G_ TAT
W AT LA G_S
CH T _F
DO N
G_ G_I

m. T
INT DO
_FL A TCH
AG _ W
_ ST RG
AT
US INT

.co EN
Chr_en: rld FID IDLE
CHR_EN=1 && CHRDET=1 && no TIMEOUT

CHR_EN=0 || CHRDET=0 || TIMEOUT


CHARGING

Figure 13: Watchdog


wo N
ter CO

3.2.10 I2C Interface


PMIC uses a 2-wire interface consisting of a clock and data signals (SCL and SDA) to connect to BB.
This bi-directional serial bus interface allows BB to write commands to and read status from PMIC.
The SCL signal is driven by the master, whereas the SDA signal is bidirectional and can be driven by
wa K

either the master or slave.


@ TE

3.2.10.1 Write Sequence


I2C write cycle:
xin IA

Write Sequence
S Device R/W A Address A Data A P
Bit 7 … 1 0 7 … 0 7 … 0
zli ED

“S” is the start bit as defined in I2C spec. “Device” is the device ID, and our device ID is “1100000”.
R/W is read/write flag of the following byte. 1 means read, and 0 means write. “A” is the
acknowledgement bit. “P” is the stop bit. The number below the blue bar is the bit order. The device
M

has 7 bits from 7 to 1, and bit 0 is R/W. The “Address” and “Data” both have 8 bits. After the write
sequence, the data in “Data” will be written to address “Address”.

3.2.10.2 Read Sequence


I2C read cycle:
R
FO

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Read Sequence

EO
S Device R/W A Address A S Device R/W A Data A P

US L
Bit 7 … 1 0 7 … 0 7 … 1 0 7 … 0

cn IA
The write sequence has 3 byte of data, but the read sequence has 4 bytes. In the read sequence, the
device and R/W are sent twice, and R/W is 0 (write) at the first time and 1 (read) at the second time.
There are also two start bits. The second start bit means the device will be sent again, and the

m. T
read/write mode can be switched. The address is sent from the host, and the data will be given from

.co EN
the device.

3.2.10.1 Bank Address

Bank 0
rld FID
There are two register banks: bank 0 and bank 1

Device address[7:1] = 0110000


Includes top, startup, interrupt, pulse charger, Buck, analog LDO, digital LDO and AUXADC related
control settings.
wo N

Bank 1
ter CO

Device address[7:1] = 0110001


Includes test, driver, boost, speaker, analog switch, fuel gauge, OTP and I2C related control settings.

3.2.10.2 Timing Constraint


wa K

tF tR
@ TE

All signal

tHD tSU tHIGH


xin IA

SCL
zli ED

SDA

tLOW
M

Constraint Min. Max. Description


tF 25ns 100ns Fall time
tR 25ns 100ns Rise time
tHD 100ns - Hold time of SDA to SCL
R
FO

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Constraint Min. Max. Description


tSU 100ns - Setup time of SDA to SCL

EO
US L
tHIGH 100ns - Period when SCL is high
tLOW 100ns - Period when SCL is low

cn IA
3.2.10.3 Example

m. T
(1) MTK’s register write protocol
SCL …… ……

.co EN
SDA …… ……
Slave Slave Slave
START DEV[7:1] W ADDR[7:0] DATA[7:0] STOP
ack ack ack

(2) MTK’s register read protocol

rld FID
wo N
ter CO

3.2.10.4 Related Registers


SCL and SDA can be pulled high optionally by I2C_PULL_HIGH_B. If the master in baseband forces
wa K

to send 1 through SCL and SDA to slave, the slave can set I2C_PULL_HIGH_B to 1 (not pull high
internally) to save power. If the master only pulls SCL and SDA high internally, I2C_PULL_HIGH_B
@ TE

must be set to 0 to meet the I2C protocol.

3.3 Register Table and Descriptions


xin IA

3.3.1 Bank 0
zli ED

Address Name Widt Register Function


h
M

Charger Control Register 0


21 CHR_CON0 8
Set this register for PMIC Charger circuit configuration controls.
22 CHR_CON1 8 Charger Control Register 1
Charger Control Register 2
23 CHR_CON2 8
Set this register for PMIC Charger circuit configuration controls.
24 CHR_CON3 8 Charger Control Register 3
25 CHR_CON4 8 Charger Control Register 4
R
FO

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EO
Set this register for PMIC Charger circuit configuration controls.

US L
Charger Control Register 6
27 CHR_CON6 8
Set this register for PMIC Charger circuit configuration controls.

cn IA
28 CHR_CON7 8 Charger Control Register 7
Charger Control Register 10
2B CHR_CONA 8
Set this register for PMIC Charger circuit configuration controls.
2E CHR_COND 8 Charger Control Register 13

m. T
30 CHR_CONF 8 Charger Control Register 15
44 VPROC_CON5 8 VPROC Control Register 5

.co EN
45 VPROC_CON6 8 VPROC Control Register 6
47 VPROC_CON8 8 VPROC Control Register 8
48 VPROC_CON9 8 VPROC Control Register 9
49 VPROC_CONA 8 VPROC Control Register A
4A
4B
57
rld FID
VPROC_CONB
VPROC_CONC
VCORE_CON5
8
8
8
VPROC Control Register B
VPROC Control Register C
VCORE Control Register 5
59 VCORE_CON7 8 VCORE Control Register 7
60 VRF18_CON3 8 VRF18 Control Register 3
wo N

73 VPA_CON3 8 VPA Control Register 3


75 VPA_CON5 8 VPA Control Register 5
ter CO

76 VPA_CON6 8 VPA Control Register 6


77 VPA_CON7 8 VPA Control Register 7
78 VPA_CON8 8 VPA Control Register 8
79 VPA_CON9 8 VPA Control Register 9
7A VPA_CONA 8 VPA Control Register A
wa K

7B VPA_CONB 8 VPA Control Register B


7C VPA_CONC 8 VPA Control Register C
@ TE

7D VPA_COND 8 VPA Control Register D


7E VPA_CONE 8 VPA Control Register E
7F VPA_CONF 8 VPA Control Register F
83 DIGLDO_CON1 8 Digital LDO Control Register 1
xin IA

87 DIGLDO_CON5 8 Digital LDO Control Register 5


95 DIGLDO_CON13 8 Digital LDO Control Register 13
98 DIGLDO_CON16 8 Digital LDO Control Register 16
zli ED

9E DIGLDO_CON1C 8 Digital LDO Control Register 1C


A1 DIGLDO_CON1F 8 Digital LDO Control Register 1F
A4 DIGLDO_CON22 8 Digital LDO Control Register 22
A7 DIGLDO_CON25 8 Digital LDO Control Register 25
M

AB DIGLDO_CON29 8 Digital LDO Control Register 29


AF DIGLDO_CON2D 8 Digital LDO Control Register 2D
B2 DIGLDO_CON30 8 Digital LDO Control Register 30
B5 DIGLDO_CON33 8 Digital LDO Control Register 33
B7 DIGLDO_CON35 8 Digital LDO Control Register 35
B8 DIGLDO_CON36 8 Digital LDO Control Register 36
BA DIGLDO_RSV 8 Reserved register
R
FO

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EO
BE ANALDO_CON1 8 Analog LDO Control Register 1

US L
C1 ANALDO_CON4 8 Analog LDO Control Register 4
C8 ANALDO_CONB 8 Analog LDO Control Register B

cn IA
CB ANALDO_CONE 8 Analog LDO Control Register E
D0 ANALDO_CON13 8 Analog LDO Control Register 13
DA AUXADC_CON0 8 AUXADC Control Register 0

m. T
DB AUXADC_CON1 8 AUXADC Control Register 1
DC AUXADC_CON2 8 AUXADC Control Register 2

.co EN
DD AUXADC_CON3 8 AUXADC Control Register 3
DE AUXADC_CON4 8 AUXADC Control Register 4
DF AUXADC_CON5 8 AUXADC Control Register 5
E0 AUXADC_CON6 8 AUXADC Control Register 6
E1
E2
E3
rld FID
AUXADC_CON7
AUXADC_CON8
AUXADC_CON9
8
8
8
AUXADC Control Register 7
AUXADC Control Register 8
AUXADC Control Register 9
E6 AUXADC_CON12 8 AUXADC Control Register 12
E7 AUXADC_CON13 8 AUXADC Control Register 13
wo N
E8 AUXADC_CON14 8 AUXADC Control Register 14
ter CO

Charger Control
21 CHR_CON0 01
Register 0
Bit 7 6 5 4 3 2 1 0
VCDT_HV CSDAC_E CHR_LD VCDT_HV
Name CHRDET CHR_EN
wa K

_DET N O_DET _EN


Type RO RO RW RW RO RW
Reset 0 0 0 0 0 1
@ TE

Bit(s) Mnemonic Name Description


Charger-in high voltage detection (with de-bounce).
VCDT_HV_
7 VCDT_HV_DET 0: charge-in voltage < VCDT_HV_VTH
DET
1: charge-in voltage > VCDT_HV_VTH
xin IA

5 CHRDET CHRDET Charger-in detect.


Charger enable setting, which would gated CSDAC_EN & PCHR_AUTO
4 CHR_EN CHR_EN
& charger watch-dog timer
zli ED

3 CSDAC_EN CSDAC_EN CS DAC enable.


CHR_LDO_
1 CHR_LDO_DET Charger LDO Detect. If not detect, PCHR won't work
DET
Charger-in high voltage detection comparator enable.
VCDT_HV_
0 VCDT_HV_EN 0: disable. Only compare LV threshold
EN
M

1: enable. Compare both LV and HV threshold

Charger Control
22 CHR_CON1 F2
Register 1
Bit 7 6 5 4 3 2 1 0
Name VCDT_HV_VTH
R
FO

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Charger Control
22 CHR_CON1 F2

EO
Register 1

US L
Type RW
Reset 1 1 1 1

cn IA
Bit(s) Mnemonic Name Description
Charger-in high voltage detection vth.
VCDT_HV_ 0000~1000: 4.2V~4.6V with 50mV/step
7:4 VCDT_HV_VTH

m. T
VTH 1001~1100: 6V~7.5V with 500mV/step
1101~1111: 8.5V~10.5V with 1000mV/step

.co EN
Charger Control
23 CHR_CON2 04
Register 2
Bit
Name
Type
rld FID 7
VBAT_CC
_DET
RO
VBAT_CV
_DET
RO
6 5
CS_DET
RO
4 3
CS_EN
RW
2 1
VBAT_CV
_EN
RW
0

Reset 0 0 0 0 0
wo N
Bit(s) Mnemonic Name Description
VBAT voltage detection for CC.
VBAT_CC_
7 VBAT_CC_DET
ter CO

DET 0: VBAT voltage < VBAT_CC_VTH


1: VBAT voltage > VBAT_CC_VTH
VBAT voltage detection for CV.
VBAT_CV_
6 VBAT_CV_DET 0: VBAT voltage < VBAT_CV_VTH
DET
1: VBAT voltage > VBAT_CV_VTH
Current sense voltage detection.
5 CS_DET CS_DET 0: CS voltage < CS_VTH
wa K

1: CS voltage > CS_VTH


3 CS_EN CS_EN Current sense voltage detection comparator enable.
VBAT_CV_
@ TE

1 VBAT_CV_EN Battery CV detection enable (0: disable, 1: enable)


EN
xin IA

Charger Control
24 CHR_CON3 80
Register 3
Bit 7 6 5 4 3 2 1 0
Name VBAT_CV_VTH
zli ED

Type RW
Reset 0 0 0 0 0

Bit(s) Mnemonic Name Description


M

Battery CV dection threshold trimming option, default 4.2V


this register is used for FT CV threshold trimming and not for customer's fine
tuning (pchr_dig should invert MSB bit. otherwise, BC1.1 2.2V threshold
VBAT_CV_ would be wrong)
4:0 VBAT_CV_VTH
VTH 10000~11111: 4.0000V~4.1875V with 12.5mV/step
00000~00111: 4.2000V~4.2875V with 12.5mV/step
01000~01110: 4.2000V~4.2750V with 12.5mV/step
01111: 2.2V (used in BC1.1 application)
R
FO

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EO
Charger Control
25 CHR_CON4 0F

US L
Register 4
Bit 7 6 5 4 3 2 1 0

cn IA
Name CS_VTH
Type RW
Reset 1 1 1 1

m. T
Bit(s) Mnemonic Name Description
Current sense voltage detection threshold @ Rcs=0.2ohm

.co EN
1111: 70mA
1110: 200mA
1101: 400mA
1100: 450mA
1011: 550mA
1010: 650mA

3:0
rld FID
CS_VTH CS_VTH
1001:
1000:
0111:
0110:
0101:
700mA
800mA
900mA
1000mA
1100mA
0100: 1200mA
0011: 1300mA
0010: 1400mA
wo N
0001: 1500mA
0000: 1600mA
ter CO

Charger Control
27 CHR_CON6 07
Register 6
Bit 7 6 5 4 3 2 1 0
VBAT_OV VBAT_OV VBAT_OV
wa K

Name VBAT_OV_VTH
_DET _DEG _EN
Type RO RW RW RW
Reset 0 0 1 1 1
@ TE

Bit(s) Mnemonic Name Description


VBAT_OV voltage detection.
VBAT_OV_
6 VBAT_OV_DET 0: VBAT voltage < VBAT_OV_VTH
xin IA

DET
1: VBAT voltage > VBAT_OV_VTH
VBAT OV voltage detection deglitch enable.
VBAT_OV_
5 VBAT_OV_DEG 0: no debounce
DEG
1: debounce one cycle (1us)
zli ED

VBAT OV voltage detection threshold


VBAT_OV_ 00: 4.300V
2:1 VBAT_OV_VTH 01: 4.350V
VTH
10: 4.375V
11: 4.115V
M

VBAT_OV_
0 VBAT_OV_EN VBAT OV over-voltage detection comparator enable.
EN

Charger Control
28 CHR_CON7 02
Register 7
Bit 7 6 5 4 3 2 1 0
R
FO

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Charger Control
28 CHR_CON7 02

EO
Register 7

US L
BATON_U BATON_H BATON_E
Name NDET T_EN N
Type RO RW RW

cn IA
Reset 0 0 1

Bit(s) Mnemonic Name Description

m. T
BATON_UNDET voltage detection. BATON_UNDET always is 0 during
BATON_UN DDLO/UVLO
7 BATON_UNDET
DET 0 Battery is OK

.co EN
1 Battery is Fail
BATON_HT
2 BATON_HT_EN Battery-On HW high temperature detection (1: enable, 0: disable)
_EN
BATON_UNDET detection enable.
1 BATON_EN BATON_EN 0 BATON_UNDET always = 0

rld FID 1 Compare enable

Charger Control
2B CHR_CONA 20
Register 10
wo N
Bit 7 6 5 4 3 2 1 0
OTG_BVA OTG_BVA
Name
ter CO

LID LID_EN
Type RO RW
Reset 0 1

Bit(s) Mnemonic Name Description


Indicates if the session for B-peripheral is valid (0.8V<Vth<4V). Here
wa K

OTG_BVAL VBUS is connected to CHRIN.


6 OTG_BVALID
ID 0: Vbus < 0.8V
1: Vbus > 4V
@ TE

OTG_BVAL
5 OTG_BVALID_EN BVALID detect enable.
ID_EN
xin IA

Charger Control
2E CHR_COND 10
Register 13
Bit 7 6 5 4 3 2 1 0
CHRWDT
zli ED

Name CHRWDT_TD
_EN
Type RW RW
Reset 1 0 0 0 0

Bit(s) Mnemonic Name Description


M

Enable setting for charger watch-dog timer


0: disable
CHRWDT_ 1: enable if (CHR_EN(@CHR_CON0) == 1)
4 CHRWDT_EN
EN Note1: UVLO don't care this bit and will timeout after 3000s
Note2: PCHR_TESTMODE can force to control watch-dog enable by using
this bit
CHRWDT_ Time constant setting for charger watch-dog timer
3:0 CHRWDT_TD
TD b0000: 4 sec
R
FO

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Bit(s) Mnemonic Name Description


b0001: 8 sec

EO
b0010: 16 sec

US L
b0011: 32 sec
b0100: 128 sec
b0101: 256 sec

cn IA
b0110: 512 sec
b0111: 1024 sec
b1xxx: 3000 sec

m. T
Charger Control

.co EN
30 CHR_CONF 00
Register 15
Bit 7 6 5 4 3 2 1 0
CHRWDT
CHRWDT CHRWDT
Name _FLAG_W
_OUT _INT_EN
R
Type
Reset rld FID RO
0
RW
0
RW
0

Bit(s) Mnemonic Name Description


Time-out flag for charger watch-dog timer
wo N
Read:
CHRWDT_ 0: no time-out status
2 CHRWDT_OUT
OUT 1: has time-out status
Write:
ter CO

1: clear time-out status flag to 0


Time-out flag for charger watch-dog timer
Read:
CHRWDT_ CHRWDT_FLAG_ 0: no time-out status
1
FLAG_WR WR 1: has time-out status
Write:
1: clear time-out status flag to 0
wa K

CHRWDT_I
0 CHRWDT_INT_EN Interrupt enable setting for charger watch-dog timer.
NT_EN
@ TE

VPROC Control
44 VPROC_CON5 14
Register 5
xin IA

Bit 7 6 5 4 3 2 1 0
Name RG_VPROC_VOSEL
Type RW
Reset 1 0 1 0 0
zli ED

Bit(s) Mnemonic Name Description


Vout selection
(25mV/step)
M

00000: 0.700V
00001: 0.725V
00010: 0.750V
RG_VPRO RG_VPROC_VOSE 00011: 0.775V
4:0
C_VOSEL L 00100: 0.800V
00101: 0.825V
00110: 0.850V
00111: 0.875V
01000: 0.900V
01001: 0.925V
R
FO

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Bit(s) Mnemonic Name Description


01010: 0.950V

EO
01011: 0.975V

US L
01100: 1.000V
01101: 1.025V
01110: 1.050V

cn IA
01111: 1.075V
10000: 1.100V
10001: 1.125V
10010: 1.150V
10011: 1.175V

m. T
10100: 1.200V
10101: 1.225V
10110: 1.250V

.co EN
10111: 1.275V
11000: 1.300V
11001~11111: 1.300V

45

Bit
rld FID
7
VPROC_CON6

6 5 4
VPROC
Register 6
3
Control

2 1 0
14

Name VPROC_VOSEL_SRCLKEN0
Type RW
wo N
Reset 1 0 1 0 0

Bit(s) Mnemonic Name Description


ter CO

VPROC_VO VPROC voltage setting for SRCLKEN=0


VPROC_VOSEL_S
4:0 SEL_SRCL
RCLKEN0 The setting is the same as RG_VPROC_VOSEL
KEN0
wa K

VPROC Control
47 VPROC_CON8 14
Register 8
@ TE

Bit 7 6 5 4 3 2 1 0
Name VPROC_VOSEL_DVS00
Type RW
Reset 1 0 1 0 0
xin IA

Bit(s) Mnemonic Name Description


VPROC_VO VPROC voltage setting for DVS=00
VPROC_VOSEL_D
4:0 SEL_DVS0
VS00 The setting is the same as RG_VPROC_VOSEL
0
zli ED

VPROC Control
48 VPROC_CON9 14
M

Register 9
Bit 7 6 5 4 3 2 1 0
Name VPROC_VOSEL_DVS01
Type RW
Reset 1 0 1 0 0

Bit(s) Mnemonic Name Description


R
FO

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Bit(s) Mnemonic Name Description


VPROC_VO

EO
VPROC_VOSEL_D VPROC voltage setting for DVS=01
4:0 SEL_DVS0

US L
VS01 The setting is the same as RG_VPROC_VOSEL
1

cn IA
VPROC Control
49 VPROC_CONA 14
Register A

m. T
Bit 7 6 5 4 3 2 1 0
Name VPROC_VOSEL_DVS10

.co EN
Type RW
Reset 1 0 1 0 0

Bit(s) Mnemonic Name Description


VPROC_VO
4:0
rld FID
SEL_DVS1
0
VPROC_VOSEL_D
VS10
VPROC voltage setting for DVS=10
The setting is the same as RG_VPROC_VOSEL

VPROC Control
wo N
4A VPROC_CONB 14
Register B
Bit 7 6 5 4 3 2 1 0
ter CO

Name VPROC_VOSEL_DVS11
Type RW
Reset 1 0 1 0 0

Bit(s) Mnemonic Name Description


VPROC_VO VPROC voltage setting for DVS=11
VPROC_VOSEL_D
wa K

4:0 SEL_DVS1
VS11 The setting is the same as RG_VPROC_VOSEL
1
@ TE

VPROC Control
4B VPROC_CONC 00
Register C
xin IA

Bit 7 6 5 4 3 2 1 0
Name RG_VPROC_CTRL
Type RW
Reset 0 0
zli ED

Bit(s) Mnemonic Name Description


VPROC control
RG_VPRO 00: by SW RG_VPROC_VOSEL
1:0 RG_VPROC_CTRL
C_CTRL 01: Only by SRCLKEN
M

1x: Control by SRCLKEN and DVS1/0

VCORE Control
57 VCORE_CON5 10
Register 5
Bit 7 6 5 4 3 2 1 0
R
FO

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VCORE Control
57 VCORE_CON5 10

EO
Register 5

US L
Name RG_VCORE_VOSEL
Type RW
Reset 1 0 0 0 0

cn IA
Bit(s) Mnemonic Name Description
Vout selection

m. T
(25mV/step)
5'b00000: 0.700V
5'b00001: 0.725V

.co EN
5'b00010: 0.750V
5'b00011: 0.775V
5'b00100: 0.800V
5'b00101: 0.825V
5'b00110: 0.850V
5'b00111: 0.875V

rld FID 5'b01000:


5'b01001:
5'b01010:
5'b01011:
5'b01100:
0.900V
0.925V
0.950V
0.975V
1.000V
5'b01101: 1.025V
RG_VCOR RG_VCORE_VOSE 5'b01110: 1.050V
4:0
E_VOSEL L 5'b01111: 1.075V
wo N
5'b10000: 1.100V
5'b10001: 1.125V
5'b10010: 1.150V
ter CO

5'b10011: 1.175V
5'b10100: 1.200V
5'b10101: 1.225V
5'b10110: 1.250V
5'b10111: 1.275V
5'b11000: 1.300V
5'b11001: 1.300V
5'b11010: 1.300V
wa K

5'b11011: 1.300V
5'b11100: 1.300V
5'b11101: 1.300V
@ TE

5'b11110: 1.300V
5'b11111: 1.300V
xin IA

VCORE Control
59 VCORE_CON7 00
Register 7
Bit 7 6 5 4 3 2 1 0
RG_VCO
zli ED

Name RE_CTRL
Type RW
Reset 0

Bit(s) Mnemonic Name Description


M

VCORE control
RG_VCOR
0 RG_VCORE_CTRL 0: by SW RG_VCORE_VOSEL
E_CTRL
1: by SRCLKEN
R
FO

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VRF18 Control
60 VRF18_CON3 00

EO
Register 3

US L
Bit 7 6 5 4 3 2 1 0
RG_VRF1
Name 8_EN

cn IA
Type RW
Reset 0

Bit(s) Mnemonic Name Description

m. T
VRF18 enable
RG_VRF18
0 RG_VRF18_EN 1'b1: enable

.co EN
_EN
1'b0: disable

VPA Control
73

Bit
Name
rld FID 7
VPA_CON3

6 5 4
Register 3
3 2 1 0
RG_VPA_
00

EN
Type RW
Reset 0
wo N

Bit(s) Mnemonic Name Description


ter CO

VPA enable signal


RG_VPA_E
0 RG_VPA_EN 0: disable
N
1: enable
wa K

VPA Control
75 VPA_CON5 00
Register 5
@ TE

Bit 7 6 5 4 3 2 1 0
Name RG_VPA_VOSEL
Type RW
Reset 0 0 0 0 0
xin IA

Bit(s) Mnemonic Name Description


Vout selection
00000: 0.9V ~ 11001: 3.4V (100mV/step)
5'b00000: 0.9V
zli ED

5'b00001: 1.0V
5'b00010: 1.1V
5'b00011: 1.2V
5'b00100: 1.3V
5'b00101: 1.4V
RG_VPA_V 5'b00110: 1.5V
M

4:0 RG_VPA_VOSEL 5'b00111: 1.6V


OSEL
5'b01000: 1.7V
5'b01001: 1.8V
5'b01010: 1.9V
5'b01011: 2.0V
5'b01100: 2.1V
5'b01101: 2.2V
5'b01110: 2.3V
5'b01111: 2.4V
5'b10000: 2.5V
R
FO

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Bit(s) Mnemonic Name Description


5'b10001: 2.6V

EO
5'b10010: 2.7V

US L
5'b10011: 2.8V
5'b10100: 2.9V
5'b10101: 3.0V

cn IA
5'b10110: 3.1V
5'b10111: 3.2V
5'b11000: 3.3V
5'b11001: 3.4V
5'b11010~5'b11111: 3.4V

m. T
.co EN
VPA Control
76 VPA_CON6 00
Register 6
Bit 7 6 5 4 3 2 1 0
Name RG_PASEL_SET0
Type
Reset rld FID 0 0
RW
0 0 0

Bit(s) Mnemonic Name Description


RG_PASEL VPA voltage control with PASEL=000
4:0 RG_PASEL_SET0
wo N
_SET0 same as RG_VPA_VOSEL
ter CO

VPA Control
77 VPA_CON7 00
Register 7
Bit 7 6 5 4 3 2 1 0
Name RG_PASEL_SET1
Type RW
wa K

Reset 0 0 0 0 0
@ TE

Bit(s) Mnemonic Name Description


RG_PASEL VPA voltage control with PASEL=001
4:0 RG_PASEL_SET1
_SET1 same as RG_VPA_VOSEL
xin IA

VPA Control
78 VPA_CON8 00
Register 8
zli ED

Bit 7 6 5 4 3 2 1 0
Name RG_PASEL_SET2
Type RW
Reset 0 0 0 0 0
M

Bit(s) Mnemonic Name Description


RG_PASEL VPA voltage control with PASEL=010
4:0 RG_PASEL_SET2
_SET2 same as RG_VPA_VOSEL
R
FO

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VPA Control
79 VPA_CON9 00

EO
Register 9

US L
Bit 7 6 5 4 3 2 1 0
Name RG_PASEL_SET3
Type RW

cn IA
Reset 0 0 0 0 0

Bit(s) Mnemonic Name Description

m. T
RG_PASEL VPA voltage control with PASEL=011
4:0 RG_PASEL_SET3
_SET3 same as RG_VPA_VOSEL

.co EN
VPA Control
7A VPA_CONA 00
Register A
Bit
Name
Type
Reset
rld FID
7 6 5 4

0
3

0
RG_PASEL_SET4
RW
0
2 1

0
0

Bit(s) Mnemonic Name Description


wo N

RG_PASEL VPA voltage control with PASEL=100


4:0 RG_PASEL_SET4
_SET4 same as RG_VPA_VOSEL
ter CO

VPA Control
7B VPA_CONB 00
Register B
Bit 7 6 5 4 3 2 1 0
wa K

Name RG_PASEL_SET5
Type RW
Reset 0 0 0 0 0
@ TE

Bit(s) Mnemonic Name Description


RG_PASEL VPA voltage control with PASEL=101
4:0 RG_PASEL_SET5
_SET5 same as RG_VPA_VOSEL
xin IA

VPA Control
zli ED

7C VPA_CONC 00
Register C
Bit 7 6 5 4 3 2 1 0
Name RG_PASEL_SET6
Type RW
M

Reset 0 0 0 0 0

Bit(s) Mnemonic Name Description


RG_PASEL VPA voltage control with PASEL=110
4:0 RG_PASEL_SET6
_SET6 same as RG_VPA_VOSEL
R
FO

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VPA Control
7D VPA_COND 00

EO
Register D

US L
Bit 7 6 5 4 3 2 1 0
Name RG_PASEL_SET7
Type RW

cn IA
Reset 0 0 0 0 0

Bit(s) Mnemonic Name Description

m. T
RG_PASEL VPA voltage control with PASEL=111
4:0 RG_PASEL_SET7
_SET7 same as RG_VPA_VOSEL

.co EN
VPA Control
7E VPA_CONE 00
Register E
Bit

Name
rld FID 7

RG_VPA_RSV
6 5
RG_VPA_
VO_UP50
MV
4 3 2 1 0
RG_VPA_
CTRL
Type RW RW RW
Reset 0 0 0 0 0
wo N

Bit(s) Mnemonic Name Description


ter CO

RG_VPA_R
7:5 RG_VPA_RSV reserved
SV
Vout shift selection
RG_VPA_V RG_VPA_VO_UP50
4 0: no shift
O_UP50MV MV
1: shift up by 50mV
VPA control
RG_VPA_C
0 RG_VPA_CTRL 0: by SW RG_VPA_CAL
TRL
wa K

1: by PASEL2/1/0
@ TE

VPA Control
7F VPA_CONF 00
Register F
Bit 7 6 5 4 3 2 1 0
xin IA

Name QI_VPA_VOSEL
Type RO
Reset 0 0 0 0 0
zli ED

Bit(s) Mnemonic Name Description


4:0 QI_VPA_VOSEL
M

Digital LDO
83 DIGLDO_CON1 01
Control Register 1
Bit 7 6 5 4 3 2 1 0
QI_VM12_ VM12_1_
Name 1_EN EN
Type RO RW
Reset 0 1
R
FO

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Bit(s) Mnemonic Name Description

EO
US L
7 QI_VM12_1_EN LDO enable/disable status
VM12 enable
0 VM12_1_EN 1'b1: enable

cn IA
1'b0: disable

m. T
Digital LDO
87 DIGLDO_CON5 01
Control Register 5

.co EN
Bit 7 6 5 4 3 2 1 0
VM12_2_
Name EN
Type RW
Reset 1

Bit(s)
rld FID
Mnemonic Name Description
VM12_2 enable
0 VM12_2_EN 1'b1: enable
1'b0: disable
wo N
ter CO

Digital LDO
95 DIGLDO_CON13 Control Register 10
13
Bit 7 6 5 4 3 2 1 0
RG_VSIM RG_VSIM
Name _VOSEL _EN
wa K

Type RW RW
Reset 1 0
@ TE

Bit(s) Mnemonic Name Description


output selection signal
4 RG_VSIM_VOSEL (1'b0:1.8V)
1'b0: 1.8V
xin IA

1'b1: 3.0V
Enable
0 RG_VSIM_EN 1'b1: enable
1'b0: disable
zli ED

Digital LDO
98 DIGLDO_CON16 Control Register 50
M

16
Bit 7 6 5 4 3 2 1 0
RG_VSIM
Name RG_VSIM2_VOSEL
2_EN
Type RW RW
Reset 1 0 1 0
R
FO

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Bit(s) Mnemonic Name Description


output selection signal

EO
(3'b010:1.8V)

US L
3'b000: 1.3V
3'b001: 1.5V
3'b010: 1.8V

cn IA
6:4 RG_VSIM2_VOSEL
3'b011: 2.5V
3'b100: 2.8V
3'b101: 3.0V
3'b110: 3.3V
3'b111: 3.3V

m. T
Enable
0 RG_VSIM2_EN (1'b1: enable; 1'b0: disable)

.co EN
1'b1: enable
1'b0: disable

9E rld FID DIGLDO_CON1C


Digital
Control
1C
LDO
Register 10

Bit 7 6 5 4 3 2 1 0
RG_VCA
Name RG_VCAMD_VOSEL
MD_EN
wo N
Type RW RW
Reset 0 0 1 0
ter CO

Bit(s) Mnemonic Name Description


output selection signal
(3'b000:1.3V)
3'b000: 1.3V
3'b001: 1.5V
RG_VCAMD_VOSE 3'b010: 1.8V
6:4
wa K

L 3'b011: 2.5V
3'b100: 2.8V
3'b101: 3.0V
@ TE

3'b110: 3.3V
3'b111: 1.2V
Enable
0 RG_VCAMD_EN 1'b1: enable
1'b0: disable
xin IA

Digital LDO
zli ED

A1 DIGLDO_CON1F Control Register 20


1F
Bit 7 6 5 4 3 2 1 0
RG_VCA
Name RG_VCAM_IO_VOSEL
M_IO_EN
M

Type RW RW
Reset 0 1 0 0

Bit(s) Mnemonic Name Description


output selection signal
RG_VCAM_IO_VO (3'b010:1.8V)
6:4
SEL 3'b000: 1.3V
3'b001: 1.5V
R
FO

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Bit(s) Mnemonic Name Description


3'b010: 1.8V

EO
3'b011: 2.5V

US L
3'b100: 2.8V
3'b101: 3.0V
3'b110: 3.3V

cn IA
3'b111: 3.3V
Enable
0 RG_VCAM_IO_EN 1'b1: enable
1'b0: disable

m. T
.co EN
Digital LDO
A4 DIGLDO_CON22 Control Register 40
22
Bit 7 6 5 4 3 2 1 0
Name
Type
Reset
rld FID 1
RG_VCAM_AF_VOSEL
RW
0 0
RG_VCA
M_AF_EN
RW
0

Bit(s) Mnemonic Name Description


wo N
output selection signal
(3'b100:2.8V)
3'b000: 1.3V
ter CO

3'b001: 1.5V
RG_VCAM_AF_VO 3'b010: 1.8V
6:4
SEL 3'b011: 2.5V
3'b100: 2.8V
3'b101: 3.0V
3'b110: 3.3V
3'b111: 3.3V
wa K

Enable
0 RG_VCAM_AF_EN 1'b1: enable
1'b0: disable
@ TE

Digital LDO
A7 DIGLDO_CON25 Control Register 71
xin IA

25
Bit 7 6 5 4 3 2 1 0
RG_VMC
Name RG_VMC_VOSEL
zli ED

_EN
Type RW RW
Reset 1 1 1 1

Bit(s) Mnemonic Name Description


M

output selection signal


(3'b100:2.8V)
3'b000: 1.3V
3'b001: 1.5V
6:4 RG_VMC_VOSEL 3'b010: 1.8V
3'b011: 2.5V
3'b100: 2.8V
3'b101: 3.0V
3'b110: 3.3V
R
FO

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Bit(s) Mnemonic Name Description


3'b111: 3.3V

EO
VMC0 enable

US L
0 RG_VMC_EN 1'b1: enable
1'b0: disable

cn IA
Digital LDO

m. T
AB DIGLDO_CON29 Control Register 71
29

.co EN
Bit 7 6 5 4 3 2 1 0
RG_VMC
Name RG_VMCH_VOSEL
H_EN
Type RW RW
Reset 1 1 1 1

Bit(s) rld FID


Mnemonic Name Description
output selection signal
(3'b100:2.8V)
3'b000: 1.3V
3'b001: 1.5V
wo N
6:4 RG_VMCH_VOSEL 3'b010: 1.8V
3'b011: 2.5V
3'b100: 2.8V
3'b101: 3.0V
ter CO

3'b110: 3.3V
3'b111: 3.3V
VMC1 enable
0 RG_VMCH_EN 1'b1: enable
1'b0: disable
wa K

Digital LDO
@ TE

AF DIGLDO_CON2D Control Register 40


2D
Bit 7 6 5 4 3 2 1 0
RG_VGP_
Name RG_VGP_VOSEL
xin IA

EN
Type RW RW
Reset 1 0 0 0
zli ED

Bit(s) Mnemonic Name Description


output selection signal
(3'b100:2.8V)
3'b000: 1.3V
3'b001: 1.5V
M

6:4 RG_VGP_VOSEL 3'b010: 1.8V


3'b011: 2.5V
3'b100: 2.8V
3'b101: 3.0V
3'b110: 3.3V
3'b111: 3.3V
Enable
0 RG_VGP_EN 1'b1: enable
1'b0: disable
R
FO

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EO
US L
Digital LDO
B2 DIGLDO_CON30 Control Register 40

cn IA
30
Bit 7 6 5 4 3 2 1 0
RG_VGP2
Name RG_VGP2_VOSEL
_EN

m. T
Type RW RW
Reset 1 0 0 0

.co EN
Bit(s) Mnemonic Name Description
output selection signal
(3'b100:2.8V)
3'b000: 1.3V

6:4
rld FID RG_VGP2_VOSEL
3'b001:
3'b010:
3'b011:
3'b100:
3'b101:
1.5V
1.8V
2.5V
2.8V
3.0V
3'b110: 3.3V
3'b111: 3.3V
Enable
wo N
0 RG_VGP2_EN 1'b1: enable
1'b0: disable
ter CO

Digital LDO
B5 DIGLDO_CON33 Control Register 60
33
wa K

Bit 7 6 5 4 3 2 1 0
RG_VIBR
Name RG_VIBR_VOSEL
_EN
@ TE

Type RW RW
Reset 1 1 0 0

Bit(s) Mnemonic Name Description


xin IA

output selection signal


(3'b110:3.3V)
3'b000: 1.3V
3'b001: 1.5V
6:4 RG_VIBR_VOSEL 3'b010: 1.8V
zli ED

3'b011: 2.5V
3'b100: 2.8V
3'b101: 3.0V
3'b110: 3.3V
3'b111: 3.3V
Enable
M

0 RG_VIBR_EN 1'b1: enable


1'b0: disable
R
FO

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Digital LDO

EO
B7 DIGLDO_CON35 Control Register 00
35

US L
Bit 7 6 5 4 3 2 1 0
RO_QI_V RO_QI_V RO_QI_V

cn IA
RO_QI_V RO_QI_V RO_QI_V RO_QI_VI
M12_INT_ M12_2_O M12_1_O
Name USB_OC_ SIM2_OC SIM_OC_ O28_OC_
OC_STAT C_STATU C_STATU
STATUS _STATUS STATUS STATUS
US S S
Type RO RO RO RO RO RO RO

m. T
Reset 0 0 0 0 0 0 0

.co EN
Bit(s) Mnemonic Name Description
over current status
RO_QI_VUSB_OC_
6 1'b1: over current occur
STATUS
1'b0: no over current occur
over current status
RO_QI_VSIM2_OC
5

4
rld FID _STATUS

RO_QI_VSIM_OC_
1'b1: over
1'b0: no over current occur
over current status
1'b1: over
current

current
occur

occur
STATUS
1'b0: no over current occur
over current status
RO_QI_VIO28_OC
wo N
3 1'b1: over current occur
_STATUS
1'b0: no over current occur
over current status
ter CO

RO_QI_VM12_INT_
2 1'b1: over current occur
OC_STATUS
1'b0: no over current occur
over current status
RO_QI_VM12_2_O
1 1'b1: over current occur
C_STATUS
1'b0: no over current occur
over current status
RO_QI_VM12_1_O
wa K

0 1'b1: over current occur


C_STATUS
1'b0: no over current occur
@ TE

Digital LDO
B8 DIGLDO_CON36 Control Register 00
36
xin IA

Bit 7 6 5 4 3 2 1 0
RO_QI_V RO_QI_V RO_QI_V
RO_QI_VI RO_QI_V RO_QI_V RO_QI_V RO_QI_V
CAM_AF_ CAM_IO_ CAMD_O
Name BR_OC_S GP2_OC_ GP_OC_S MCH_OC MC_OC_
OC_STAT OC_STAT C_STATU
zli ED

TATUS STATUS TATUS _STATUS STATUS


US US S
Type RO RO RO RO RO RO RO RO
Reset 0 0 0 0 0 0 0 0

Bit(s) Mnemonic Name Description


M

over current status


RO_QI_VIBR_OC_
7 1'b1: over current occur
STATUS
1'b0: no over current occur
over current status
RO_QI_VGP2_OC_
6 1'b1: over current occur
STATUS
1'b0: no over current occur
RO_QI_VGP_OC_ over current status
5
STATUS 1'b1: over current occur
R
FO

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Bit(s) Mnemonic Name Description


1'b0: no over current occur

EO
over current status

US L
RO_QI_VMCH_OC
4 1'b1: over current occur
_STATUS
1'b0: no over current occur

cn IA
over current status
RO_QI_VMC_OC_
3 1'b1: over current occur
STATUS
1'b0: no over current occur
over current status
RO_QI_VCAM_AF_

m. T
2 1'b1: over current occur
OC_STATUS
1'b0: no over current occur
over current status

.co EN
RO_QI_VCAM_IO_
1 1'b1: over current occur
OC_STATUS
1'b0: no over current occur
over current status
RO_QI_VCAMD_O
0 1'b1: over current occur
C_STATUS
1'b0: no over current occur

rld FID
BA DIGLDO_RSV Reserved register 00
Bit 7 6 5 4 3 2 1 0
Name RG_VM12_2_VOSEL
wo N
Type RW
Reset 0 0
ter CO

Bit(s) Mnemonic Name Description


VM12_2 output voltage select
RG_VM12_2_VOS 2'b00: 1.2V
3:2 2'b01: 1.1V
EL
2'b10: 1.0V
wa K

2'b11: 0.9V
@ TE

Analog LDO
BE ANALDO_CON1 00
Control Register 1
Bit 7 6 5 4 3 2 1 0
xin IA

VRF_ON_ RG_VRF_
Name CTRL EN
Type RW RW
Reset 0 0
zli ED

Bit(s) Mnemonic Name Description


VRF enable control
1 VRF_ON_CTRL 0: SW control by RG_VRF_EN
1: SRCLKEN
M

0 RG_VRF_EN VRF enable

Analog LDO
C1 ANALDO_CON4 03
Control Register 4
Bit 7 6 5 4 3 2 1 0
R
FO

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Analog LDO
C1 ANALDO_CON4 03

EO
Control Register 4

US L
QI_VTCX RG_VTCX
Name O_EN O_EN
Type RO RW

cn IA
Reset 0 1

Bit(s) Mnemonic Name Description

m. T
VTCXO enable status
7 QI_VTCXO_EN 1'b1: enable
1'b0: disable

.co EN
VTCXO enable
0 RG_VTCXO_EN 1'b1: enable
1'b0: disable

C8
rld FID ANALDO_CONB
Analog
Control
LDO
Register 81
B
Bit 7 6 5 4 3 2 1 0
wo N
RG_VA2_
Name EN
Type RW
ter CO

Reset 1

Bit(s) Mnemonic Name Description


VA2 enable
0 RG_VA2_EN 1'b1: enable
1'b0: disable
wa K
@ TE

Analog LDO
CB ANALDO_CONE Control Register 30
E
Bit 7 6 5 4 3 2 1 0
xin IA

RG_VCA
Name RG_VCAMA_VOSEL
MA_EN
Type RW RW
Reset 1 1 0
zli ED

Bit(s) Mnemonic Name Description


output voltage select
RG_VCAMA_VOSE 2'b00: 1.5V
5:4 2'b01: 1.8V
M

L
2b'10: 2.5V
2b'11: 2.8V
Enable
0 RG_VCAMA_EN 1'b1: enable
1'b0: disable
R
FO

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Analog LDO

EO
D0 ANALDO_CON13 Control Register 00
13

US L
Bit 7 6 5 4 3 2 1 0
RO_QI_V RO_QI_V

cn IA
RO_QI_V RO_QI_V RO_QI_V
CAMA_O TCXO_O
Name A2_OC_S A1_OC_S RF_OC_S
C_STATU C_STATU
TATUS TATUS TATUS
S S
Type RO RO RO RO RO

m. T
Reset 0 0 0 0 0

.co EN
Bit(s) Mnemonic Name Description
over current status
RO_QI_VCAMA_O
4 1'b1: over current occur
C_STATUS
1'b0: no over current occur
over current status
RO_QI_VA2_OC_S
3

2
rld FID TATUS

RO_QI_VA1_OC_S
1'b1: over
1'b0: no over current occur
over current status
1'b1: over
current

current
occur

occur
TATUS
1'b0: no over current occur
over current status
RO_QI_VTCXO_O
wo N
1 1'b1: over current occur
C_STATUS
1'b0: no over current occur
over current status
ter CO

RO_QI_VRF_OC_S
0 1'b1: over current occur
TATUS
1'b0: no over current occur

AUXADC Control
DA AUXADC_CON0 00
wa K

Register 0
Bit 7 6 5 4 3 2 1 0
Name RG_ADC_OUT[7:0]
@ TE

Type RO
Reset 0 0 0 0 0 0 0 0

Bit(s) Mnemonic Name Description


xin IA

RG_ADC_O RG_ADC_OUT_C0
7:0 AUXADC channel 0 output data
UT[7:0] _7_0
zli ED

AUXADC Control
DB AUXADC_CON1 00
Register 1
Bit 7 6 5 4 3 2 1 0
M

RG_ADC_
Name RG_ADC_OUT[9:8]
RDY
Type RO RO
Reset 0 0 0

Bit(s) Mnemonic Name Description


RG_ADC_R AUXADC channel 0 output data ready
7 RG_ADC_RDY_C0
DY 0: AUXADC data proceeding
R
FO

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Bit(s) Mnemonic Name Description


1: AUXADC data ready

EO
RG_ADC_O RG_ADC_OUT_C0

US L
1:0 AUXADC channel 0 output data
UT[9:8] _9_8

cn IA
AUXADC Control
DC AUXADC_CON2 00
Register 2

m. T
Bit 7 6 5 4 3 2 1 0
Name RG_ADC_OUT_WAKEUP[7:0]

.co EN
Type RO
Reset 0 0 0 0 0 0 0 0

Bit(s) Mnemonic Name Description

7:0
rld FID
RG_ADC_O
UT_WAKE
UP[7:0]
RG_ADC_OUT_C1
_7_0
AUXADC channel 1 output data

AUXADC Control
wo N
DD AUXADC_CON3 00
Register 3
Bit 7 6 5 4 3 2 1 0
ter CO

RG_ADC_
RG_ADC_OUT_WAKE
Name RDY_WA
UP[9:8]
KEUP
Type RO RO
Reset 0 0 0
wa K

Bit(s) Mnemonic Name Description


RG_ADC_R AUXADC channel 1 output data ready
7 DY_WAKE RG_ADC_RDY_C1 0: AUXADC data proceeding
@ TE

UP 1: AUXADC data ready


RG_ADC_O
RG_ADC_OUT_C1
1:0 UT_WAKE AUXADC channel 1 output data
_9_8
UP[9:8]
xin IA

AUXADC Control
DE AUXADC_CON4 00
Register 4
zli ED

Bit 7 6 5 4 3 2 1 0
Name RG_ADC_OUT_LBAT[7:0]
Type RO
Reset 0 0 0 0 0 0 0 0
M

Bit(s) Mnemonic Name Description


RG_ADC_O
RG_ADC_OUT_C2
7:0 UT_LBAT[7 AUXADC channel 2 output data
_7_0
:0]
R
FO

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AUXADC Control
DF AUXADC_CON5 00

EO
Register 5

US L
Bit 7 6 5 4 3 2 1 0
RG_ADC_
RG_ADC_OUT_LBAT[9
Name RDY_LBA

cn IA
:8]
T
Type RO RO
Reset 0 0 0

m. T
Bit(s) Mnemonic Name Description
AUXADC channel 2 output data ready

.co EN
RG_ADC_R
7 RG_ADC_RDY_C2 0: AUXADC data proceeding
DY_LBAT
1: AUXADC data ready
RG_ADC_O
RG_ADC_OUT_C2
1:0 UT_LBAT[9 AUXADC channel 2 output data
_9_8
:8]

rld FID AUXADC Control


E0 AUXADC_CON6 00
Register 6
Bit 7 6 5 4 3 2 1 0
wo N
Name RG_ADC_OUT_TRIM[7:0]
Type RO
Reset 0 0 0 0 0 0 0 0
ter CO

Bit(s) Mnemonic Name Description


RG_ADC_O
RG_ADC_OUT_C3
7:0 UT_TRIM[7: AUXADC channel 3 output data
_7_0
0]
wa K
@ TE

AUXADC Control
E1 AUXADC_CON7 00
Register 7
Bit 7 6 5 4 3 2 1 0
RG_ADC_
RG_ADC_OUT_TRIM[9
Name RDY_TRI
xin IA

:8]
M
Type RO RO
Reset 0 0 0
zli ED

Bit(s) Mnemonic Name Description


AUXADC channel 3 output data ready
RG_ADC_R
7 RG_ADC_RDY_C3 0: AUXADC data proceeding
DY_TRIM
1: AUXADC data ready
M

RG_ADC_O
RG_ADC_OUT_C3
1:0 UT_TRIM[9: AUXADC channel 3 output data
_9_8
8]

AUXADC Control
E2 AUXADC_CON8 00
Register 8
R
FO

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AUXADC Control
E2 AUXADC_CON8 00

EO
Register 8

US L
Bit 7 6 5 4 3 2 1 0
Name RG_ADC_OUT_WAKUP[7:0]
Type RO

cn IA
Reset 0 0 0 0 0 0 0 0

Bit(s) Mnemonic Name Description

m. T
RG_ADC_O
RG_ADC_OUT_WA
7:0 UT_WAKU AUXADC wakeup output data
KEUP_7_0
P[7:0]

.co EN
AUXADC Control
E3 AUXADC_CON9 00
Register 9
Bit

Name
rld FID 7
RG_ADC_
RDY_WA
6 5 4 3 2 1
RG_ADC_OUT_WAKU
P[9:8]
0

KUP
Type RO RO
Reset 0 0 0
wo N

Bit(s) Mnemonic Name Description


ter CO

RG_ADC_R AUXADC wakeup output data ready


RG_ADC_RDY_WA
7 DY_WAKU 0: AUXADC wakeup data not ready
KEUP
P 1: AUXADC wakeup data ready
RG_ADC_O
RG_ADC_OUT_WA
1:0 UT_WAKU AUXADC wakeup output data
KEUP_9_8
P[9:8]
wa K
@ TE

AUXADC Control
E6 AUXADC_CON12 00
Register 12
Bit 7 6 5 4 3 2 1 0
Name RG_ADC_OUT_TRIM[7:0]
Type RO
xin IA

Reset 0 0 0 0 0 0 0 0

Bit(s) Mnemonic Name Description


zli ED

RG_ADC_O
RG_ADC_OUT_TRI
7:0 UT_TRIM[7: AUXADC trimming output data
M_7_0
0]
M

AUXADC Control
E7 AUXADC_CON13 00
Register 13
Bit 7 6 5 4 3 2 1 0
RG_ADC_
RG_ADC_OUT_TRIM[9
Name RDY_TRI
:8]
M
Type RO RO
R
FO

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AUXADC Control
E7 AUXADC_CON13 00

EO
Register 13

US L
Reset 0 0 0

cn IA
Bit(s) Mnemonic Name Description
AUXADC trimming output data ready
RG_ADC_R RG_ADC_RDY_TRI
7 0: AUXADC trimming data proceeding
DY_TRIM M
1: AUXADC trimming data ready

m. T
RG_ADC_O
RG_ADC_OUT_TRI
1:0 UT_TRIM[9: AUXADC trimming output data
M_9_8
8]

.co EN
AUXADC Control
E8 AUXADC_CON14 02

Bit

Name
rld FID 7 6

RG_AUXADC_CHSEL
5 4
Register 14
3 2 1 0
RG_AUX
ADC_STA
RT
Type RW RW
Reset 0 0 0 0 0
wo N

Bit(s) Mnemonic Name Description


ter CO

AUXADC channel selection


4'h0: VBAT
RG_AUXA RG_AUXADC_CHS 4'h1: VISENSE
7:4
DC_CHSEL EL 4'h2: VCHARGER
4'h3: TBAT
4'h4~4'h15: Reserved
wa K

AUXADC start trigger, write 1 trigger, auto clear to 0


RG_AUXA RG_AUXADC_STA
0 0: AUXADC not start trigger
DC_START RT
1: AUXADC start trigger
@ TE
xin IA

3.3.2 Bank 1
zli ED

Address Name Widt Register Function


h
22 FLASH_CON0 8 FLASH Control Register 0
23 FLASH_CON1 8 FLASH Control Register 1
M

24 FLASH_CON2 8 FLASH Control Register 2


26 FLASH_CON4 8 FLASH Control Register 4
27 KPLED_CON0 8 KPLED Control Register 0
28 KPLED_CON1 8 KPLED Control Register 1
29 KPLED_CON2 8 KPLED Control Register 2
2A KPLED_CON3 8 KPLED Control Register 3
2B KPLED_CON4 8 KPLED Control Register 4
R
FO

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EO
2C ISINKS_CON0 8 ISINKS Control Register 0

US L
2D ISINKS_CON1 8 ISINKS Control Register 1
2E ISINKS_CON2 8 ISINKS Control Register 2

cn IA
2F ISINKS_CON3 8 ISINKS Control Register 3
30 ISINKS_CON4 8 ISINKS Control Register 4
31 ISINKS_CON5 8 ISINKS Control Register 5

m. T
32 ISINKS_CON6 8 ISINKS Control Register 6
33 ISINKS_CON7 8 ISINKS Control Register 7

.co EN
34 ISINKS_CON8 8 ISINKS Control Register 8
35 ISINKS_CON9 8 ISINKS Control Register 9
36 ISINKS_CON10 8 ISINKS Control Register 10
37 ISINKS_CON11 8 ISINKS Control Register 11
38
39
3F
rld FID
ISINKS_CON12
ISINKS_CON13
BOOST_CON0
8
8
8
ISINKS Control Register 12
ISINKS Control Register 13
BOOST Control Register 0
40 BOOST_CON1 8 BOOST Control Register 1
46 SPK_CON0 8 Speaker Control Register 0
wo N
47 SPK_CON1 8 Speaker Control Register 1
4C SPK_CON6 8 Speaker Control Register 6
ter CO

4D SPK_CON7 8 Speaker Control Register 7


5A SPK_CON20 8 Speaker Control Register 20
5F ASW_CON0 8 ASW Control Register 0
6B FGADC_CON2 8 FGADC Control Register 2
6C FGADC_CON3 8 FGADC Control Register 3
wa K

6D FGADC_CON4 8 FGADC Control Register 4


6E FGADC_CON5 8 FGADC Control Register 5
6F FGADC_CON6 8 FGADC Control Register 6
@ TE

70 FGADC_CON7 8 FGADC Control Register 7


71 FGADC_CON8 8 FGADC Control Register 8
72 FGADC_CON9 8 FGADC Control Register 9
8
xin IA

73 FGADC_CON10 FGADC Control Register 10


78 FGADC_CON15 8 FGADC Control Register 15
79 FGADC_CON16 8 FGADC Control Register 16
zli ED

FLASH Control
22 FLASH_CON0 00
Register 0
M

Bit 7 6 5 4 3 2 1 0
Name FLASH_DIM_DUTY
Type RW
Reset 0 0 0 0 0

Bit(s) Mnemonic Name Description


FLASH_DI Flash ON-duty of dimming control
4:0 FLASH_DIM_DUTY
M_DUTY 0: 1/32
R
FO

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Bit(s) Mnemonic Name Description


1: 2/32

EO
2: 3/32

US L
N: N+1/32
31: 32/32

cn IA
FLASH Control
23 FLASH_CON1 00
Register 1

m. T
Bit 7 6 5 4 3 2 1 0
FLASH_T

.co EN
FLASH_E
Name HER_SHD
N
N_EN
Type RW RW
Reset 0 0

Bit(s)

1
rld FID
Mnemonic
FLASH_TH
ER_SHDN_
Name

FLASH_THER_SH
DN_EN
Description
Flash thermal shut down enable
0: Disable
EN 1: Enable
Turn on Flash driver
0 FLASH_EN FLASH_EN 0: Disable
wo N
1: Enable
ter CO

FLASH Control
24 FLASH_CON2 00
Register 2
Bit 7 6 5 4 3 2 1 0
Name FLASH_DIM_DIV
wa K

Type RW
Reset 0 0 0 0 0 0 0 0
@ TE

Bit(s) Mnemonic Name Description


Flash dimming frequency division
0: /1
FLASH_DI 1: /2
7:0 FLASH_DIM_DIV
M_DIV 2: /3
xin IA

N: /N+1
255: 256
zli ED

FLASH Control
26 FLASH_CON4 00
Register 4
Bit 7 6 5 4 3 2 1 0
M

FLASH_S FLASH_M
Name FLASH_SFSTR
FSTREN ODE
Type RW RW RW
Reset 0 0 0 0

Bit(s) Mnemonic Name Description


FLASH_SF Flash soft-start enable
7 FLASH_SFSTREN
STREN 0: Disable
R
FO

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Bit(s) Mnemonic Name Description


1: Enable

EO
Flash soft-start time

US L
FLASH_SF 00: 30.52us
5:4 FLASH_SFSTR 01: 61.04us
STR

cn IA
10: 91.55us
11: 122.07us
Flash enable mode select
FLASH_MO
0 FLASH_MODE 0: PWM mode
DE
1: Register mode (FLASH_EN)

m. T
.co EN
KPLED Control
27 KPLED_CON0 00
Register 0
Bit 7 6 5 4 3 2 1 0
Name
Type
Reset rld FID 0 0
KPLED_DIM_DUTY
RW
0 0 0

Bit(s) Mnemonic Name Description


Kpled ON-duty of dimming control
wo N
0: 1/32
KPLED_DI 1: 2/32
4:0 KPLED_DIM_DUTY
M_DUTY 2: 3/32
ter CO

N: N+1/32
31: 32/32

KPLED Control
28 KPLED_CON1 00
Register 1
wa K

Bit 7 6 5 4 3 2 1 0
KPLED_T
KPLED_E
@ TE

Name HER_SHD
N
N_EN
Type RW RW
Reset 0 0
xin IA

Bit(s) Mnemonic Name Description


KPLED_TH Kpled thermal shut down enable
KPLED_THER_SH
1 ER_SHDN_ 0: Disable
DN_EN
EN 1: Enable
zli ED

Turn on kpled
0 KPLED_EN KPLED_EN 0: Disable
1: Enable
M

KPLED Control
29 KPLED_CON2 00
Register 2
Bit 7 6 5 4 3 2 1 0
Name KPLED_DIM_DIV
Type RW
Reset 0 0 0 0 0 0 0 0
R
FO

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Bit(s) Mnemonic Name Description

EO
US L
Kpled dimming frequency division
0: /1
KPLED_DI 1: /2
7:0 KPLED_DIM_DIV

cn IA
M_DIV 2: /3
N: /N+1
255: 256

m. T
KPLED Control

.co EN
2A KPLED_CON3 00
Register 3
Bit 7 6 5 4 3 2 1 0
Name KPLED_SEL
Type RW
Reset 0 0 0

Bit(s)
rld FID
Mnemonic Name Description
KPLED_SE
2:0 KPLED_SEL Kpled driving step select
L
wo N

KPLED Control
ter CO

2B KPLED_CON4 00
Register 4
Bit 7 6 5 4 3 2 1 0
KPLED_S KPLED_M
Name KPLED_SFSTR
FSTREN ODE
Type RW RW RW
Reset 0 0 0 0
wa K

Bit(s) Mnemonic Name Description


@ TE

Kpled soft-start enable


KPLED_SF
7 KPLED_SFSTREN 0: Disable
STREN
1: Enable
Kpled soft-start time
00: 30.52us
xin IA

KPLED_SF
5:4 KPLED_SFSTR 01: 61.04us
STR
10: 91.55us
11: 122.07us
Kpled enable mode select
KPLED_MO
zli ED

0 KPLED_MODE 0: PWM mode


DE
1: Register mode (KPLED_EN)
M

ISINKS Control
2C ISINKS_CON0 00
Register 0
Bit 7 6 5 4 3 2 1 0
Name ISINK_DIM0_DUTY
Type RW
Reset 0 0 0 0
R
FO

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Bit(s) Mnemonic Name Description


ISINK ON-duty of dimming0 control

EO
0: 1/16

US L
ISINK_DIM 1: 2/16
3:0 ISINK_DIM0_DUTY
0_DUTY 2: 3/16
N: N+1/16

cn IA
15: 16/16

m. T
ISINKS Control
2D ISINKS_CON1 0B
Register 1

.co EN
Bit 7 6 5 4 3 2 1 0
Name ISINK_DIM0_FSEL
Type RW
Reset 0 1 0 1 1

Bit(s) rld FID


Mnemonic Name Description
ISINK dimming0 frequency selection
0: 31.25KHz
1: 29.762KHz
2: 28.409KHz
3: 27.174KHz
wo N
4: 26.042KHz
5: 25KHz
6: 24.038KHz
ter CO

7: 23.148KHz
8: 22.321KHz
9: 21.552KHz
ISINK_DIM 10: 20.833KHz
4:0 ISINK_DIM0_FSEL 11: 20.161KHz
0_FSEL
12: 19.531KHz
13: 1KHz
14: 901Hz
wa K

15: 800Hz
16: 700Hz
17: 600Hz
@ TE

18: 500Hz
19: 400Hz
20: 300Hz
21: 200Hz
22: 100Hz
Others: Reserved
xin IA

ISINKS Control
zli ED

2E ISINKS_CON2 00
Register 2
Bit 7 6 5 4 3 2 1 0
Name ISINK_DIM1_DUTY
Type RW
Reset 0 0 0 0 0
M

Bit(s) Mnemonic Name Description


ISINK ON-duty of dimming1 control
0: 1/32
ISINK_DIM 1: 2/32
4:0 ISINK_DIM1_DUTY
1_DUTY 2: 3/32
N: N+1/32
31: 32/32
R
FO

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EO
US L
ISINKS Control
2F ISINKS_CON3 08
Register 3

cn IA
Bit 7 6 5 4 3 2 1 0
Name ISINK_DIM1_FSEL
Type RW
Reset 0 1 0 0 0

m. T
Bit(s) Mnemonic Name Description

.co EN
ISINK dimming1 frequency selection
ISINK_DIM1_CKSEL[1: 0]=00/01/10/11
0: 1008Hz/504Hz/252Hz/126Hz
1: 893Hz/446Hz/223Hz/112Hz
2: 801Hz/400Hz/200Hz/100Hz
3: 694Hz/347Hz/174Hz/87Hz

rld FID 4:
5:
6:
7:
601Hz/300Hz/150Hz/75Hz
496Hz/248Hz/124Hz/62Hz
401Hz/200Hz/100Hz/50Hz
300Hz/150Hz/75Hz/37.5Hz
8: 200Hz/100Hz/50Hz/25Hz
9: 100Hz/50Hz/25Hz/12.5Hz
10: 90Hz/45Hz/22.5Hz/11.3Hz
wo N
11: 80Hz/40Hz/20Hz/10Hz
12: 70Hz/35Hz/17.5Hz/8.75Hz
13: 60Hz/30Hz/15Hz/7.5Hz
ISINK_DIM 14: 50Hz/25Hz/12.5Hz/6.25Hz
ter CO

4:0 ISINK_DIM1_FSEL
1_FSEL 15: 40Hz/20Hz/10Hz/5Hz
16: 30Hz/15Hz/7.5Hz/3.75Hz
17: 20Hz/10Hz/5Hz/2.5Hz
18: 10Hz/5Hz/2.5Hz/1.25Hz
19: 9Hz/4.5Hz/2.25Hz/1.125Hz
20: 8Hz/4Hz/2Hz/1Hz
21: 7Hz/3.5Hz/1.75Hz/0.875Hz
wa K

22: 6Hz/3Hz/1.5Hz/0.75Hz
23: 5Hz/2.5Hz/1.25Hz/0.625Hz
24: 4Hz/2Hz/1Hz/0.5Hz
25: 3Hz/1.5Hz/0.75Hz/0.375Hz
@ TE

26: 2Hz/1Hz/0.5Hz/0.25Hz
27: 1.5Hz/0.75Hz/0.375Hz/0.188Hz
28: 1Hz/0.5Hz/0.25Hz/0.125Hz
29: 0.8Hz/0.4Hz/0.2Hz/0.1Hz
30: 0.6Hz/0.3Hz/0.15Hz/0.075Hz
31: 0.5Hz/0.25Hz/0.125Hz/0.0625Hz
xin IA

ISINKS Control
zli ED

30 ISINKS_CON4 00
Register 4
Bit 7 6 5 4 3 2 1 0
Name ISINK_DIM2_DUTY
Type RW
Reset
M

0 0 0 0 0

Bit(s) Mnemonic Name Description


ISINK ON-duty of dimming2 control
ISINK_DIM 0: 1/32
4:0 ISINK_DIM2_DUTY 1: 2/32
2_DUTY
2: 3/32
N: N+1/32
R
FO

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Bit(s) Mnemonic Name Description


31: 32/32

EO
US L
cn IA
ISINKS Control
31 ISINKS_CON5 08
Register 5
Bit 7 6 5 4 3 2 1 0
Name ISINK_DIM2_FSEL

m. T
Type RW
Reset 0 1 0 0 0

.co EN
Bit(s) Mnemonic Name Description
ISINK dimming2 frequency selection
ISINK_DIM2_CKSEL[1: 0]=00/01/10/11
0: 1008Hz/504Hz/252Hz/126Hz

rld FID 1:
2:
3:
4:
893Hz/446Hz/223Hz/112Hz
801Hz/400Hz/200Hz/100Hz
694Hz/347Hz/174Hz/87Hz
601Hz/300Hz/150Hz/75Hz
5: 496Hz/248Hz/124Hz/62Hz
6: 401Hz/200Hz/100Hz/50Hz
7: 300Hz/150Hz/75Hz/37.5Hz
wo N
8: 200Hz/100Hz/50Hz/25Hz
9: 100Hz/50Hz/25Hz/12.5Hz
10: 90Hz/45Hz/22.5Hz/11.3Hz
11: 80Hz/40Hz/20Hz/10Hz
ter CO

12: 70Hz/35Hz/17.5Hz/8.75Hz
13: 60Hz/30Hz/15Hz/7.5Hz
ISINK_DIM 14: 50Hz/25Hz/12.5Hz/6.25Hz
4:0 ISINK_DIM2_FSEL
2_FSEL 15: 40Hz/20Hz/10Hz/5Hz
16: 30Hz/15Hz/7.5Hz/3.75Hz
17: 20Hz/10Hz/5Hz/2.5Hz
18: 10Hz/5Hz/2.5Hz/1.25Hz
wa K

19: 9Hz/4.5Hz/2.25Hz/1.125Hz
20: 8Hz/4Hz/2Hz/1Hz
21: 7Hz/3.5Hz/1.75Hz/0.875Hz
22: 6Hz/3Hz/1.5Hz/0.75Hz
@ TE

23: 5Hz/2.5Hz/1.25Hz/0.625Hz
24: 4Hz/2Hz/1Hz/0.5Hz
25: 3Hz/1.5Hz/0.75Hz/0.375Hz
26: 2Hz/1Hz/0.5Hz/0.25Hz
27: 1.5Hz/0.75Hz/0.375Hz/0.188Hz
28: 1Hz/0.5Hz/0.25Hz/0.125Hz
xin IA

29: 0.8Hz/0.4Hz/0.2Hz/0.1Hz
30: 0.6Hz/0.3Hz/0.15Hz/0.075Hz
31: 0.5Hz/0.25Hz/0.125Hz/0.0625Hz
zli ED

ISINKS Control
32 ISINKS_CON6 00
Register 6
Bit 7 6 5 4 3 2 1 0
M

ISINKS_C ISINKS_C ISINKS_C ISINKS_C ISINKS_C ISINKS_C


Name H5_EN H4_EN H3_EN H2_EN H1_EN H0_EN
Type RW RW RW RW RW RW
Reset 0 0 0 0 0 0

Bit(s) Mnemonic Name Description


5 ISINKS_CH ISINKS_CH5_EN Turn on ISINK Channel 5
R
FO

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Bit(s) Mnemonic Name Description


5_EN

EO
ISINKS_CH

US L
4 ISINKS_CH4_EN Turn on ISINK Channel 4
4_EN
ISINKS_CH
3 ISINKS_CH3_EN Turn on ISINK Channel 3

cn IA
3_EN
ISINKS_CH
2 ISINKS_CH2_EN Turn on ISINK Channel 2
2_EN
ISINKS_CH
1 ISINKS_CH1_EN Turn on ISINK Channel 1

m. T
1_EN
ISINKS_CH
0 ISINKS_CH0_EN Turn on ISINK Channel 0
0_EN

.co EN
ISINKS Control
33 ISINKS_CON7 00

Bit

Name
rld FID 7 6 5
ISINKS_C
H5_CABC
4
ISINKS_C
H4_CABC
Register 7
3
ISINKS_C
H3_CABC
2
ISINKS_C
H2_CABC
1
ISINKS_C
H1_CABC
0
ISINKS_C
H0_CABC
_EN _EN _EN _EN _EN _EN
Type RW RW RW RW RW RW
Reset 0 0 0 0 0 0
wo N

Bit(s) Mnemonic Name Description


ter CO

ISINKS_CH ISINK Channel 5 CABC enable


ISINKS_CH5_CAB
5 5_CABC_E 0: Disable
C_EN
N 1: Enable
ISINKS_CH ISINK Channel 4 CABC enable
ISINKS_CH4_CAB
4 4_CABC_E 0: Disable
C_EN
N 1: Enable
wa K

ISINKS_CH ISINK Channel 3 CABC enable


ISINKS_CH3_CAB
3 3_CABC_E 0: Disable
C_EN
N 1: Enable
@ TE

ISINKS_CH ISINK Channel 2 CABC enable


ISINKS_CH2_CAB
2 2_CABC_E 0: Disable
C_EN
N 1: Enable
ISINKS_CH ISINK Channel 1 CABC enable
ISINKS_CH1_CAB
1 1_CABC_E 0: Disable
C_EN
xin IA

N 1: Enable
ISINKS_CH ISINK Channel 0 CABC enable
ISINKS_CH0_CAB
0 0_CABC_E 0: Disable
C_EN
N 1: Enable
zli ED

ISINKS Control
34 ISINKS_CON8 00
Register 8
M

Bit 7 6 5 4 3 2 1 0
Name ISINKS_CH0_STEP ISINKS_CH0_MODE
Type RW RW
Reset 0 0 0 0 0

Bit(s) Mnemonic Name Description


6:4 ISINKS_CH ISINKS_CH0_STEP Coarse 6 step current level for ISINK CH0
R
FO

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Bit(s) Mnemonic Name Description


0_STEP 000: 4mA

EO
001: 8mA

US L
010: 12mA
011: 16mA
100: 20mA

cn IA
101: 24mA
110: 24mA
111: 24mA
ISINK Channel 0 enable mode select

m. T
ISINKS_CH ISINKS_CH0_MOD 00: PWM0 mode
1:0 01: PWM1 mode
0_MODE E
10: PWM2 mode

.co EN
11: Register mode (ISINKS_CH0_EN)

ISINKS Control
35 ISINKS_CON9 00

Bit
Name
Type
rld FID
7 6 5
ISINKS_CH1_STEP
RW
4
Register 9
3 2 1 0
ISINKS_CH1_MODE
RW
Reset 0 0 0 0 0
wo N
Bit(s) Mnemonic Name Description
Coarse 6 step current level for ISINK CH1
ter CO

000: 4mA
001: 8mA
ISINKS_CH 010: 12mA
6:4 ISINKS_CH1_STEP 011: 16mA
1_STEP
100: 20mA
101: 24mA
110: 24mA
111: 24mA
wa K

ISINK Channel 1 enable mode select


ISINKS_CH ISINKS_CH1_MOD 00: PWM0 mode
1:0 01: PWM1 mode
@ TE

1_MODE E
10: PWM2 mode
11: Register mode (ISINKS_CH1_EN)
xin IA

ISINKS Control
36 ISINKS_CON10 00
Register 10
Bit 7 6 5 4 3 2 1 0
zli ED

Name ISINKS_CH2_STEP ISINKS_CH2_MODE


Type RW RW
Reset 0 0 0 0 0

Bit(s) Mnemonic Name Description


M

Coarse 6 step current level for ISINK CH2


000: 4mA
001: 8mA
ISINKS_CH 010: 12mA
6:4 ISINKS_CH2_STEP 011: 16mA
2_STEP
100: 20mA
101: 24mA
110: 24mA
111: 24mA
R
FO

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Bit(s) Mnemonic Name Description


ISINK Channel 2 enable mode select

EO
00: PWM0 mode

US L
ISINKS_CH ISINKS_CH2_MOD
1:0 01: PWM1 mode
2_MODE E
10: PWM2 mode
11: Register mode (ISINKS_CH2_EN)

cn IA
m. T
ISINKS Control
37 ISINKS_CON11 00
Register 11

.co EN
Bit 7 6 5 4 3 2 1 0
Name ISINKS_CH3_STEP ISINKS_CH3_MODE
Type RW RW
Reset 0 0 0 0 0

Bit(s)
rld FID
Mnemonic Name Description
Coarse 6 step current level for ISINK CH3
000:
001:
4mA
8mA
ISINKS_CH 010: 12mA
6:4 ISINKS_CH3_STEP 011: 16mA
3_STEP
100: 20mA
wo N
101: 24mA
110: 24mA
111: 24mA
ter CO

ISINK Channel 3 enable mode select


ISINKS_CH ISINKS_CH3_MOD 00: PWM0 mode
1:0 01: PWM1 mode
3_MODE E
10: PWM2 mode
11: Register mode (ISINKS_CH3_EN)
wa K

ISINKS Control
38 ISINKS_CON12 00
@ TE

Register 12
Bit 7 6 5 4 3 2 1 0
Name ISINKS_CH4_STEP ISINKS_CH4_MODE
Type RW RW
Reset 0 0 0 0 0
xin IA

Bit(s) Mnemonic Name Description


Coarse 6 step current level for ISINK CH4
zli ED

000: 4mA
001: 8mA
ISINKS_CH 010: 12mA
6:4 ISINKS_CH4_STEP 011: 16mA
4_STEP
100: 20mA
101: 24mA
M

110: 24mA
111: 24mA
ISINK Channel 4 enable mode select
ISINKS_CH ISINKS_CH4_MOD 00: PWM0 mode
1:0 01: PWM1 mode
4_MODE E
10: PWM2 mode
11: Register mode (ISINKS_CH4_EN)
R
FO

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EO
ISINKS Control
39 ISINKS_CON13 00

US L
Register 13
Bit 7 6 5 4 3 2 1 0

cn IA
Name ISINKS_CH5_STEP ISINKS_CH5_MODE
Type RW RW
Reset 0 0 0 0 0

m. T
Bit(s) Mnemonic Name Description
Coarse 6 step current level for ISINK CH5

.co EN
000: 4mA
001: 8mA
ISINKS_CH 010: 12mA
6:4 ISINKS_CH5_STEP 011: 16mA
5_STEP
100: 20mA
101: 24mA

rld FID
ISINKS_CH ISINKS_CH5_MOD
110:
111: 24mA
ISINK Channel 5 enable mode select
00: PWM0
24mA

mode
1:0 01: PWM1 mode
5_MODE E
10: PWM2 mode
11: Register mode (ISINKS_CH5_EN)
wo N
ter CO

BOOST Control
3F BOOST_CON0 00
Register 0
Bit 7 6 5 4 3 2 1 0
BOOST_I BOOST_
BOOST_E
Name SINK_HW BOOST_MODE CABC_E
N
_SEL N
wa K

Type RW RW RW RW
Reset 0 0 0 0 0
@ TE

Bit(s) Mnemonic Name Description


BOOST_ISI select BOOST mode or ISINK
BOOST_ISINK_HW
7 NK_HW_SE 0: ISINK mode
_SEL
L 1: BOOST mode
xin IA

Boost mode
BOOST_M 00: PWM0 mode
5:4 BOOST_MODE 01: PWM1 mode
ODE
10: PWM2 mode
11: Register mode (BOOST_EN)
zli ED

CABC mode enable. PWM is from BL_PWM.


BOOST_CA
2 BOOST_CABC_EN 0: Disable
BC_EN
1: Enable
Boost backlight enable signal
0 BOOST_EN BOOST_EN
M

0: Disable
1: Enable

BOOST Control
40 BOOST_CON1 00
Register 1
Bit 7 6 5 4 3 2 1 0
R
FO

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BOOST Control
40 BOOST_CON1 00

EO
Register 1

US L
Name BOOST_SR_NMOS BOOST_VRSEL
Type RW RW
Reset 0 0 0 0 0 0

cn IA
Bit(s) Mnemonic Name Description
Slew-Rate control (NMOS)

m. T
BOOST_SR 00: driving x2
7:6 BOOST_SR_NMOS 01: driving x1
_NMOS
10: driving x4

.co EN
11: driving x3
select regulated voltage or current
4'b0000: ILED=25mV*1/R
4'b0001: ILED=25mV*2/R
4'b0010: ILED=25mV*3/R

3:0
rld FID
BOOST_VR
SEL
BOOST_VRSEL
4'b0011:
4'b0100:
4'b0101:
4'b0110:
4'b0111:
ILED=25mV*4/R
ILED=25mV*5/R
ILED=25mV*6/R
ILED=25mV*7/R
ILED=25mV*8/R
4'b1000: ILED=25mV*9/R
4'b1001: ILED=25mV*10/R
4'b1010: ILED=25mV*11/R
wo N
4'b1011: ILED=25mV*12/R
4'b1100: ILED=25mV*13/R
4'b1101: ILED=25mV*14/R
ter CO

4'b1110: ILED=25mV*15/R
4'b1111: ILED=25mV*16/R

Speaker Control
46 SPK_CON0 00
Register 0
wa K

Bit 7 6 5 4 3 2 1 0
SPK_THE
SPKMOD SPK_EN_
@ TE

Name R_SHDN_
E_L L
L_EN
Type RW RW RW
Reset 0 0 0
xin IA

Bit(s) Mnemonic Name Description


SPK_THER Speaker L-ch thermal shut down enable
SPK_THER_SHDN
6 _SHDN_L_ 0: Disable
_L_EN
EN 1: Enable
zli ED

speaker L-ch driver mode select


SPKMODE
2 SPKMODE_L 0: class D mode
_L
1: class AB mode
speaker amp. L-ch enable
0 SPK_EN_L SPK_EN_L 0: disable
M

1: enable

Speaker Control
47 SPK_CON1 03
Register 1
Bit 7 6 5 4 3 2 1 0
R
FO

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Speaker Control
47 SPK_CON1 03

EO
Register 1

US L
Name SPK_VOL_L
Type RW
Reset 0 1 1

cn IA
Bit(s) Mnemonic Name Description
speaker L-ch volume control

m. T
000: 3dB
001: 6dB
010: 9dB

.co EN
SPK_VOL_
2:0 SPK_VOL_L 011: 12dB
L
100: 15dB
101: 18dB
110: 21dB
111: mute

4C
rld FID SPK_CON6
Speaker Control
00
Register 6
Bit 7 6 5 4 3 2 1 0
wo N
SPK_THE
SPKMOD SPK_EN_
Name R_SHDN_
E_R R
R_EN
Type
ter CO

RW RW RW
Reset 0 0 0

Bit(s) Mnemonic Name Description


SPK_THER Speaker R-ch thermal shut down enable
SPK_THER_SHDN
6 _SHDN_R_ 0: Disable
_R_EN
wa K

EN 1: Enable
speaker R-ch driver mode select
SPKMODE
2 SPKMODE_R 0: class D mode
_R
@ TE

1: class AB mode
speaker amp. R-ch enable
0 SPK_EN_R SPK_EN_R 0: disable
1: enable
xin IA

Speaker Control
4D SPK_CON7 03
Register 7
zli ED

Bit 7 6 5 4 3 2 1 0
Name SPK_VOL_R
Type RW
Reset 0 1 1
M

Bit(s) Mnemonic Name Description


speaker R-ch volume control
000: 3dB
SPK_VOL_ 001: 6dB
2:0 SPK_VOL_R 010: 9dB
R
011: 12dB
100: 15dB
101: 18dB
R
FO

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Bit(s) Mnemonic Name Description


110: 21dB

EO
111: mute

US L
cn IA
Speaker Control
5A SPK_CON20 00
Register 20
Bit 7 6 5 4 3 2 1 0

m. T
SPKMOD SPKMOD
Name E_L_SW E_R_SW
Type RW RW

.co EN
Reset 0 0

Bit(s) Mnemonic Name Description


speaker L-ch driver mode select
5

4
rld FID
SPKMODE
_L_SW

SPKMODE
SPKMODE_L_SW

SPKMODE_R_SW
0:
1: class AB mode
class

speaker R-ch driver mode select


0: class
D

D
mode

mode
_R_SW
1: class AB mode
wo N

ASW Control
ter CO

5F ASW_CON0 00
Register 0
Bit 7 6 5 4 3 2 1 0
ANA_SW
Name _SEL
Type RW
Reset 0
wa K

Bit(s) Mnemonic Name Description


@ TE

Analog SW channel selection


ANA_SW_S
0 RG_ANA_SW_SEL 0: Channel 2
EL
1: Channel 1
xin IA

FGADC Control
6B FGADC_CON2 00
Register 2
zli ED

Bit 7 6 5 4 3 2 1 0
Name FG_CAR_35_32
Type RO
Reset 0 0 0 0
M

Bit(s) Mnemonic Name Description


FG_CAR_3
3:0 FG_CAR_35_32 Current charge value[35:32]
5_32
R
FO

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FGADC Control
6C FGADC_CON3 00

EO
Register 3

US L
Bit 7 6 5 4 3 2 1 0
Name FG_CAR_31_24
Type RO

cn IA
Reset 0 0 0 0 0 0 0 0

Bit(s) Mnemonic Name Description

m. T
FG_CAR_3
7:0 FG_CAR_31_24 Current charge value[31:24]
1_24

.co EN
FGADC Control
6D FGADC_CON4 00
Register 4
Bit
Name
Type
Reset
rld FID
7

0
6

0
5

0
4
FG_CAR_23_16

0
RO
0
3 2

0
1

0
0

Bit(s) Mnemonic Name Description


wo N
FG_CAR_2
7:0 FG_CAR_23_16 Current charge value[23:16]
3_16
ter CO

FGADC Control
6E FGADC_CON5 00
Register 5
Bit 7 6 5 4 3 2 1 0
wa K

Name FG_CAR_15_08
Type RO
Reset 0 0 0 0 0 0 0 0
@ TE

Bit(s) Mnemonic Name Description


FG_CAR_1
7:0 FG_CAR_15_08 Current charge value[15:8]
5_08
xin IA

FGADC Control
6F FGADC_CON6 00
zli ED

Register 6
Bit 7 6 5 4 3 2 1 0
Name FG_CAR_07_00
Type RO
Reset 0 0 0 0 0 0 0 0
M

Bit(s) Mnemonic Name Description


FG_CAR_0
7:0 FG_CAR_07_00 Current charge value[7:0]
7_00
R
FO

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FGADC Control
70 FGADC_CON7 00

EO
Register 7

US L
Bit 7 6 5 4 3 2 1 0
Name FG_NTER_29_24
Type RO

cn IA
Reset 0 0 0 0 0 0

Bit(s) Mnemonic Name Description

m. T
FG_NTER_
5:0 FG_NTER_29_24 Current charge time value[29:24]
29_24

.co EN
FGADC Control
71 FGADC_CON8 00
Register 8
Bit
Name
Type
Reset
rld FID
7

0
6

0
5

0
4
FG_NTER_23_16

0
RO
0
3 2

0
1

0
0

Bit(s) Mnemonic Name Description


wo N
FG_NTER_
7:0 FG_NTER_23_16 Current charge time value[23:16]
23_16
ter CO

FGADC Control
72 FGADC_CON9 00
Register 9
Bit 7 6 5 4 3 2 1 0
wa K

Name FG_NTER_15_08
Type RO
Reset 0 0 0 0 0 0 0 0
@ TE

Bit(s) Mnemonic Name Description


FG_NTER_
7:0 FG_NTER_15_08 Current charge time value[15:8]
15_08
xin IA

FGADC Control
73 FGADC_CON10 00
zli ED

Register 10
Bit 7 6 5 4 3 2 1 0
Name FG_NTER_07_00
Type RO
Reset 0 0 0 0 0 0 0 0
M

Bit(s) Mnemonic Name Description


FG_NTER_
7:0 FG_NTER_07_00 Current charge time value[7:0]
07_00
R
FO

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FGADC Control
78 FGADC_CON15 00

EO
Register 15

US L
Bit 7 6 5 4 3 2 1 0
Name FG_CURRENT_OUT_15_08
Type RO

cn IA
Reset 0 0 0 0 0 0 0 0

Bit(s) Mnemonic Name Description

m. T
FG_CURRE
FG_CURRENT_OU
7:0 NT_OUT_1 Current output charge of first stage[15:8]
T_15_08
5_08

.co EN
FGADC Control
79 FGADC_CON16 00
Register 16
Bit
Name
Type
rld FID
7 6 5 4
FG_CURRENT_OUT_07_00
RO
3 2 1 0

Reset 0 0 0 0 0 0 0 0
wo N
Bit(s) Mnemonic Name Description
FG_CURRE
FG_CURRENT_OU
7:0 NT_OUT_0 Current output charge of first stage[7:0]
ter CO

T_07_00
7_00

3.4 Connection to Baseband


wa K

The following schematic illustrates a typical application for PMIC to connect with the MT6575
baseband chips.
@ TE
xin IA
zli ED
M

Figure 14: Connection to BB


R
FO

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4 Application Notes

EO
US L
4.1 Hardware External Shutdown

cn IA
The following schematic illustrates the hardware external shut-down function for MT6329 to power
down when the main chip software crashes.

m. T
 Short press PWRKEY or HOMEKEY

.co EN
– INT-> EINT -> software control
– Power-down, sleep mode or the other functions
 Long press shut-down
– Force power-off of PMU

rld FID
– 5/8/11/14s with 50% accuracy
– External reset function with source from:
▪ PWRKEY and HOMEKEY both pressed for long period of time
▪ PWERKEY pressed for long period of time
▪ HOMEKEY pressed for long period of time
wo N
– Software disables watchdog counter
ter CO
wa K
@ TE
xin IA
zli ED

Figure 15: Hardware external shut-down function


M

4.2 Buck Converter (VRF18) with LDO Mode


The figure below shows MT6329 VRF18 buck converter that implements the LDO mode.
 VRF18 provides the LDO mode for lower-cost requirements.
R
FO

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– VRF18 (Buck/LDO: 250/250mA)


 Buck mode: VRF18_FB connects to the output capacitor.

EO
 LDO mode: VRF18_FB connects to VBAT.

US L
cn IA
m. T
.co EN
rld FID
Figure 16: DC/DC and LDO mode HW setting application note

4.3 Buck Converter Un-Use Configuration


wo N

The figure below shows MT6329 VPA and VRF18 buck converter un-use configuration.
ter CO

 For VPA not use configuration


– VBAT_PA connect to VBAT; GND_PA connect to GND
– VPA & VPA_FB: floating
– RG_VPA_EN=0 & RG_VPA_NDIS_EN=1
 For VRF18 not use configuration
wa K

– VBAT_RF18 connect to VBAT; GND_RF18 connect to GND


– VRF18 & VRF18_FB: floating
@ TE

– RG_VRF18_EN=0 & RG_VRF18_NDIS=1


xin IA
zli ED
M

Figure 17: DC/DC un-useconfiguration


R
FO

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5 MT6329 Packaging

EO
US L
5.1 Package Dimensions

cn IA
m. T
.co EN
rld FID
wo N
ter CO
wa K
@ TE
xin IA
zli ED
R M
FO

MediaTek Confidential © 2011 - 2012 MediaTek Inc. Page 96 of 97


This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

Free Datasheet http://www.datasheet4u.com/


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MT6329
PMIC Datasheet

NL
Confidential A

Appendix

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rld FID
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ter CO
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R M
FO

MediaTek Confidential © 2011 - 2012 MediaTek Inc. Page 97 of 97


This document contains information that is proprietary to MediaTek Inc.
Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

Free Datasheet http://www.datasheet4u.com/


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