Data Sheet

A1201, A1202, A1203, and A1204
Continuous-Time Bipolar Switch Family

Features and Benefits
Description
Continuous-time operation
Fast power-on time
Low noise
Stable operation over full operating temperature range
Reverse battery protection
Solid-state reliability
Factory-programmed at end-of-line for optimum
performance
Robust EMC performance
High ESD rating
Regulator stability without a bypass capacitor
The Allegro A1201, A1202, A1203, and A1204 Hall-effect

bipolar switches are next-generation replacements and
extension of the popular Allegro A3134, A3133, and A3132
bipolar switch product line. Overall, the A120x family, produced
with BiCMOS technology, consists of continuous-time devices
that feature fast power-on time and low-noise operation. Device
programming is performed after packaging, to ensure increased
switchpoint accuracy by eliminating offsets that can be induced
by package stress. Unique Hall element geometries and lowoffset amplifiers help to minimize noise and to reduce the
residual offset voltage normally caused by device overmolding,
temperature excursions, and thermal stress.
The A120x Hall-effect bipolar switches include the following on
a single silicon chip: voltage regulator, Hall-voltage generator,
small-signal amplifier, Schmitt trigger, and NMOS output
transistor. The integrated voltage regulator permits operation
from 3.8 to 24 V. The extensive on-board protection circuitry
makes possible a 30 V absolute maximum voltage rating for
superior protection in automotive and motor commutation
Packages: 3 pin SOT23W (suffix LH), and

3 pin SIP (suffix UA)
www.DataSheet4U.com
Continued on the next page

Not to scale
Functional Block Diagram
VCC
To all subcircuits
Regulator
VOUT
Amp
Gain
Offset
Trim
Control
GND
A1201-DS, Rev. 5
A1201, A1202,
A1203, and A1204
Description (continued)
applications, without adding external components. All devices in
the family are identical, except for magnetic switchpoints.
The small geometries of the BiCMOS process allow these devices
to be provided in ultrasmall packages. The package styles available
provide magnetically optimized solutions for most applications.

Package LH is a SOT23W, a miniature low-profile surface-mount
package, while package UA is a three-lead ultramini SIP for throughhole mounting. Each package is lead (Pb) free, with 100% matte
tin plated leadframes.
Selection Guide1
Packing2
Part Number
Mounting
Ambient, TA
A1201ELHLT-T
7-in. reel, 3000 pieces/reel
3-pin SOT23W surface mount
A1201EUA-T
Bulk, 500 pieces/bag
3-pin SIP through hole
A1201LLHLT-T
A1201LUA-T
A1202ELHLT-T
A1202EUA-T
A1202LLHLT-T
A1202LUA-T
A1203ELHLT-T
A1203EUA-T
A1203LLHLT-T
A1203LUA-T
BRP (Min)
BOP (Max)
50
50
75
75
95
95
40C to 85C
40C to 150C
40C to 85C
40C to 150C
40C to 85C
40C to 150C
The variants cited in this footnote are in production but have been determined to be NOT FOR NEW DESIGN. This classification indicates that
sale of this device is currently restricted to existing customer applications. The variants should not be purchased for new design applications
because obsolescence in the near future is probable. Samples are no longer available. Status change: October 31, 2006. These variants include:
A1204ELHLT-T, A1204EUA-T, A1204LLHLT-T, and A1204LUA-T.
2Contact Allegro for additional packing options.
Absolute Maximum Ratings

Characteristic
Symbol
Notes
Rating
Units
Supply Voltage
VCC
30
Reverse Supply Voltage
VRCC
30
Output Off Voltage
VOUT
30
Reverse Output Voltage
VROUT
0.5
IOUTSINK
25
mA
Unlimited
Range E
40 to 85
Range L
Output Current Sink

Magnetic Flux Density
Operating Ambient Temperature
TA
40 to 150
Maximum Junction Temperature
TJ(max)
165
Tstg
65 to 170
Storage Temperature
Allegro MicroSystems, Inc.

115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036 (508) 853-5000
www.allegromicro.com
A1201, A1202,
A1203, and A1204
OPERATING CHARACTERISTICS over full operating voltage and ambient temperature ranges, unless otherwise noted
Characteristic
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Electrical Characteristics
Supply Voltage1
Output Leakage Current
Output On Voltage
Power-On Time2
Output Rise Time3
Output Fall
Time3
Supply Current
Reverse Battery Current
VCC
Operating, TJ < 165C
3.8
24
IOUTOFF
VOUT = 24 V, B < BRP
10
VOUT(SAT)
IOUT = 20 mA, B > BOP
215
400
mV
Slew rate (dVCC/dt) < 2.5 V/s, B > BOP(max) + 5 G

or B < BRP(min) 5 G
tr
VCC = 12 V, RLOAD = 820 , CS = 12 pF
tf
tPO
VCC = 12 V, RLOAD = 820 , CS = 12 pF
ICCON
B > BOP
3.8
7.5
mA
ICCOFF
B < BRP
3.5
7.5
mA
VRCC = 30 V
10
mA
IRCC
Supply Zener Clamp Voltage
VZ
ICC = 30 mA; TA = 25C
32
Supply Zener Current4
IZ
VZ = 32 V; TA = 25C
30
mA
40
15
50
26
75
Magnetic
Characteristics5
A1201
Operate Point
Release Point
BOP
BRP
A1202
A1203
South pole adjacent to branded face

of device
26
95
A1204
100
42
150
A1201
50
15
40
75
26
95
26
150
40
100
A1202
A1203
North pole adjacent to branded face

of device
A1204
Hysteresis
BHYS
A1201
30
55
A1202
30
52
30
52
50
82
115
A1203
BOP BRP
A1204
1
Maximum voltage must be adjusted for power dissipation and junction temperature, see Power Derating section.
For VCC slew rates greater than 250 V/s, and TA = 150C, the Power-On Time can reach its maximum value.
3 C =oscilloscope probe capacitance.
S
4 Maximum current limit is equal to the maximum I
CC(max) + 22 mA.
5 Magnetic flux density, B, is indicated as a negative value for north-polarity magnetic fields, and as a positive value for south-polarity magnetic fields.
This so-called algebraic convention supports arithmetic comparison of north and south polarity values, where the relative strength of the field is indicated
by the absolute value of B, and the sign indicates the polarity of the field (for example, a 100 G field and a 100 G field have equivalent strength, but
opposite polarity).
2
DEVICE QUALIFICATION PROGRAM

Contact Allegro for information.
EMC (Electromagnetic Compatibility) REQUIREMENTS
Contact Allegro for information.

A1201, A1202,
A1203, and A1204
THERMAL CHARACTERISTICS may require derating at maximum conditions, see application information
Characteristic
Symbol
Test Conditions
RJA
Maximum Allowable VCC (V)
Package Thermal Resistance
Value Units
Package LH, 1-layer PCB with copper limited to solder pads
228
C/W
Package LH, 2-layer PCB with 0.463 in.2 of copper area each
side connected by thermal vias
110
C/W
Package UA, 1-layer PCB with copper limited to solder pads
165
C/W
Power Derating Curve

TJ(max) = 165C; ICC = ICC(max)
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
VCC(max)
Package LH, 2-layer PCB

(RQJA = 110 C/W)
Package UA, 1-layer PCB
(RQJA = 165 C/W)
Package LH, 1-layer PCB
(RQJA = 228 C/W)
VCC(min)
20
40
60
80
100
120
140
160
180
Power Dissipation, PD (mW)
Power Dissipation versus Ambient Temperature

1900
1800
1700
1600
1500
1400
1300
1200
1100
1000
900
800
700
600
500
400
300
200
100
0
Pa
(R cka
ge
QJ
A =
L
11 H, 2
0 -la
Pac
C/ ye
W
(R kage
) r PC
UA
QJA =
B
,
165 1-la
C/ yer
W)
PC
B
Pac
k
(R age LH
,
QJA =
228 1-laye
C/W r PC
B
)
20
40
60
80
100
120
Temperature (C)
140
160
180

A1201, A1202,
A1203, and A1204

Characteristic Data
Supply Current (On) versus Ambient Temperature
Supply Current (On) versus Supply Voltage
(A1201/02/03/04)
(A1201/02/03/04)
8.0
7.0
7.0
ICCON (mA)
6.0
VCC (V)
5.0
24
3.8
4.0
3.0
ICCON (mA)
8.0
TA (C)
40
25
150
4.0
3.0
2.0
2.0
1.0
1.0
50
50
TA (C)
100
150
10
15
20
Supply Current (Off) versus Ambient Temperature
Supply Current (Off) versus Supply Voltage
(A1201/02/03/04)
(A1201/02/03/04)
8.0
7.0
7.0
VCC (V)
5.0
24
3.8
4.0
3.0
ICCOFF (mA)
8.0
25
6.0
TA (C)
5.0
40
25
150
4.0
3.0
2.0
2.0
1.0
1.0
0
0
50
50
TA (C)
100
150
15
20
25
Output Voltage (On) versus Supply Voltage
(A1201/02/03/04)
400
10
VCC (V)
Output Voltage (On) versus Ambient Temperature
(A1201/02/03/04)
400
350
350
300
300
250
VCC (V)
200
24
3.8
150
100
50
VOUT(SAT) (mV)
VOUT(SAT) (mV)
VCC (V)
6.0
ICCOFF (mA)
6.0
5.0
TA (C)
250
40
25
150
200
150
100
50
0
50
50
TA (C)
100
150
10
15
20
25
VCC (V)

A1201, A1202,
A1203, and A1204
Operate Point versus Ambient Temperature
Operate Point versus Supply Voltage

(A1201)
(A1201)
50
50
40
40
30
30
20
VCC (V)
10
24
12
3.8
0
-10
BOP (G)
BOP (G)
20
40
25
150
0
-10
-20
-20
-30
-30
-40
TA (C)
10
-40
-50
50
TA (C)
100
150
15
20
25
Release Point versus Supply Voltage

(A1201)
(A1201)
40
40
30
30
20
20
10
10
VCC (V)
24
12
3.8
-10
-20
BRP (G)
BRP (G)
10
VCC (V)
Release Point versus Ambient Temperature
TA (C)
40
25
150
-10
-20
-30
-30
-40
-40
-50
-50
-50
50
100
150
10
15
20
TA (C)
VCC (V)
Hysteresis versus Ambient Temperature
Hysteresis versus Supply Voltage
(A1201)
55
25
(A1201)
55
50
50
45
45
40
40
VCC (V)
35
24
12
3.8
30
25
BHYS (G)
BHYS (G)
40
25
150
30
25
20
20
15
15
10
10
TA (C)
35
5
-50
50
TA (C)
100
150
10
15
20
25
VCC (V)

A1201, A1202,
A1203, and A1204
(A1204)
(A1202, A1203)
150
70
60
100
VCC (V)
40
24
12
3.8
30
A (C)
VT
(V)
CC
50
BOP (G)
BOP (G)
50
40
24
25
12
3.8
150
20
-50
10
0
-100
-50
50
TA (C)
100
150
-50
100
150
(A1204)
(A1202, A1203)
100
-5
-15
50
-25
VCC (V)
-35
24
12
3.8
-45
A (C)
VT
(V)
CC
BRP (G)
BRP (G)
50
TA (C)
40
24
25
12
3.8
150
-50
-55
-100
-65
-75
-150
-50
50
TA (C)
100
-50
150
50
TA (C)
100
150
(A1202, A1203)
80
(A1204)
130
75
120
70
65
110
VCC (V)
60
24
12
3.8
55
50
45
BHYS (G)
BHYS (G)
VCC (V)
100
40
24
12
25
3.8
150
90
80
70
40
60
35
30
50
-50
50
TA (C)
100
150
-50
50
100
150
TA (C)

A1201, A1202,
A1203, and A1204

Functional Description
Bipolar Device Switching

The devices of the A120X family provide highly sensitive
switching for applications using magnetic fields of alternating
polarities, such as ring magnets. There are three switching modes
for bipolar devices, referred to as latch, unipolar switch, and
negative switch. Mode is determined by the switchpoint characteristics of the individual device. The characteristic hysteresis,
BHYS , of the device, is the difference in the relative magnetic
strength and polarity of the switchpoints of the device. (Note
that, in the following descriptions, a negative magnetic value
indicates a north polarity field, and a positive magnetic value
indicates a south polarity field. For a given value of magnetic
strength, BX , the values BX and BX indicate two fields of equal
strength, but opposite polarity. B = 0 indicates the absence of a
magnetic field.)
In contrast to latching, when a device exhibits unipolar switching, it only responds to a south magnetic field. The field must
be of sufficient strength, > BOP , for the device to operate. When
the field is reduced beyond the BRP level, the device switches
back to the high state, as shown in panel B of figure 1. Devices
exhibiting negative switch behavior operate in a similar but
opposite manner. A north polarity field of sufficient strength,
> BRP , (more north than BRP) is required for operation, although
the result is that VOUT switches high, as shown in panel C. When
VS
VCC
Bipolar devices typically behave as latches. In this mode,

magnetic fields of opposite polarity and equivalent strengths
are needed to switch the output. When the magnetic fields are
removed (B 0) the device remains in the same state until a
magnetic field of the opposite polarity and of sufficient strength
causes it to switch. The hysteresis of latch mode behavior is
shown in panel A of figure 1.
(A)
A120x
GND
(D)
(C)
V+
V+
VOUT
Switch to High
Switch to High
VOUT
BHYS
B+
BRP
BRP
B 0
VOUT(SAT)
0
BOP
BHYS
B+
VOUT(SAT)
0
BOP
BOP
BRP
VOUT(SAT)
VCC
Switch to Low
VOUT
VCC
Switch to Low
Switch to Low
Switch to High
VCC
Sensor Output
VOUT
(B)
V+
RL
B+
BHYS
Figure 1. Bipolar Device Output Switching Modes. These behaviors can be exhibited when using a circuit such as that shown in panel D. Panel A
displays the hysteresis when a device exhibits latch mode (note that the BHYS band incorporates B= 0), panel B shows unipolar switch behavior (the
BHYS band is more positive than B = 0), and panel C shows negative switch behavior (the BHYS band is more negative than B = 0). Bipolar devices,
such as the 120x family, can operate in any of the three modes.

A1201, A1202,
A1203, and A1204
the field is reduced beyond the BOP level, the device switches
back to the low state.
Bipolar devices adopt an indeterminate output state when powered-on in the absence of a magnetic field or in a field that lies
within the hysteresis band of the device.
The typical output behavior of the A120x devices is latching.

That is, switching to the low state when the magnetic field at
the Hall sensor exceeds the operate point threshold, BOP . At this
point, the output voltage is VOUT(SAT). When the magnetic field
is reduced to below the release point threshold, BRP , the device
output, VOUT , goes high. The values of the magnetic parameters
are specified in the Magnetic Characteristics table, on page 3.
Note that, as shown in figure 1, these switchpoints can lie in
either north or south polarity ranges.
For more information on Bipolar switches, refer to Application

Note 27705, Understanding Bipolar Hall Effect Sensors.
CONTINUOUS-TIME BENEFITS
Continuous-time devices, such as the A120x family, offer the
fastest available power-on settling time and frequency response.
Due to offsets generated during the IC packaging process,
continuous-time devices typically require programming after
packaging to tighten magnetic parameter distributions. In contrast, chopper-stabilized switches employ an offset cancellation
technique on the chip that eliminates these offsets without the
need for after-packaging programming. The tradeoff is a longer
settling time and reduced frequency response as a result of the
chopper-stabilization offset cancellation algorithm.
The A120x family is designed to attain a small hysteresis, and

thereby provide more sensitive switching. Although this means
that true latching behavior cannot be guaranteed in all cases,
proper switching can be ensured by use of both south and north
magnetic fields, as in a ring magnet. The hysteresis of the A120x
family allows clean switching of the output, even in the presence
of external mechanical vibration and electrical noise.
VCC
t
VOUT
t
Output Sampled
tPO(max)
Figure 2. Continuous-Time Application, B < BRP.. This figure illustrates the use of a quick cycle for chopping VCC in order to conserve battery power.
Position 1, power is applied to the device. Position 2, the output assumes the correct state at a time prior to the maximum Power-On Time, tPO(max).
The case shown is where the correct output state is HIGH . Position 3, tPO(max) has elapsed. The device output is valid. Position 4, after the output is
valid, a control unit reads the output. Position 5, power is removed from the device.

A1201, A1202,
A1203, and A1204
The choice between continuous-time and chopper-stabilized

designs is solely determined by the application. Battery management is an example where continuous-time is often required. In
these applications, VCC is chopped with a very small duty cycle
in order to conserve power (refer to figure 4). The duty cycle
is controlled by the power-on time, tPO, of the device. Because
continuous-time devices have the shorter power-on time, they
are the clear choice for such applications.
For more information on the chopper stabilization technique,
refer to Technical Paper STP 97-10, Monolithic Magnetic Hall
Sensor Using Dynamic Quadrature Offset Cancellation and
Technical Paper STP 99-1, Chopper-Stabilized Amplifiers with a
Track-and-Hold Signal Demodulator.
ADDITIONAL APPLICATIONS INFORMATION

Extensive applications information for Hall-effect sensors is
available in:
Hall-Effect IC Applications Guide, Application Note 27701
Hall-Effect Devices: Gluing, Potting, Encapsulating, Lead
Welding and Lead Forming, Application Note 27703.1
Soldering Methods for Allegros Products SMT and ThroughHole, Application Note 26009
All are provided in Allegro Electronic Data Book, AMS-702,
and the Allegro Web site, www.allegromicro.com.
10

A1201, A1202,
A1203, and A1204

Power Derating
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied power or improving the heat dissipation properties of the
application. This section presents a procedure for correlating
factors affecting operating TJ. (Thermal data is also available on
the Allegro MicroSystems Web site.)
The Package Thermal Resistance, RJA, is a figure of merit summarizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity,
K, of the printed circuit board, including adjacent devices and
traces. Radiation from the die through the device case, RJC, is
relatively small component of RJA. Ambient air temperature,
TA, and air motion are significant external factors, damped by
overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN IIN
(1)
T = PD RJA (2)
TJ = TA + T
Example: Reliability for VCC at TA = 150C, package UA, using

minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
RJA = 165C/W, TJ(max) = 165C, VCC(max) = 24 V, and
ICC(max) = 7.5 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
Tmax = TJ(max) TA = 165 C 150 C = 15 C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = Tmax RJA = 15C 165 C/W = 91 mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ICC(max) = 91 mW 7.5 mA = 12.1 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) VCC(max), then reliable operation between VCC(est) and VCC(max) requires enhanced
RJA. If VCC(est) VCC(max), then operation between VCC(est) and
VCC(max) is reliable under these conditions.
(3)
For example, given common conditions such as: TA= 25C,

VCC = 12 V, ICC = 4 mA, and RJA = 140 C/W, then:
PD = VCC ICC = 12 V 4 mA = 48 mW
T = PD RJA = 48 mW 140 C/W = 7C
TJ = TA + T = 25C + 7C = 32C
A worst-case estimate, PD(max), represents the maximum allowable power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RJA and TA.
11

A1201, A1202,
A1203, and A1204

Package LH, 3-Pin (SOT-23W)
3.00 .118
2.70 .106
0.15 [.006] M C A B
3.04 .120
2.80 .110
A
1.49 .059
NOM
8
0
0.20 .008
0.08 .003
2.10 .083
1.85 .073
Preliminary dimensions, for reference only
Dimensions in millimeters
U.S. Customary dimensions (in.) in brackets, for reference only
(reference JEDEC TO-236 AB, except case width and terminal tip-to-tip)
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
A Hall element (not to scale)
B Active Area Depth 0.28 [.011]
0.96 .038
0.60 .024
0.25 .010
A NOM
2
0.25 .010
3X
SEATING
PLANE
0.10 [.004] C
3X 0.50 .020
0.30 .012
SEATING PLANE
GAUGE PLANE
1.17 .046
0.75 .030
0.20 [.008] M C A B
0.15 .006
0.00 .000
0.95 .037
1.90 .075
Pin-out Diagrams
Package UA
GND
Package LH
3
VOUT
VOUT
GND
VCC
1
VCC
Terminal List
Name
VCC
VOUT
GND
Description
Connects power supply to chip
Output from circuit
Ground
Number
Package LH Package UA
1
1
2
3
3
2
12

A1201, A1202,
A1203, and A1204

Package UA, 3-Pin SIP
.164 4.17
.159 4.04
C
D
.122 3.10
.117 2.97
2.04 .0805
NOM
.062 1.57
.058 1.47
D
.0565 1.44
NOM D
.085 2.16
MAX
.031 0.79
REF
A
.017 0.44
.014 0.35
.640 16.26
.600 15.24
.019 0.48
.014 0.36
.050 1.27
NOM
Dimensions in inches
Metric dimensions (mm) in brackets, for reference only
A Dambar removal protrusion (6X)
B Ejector mark on opposite side
C Active Area Depth .0195 [0.50] NOM
D Hall element (not to scale)
The products described herein are manufactured under one or more of the following U.S. patents: 5,045,920; 5,264,783; 5,442,283; 5,389,889;
5,581,179; 5,517,112; 5,619,137; 5,621,319; 5,650,719; 5,686,894; 5,694,038; 5,729,130; 5,917,320; and other patents pending.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit
improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the
information being relied upon is current.
Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;
nor for any infringement of patents or other rights of third parties which may result from its use.
Copyright 2005, 2006, Allegro MicroSystems, Inc.
13


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Available Formats

A1201, A1202, A1203, and A1204

Continuous-Time Bipolar Switch Family

The Allegro A1201, A1202, A1203, and A1204 Hall-effect

Packages: 3 pin SOT23W (suffix LH), and

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Functional Block Diagram

Continuous-Time Bipolar Switch Family

provide magnetically optimized solutions for most applications.

7-in. reel, 3000 pieces/reel

3-pin SOT23W surface mount

Bulk, 500 pieces/bag

3-pin SIP through hole

7-in. reel, 3000 pieces/reel

3-pin SOT23W surface mount

Bulk, 500 pieces/bag

3-pin SIP through hole

7-in. reel, 3000 pieces/reel

3-pin SOT23W surface mount

Bulk, 500 pieces/bag

3-pin SIP through hole

7-in. reel, 3000 pieces/reel

3-pin SOT23W surface mount

Bulk, 500 pieces/bag

3-pin SIP through hole

7-in. reel, 3000 pieces/reel

3-pin SOT23W surface mount

Bulk, 500 pieces/bag

3-pin SIP through hole

7-in. reel, 3000 pieces/reel

3-pin SOT23W surface mount

Bulk, 500 pieces/bag

3-pin SIP through hole

Absolute Maximum Ratings

Reverse Supply Voltage

Output Off Voltage

Reverse Output Voltage

Output Current Sink

Maximum Junction Temperature

Allegro MicroSystems, Inc.

Continuous-Time Bipolar Switch Family

Operating, TJ < 165C

VOUT = 24 V, B < BRP

IOUT = 20 mA, B > BOP

Slew rate (dVCC/dt) < 2.5 V/s, B > BOP(max) + 5 G

VCC = 12 V, RLOAD = 820 , CS = 12 pF

VCC = 12 V, RLOAD = 820 , CS = 12 pF

Supply Zener Clamp Voltage

ICC = 30 mA; TA = 25C

Supply Zener Current4

South pole adjacent to branded face

North pole adjacent to branded face

DEVICE QUALIFICATION PROGRAM

Allegro MicroSystems, Inc.

Continuous-Time Bipolar Switch Family

Maximum Allowable VCC (V)

Package Thermal Resistance

Package LH, 1-layer PCB with copper limited to solder pads

Package UA, 1-layer PCB with copper limited to solder pads

Power Derating Curve

Package LH, 2-layer PCB