25-W Digital Audio Power Amplifier With Eq and DRC: Features
25-W Digital Audio Power Amplifier With Eq and DRC: Features
25-W Digital Audio Power Amplifier With Eq and DRC: Features
FEATURES
Audio Input/Output 25 W Into an 8- Load From a 20-V Supply Wide PVDD Range, From 8 V to 26 V Supports BTL Configuration With 4- Load Efficient Class-D Operation Eliminates Need for Heatsinks One Serial Audio Input (Two Audio Channels) I2C Address Selection Pin (Chip Select) Single Output Filter PBTL Support Supports 44.1-kHz to 48-kHz Sample Rate (LJ/RJ/I2S) Audio/PWM Processing Independent Channel Volume Controls With Gain of 24 dB to Mute With 0.125-dB Resolution Steps Programmable Two-Band Dynamic-Range Control 18 Programmable Biquads for Speaker EQ and Other Audio-Processing Features Programmable Coefficients for DRC Filters DC Blocking Filters General Features I2C Serial Control Interface Operational Without MCLK Requires Only 3.3 V and PVDD No External Oscillator: Internal Oscillator for Automatic Rate Detection Surface-Mount, 48-Pin HTQFP Package Thermal and Short-Circuit Protection 106-dB SNR, A-Weighted AD, BD, and Ternary Modulation Up to 90% Efficient PWM Level Meter to Measure the Digital Power Profile A Benefits EQ: Speaker Equalization Improves Audio Performance Two-Band DRC: Dynamic Range Compression. Can Be Used As Power Limiter. Enables Speaker Protection, Easy Listening, Night-Mode Listening Autodetect: Automatically Detects Sample-Rate Changes. No Need for External Microprocessor Intervention
APPLICATIONS
LCD TV, LED TV, Soundbar
DESCRIPTION
The TAS5727 is a 25-W, efficient, digital-audio power amplifier for driving stereo bridge-tied speakers. One serial data input allows processing of up to two discrete audio channels and seamless integration to most digital audio processors and MPEG decoders. The device accepts a wide range of input data and data rates. A fully programmable data path routes these channels to the internal speaker drivers. The TAS5727 is a slave-only device receiving all clocks from external sources. The TAS5727 operates with a PWM carrier between a 384-kHz switching rate and a 288-KHz switching rate, depending on the input sample rate. Oversampling combined with a fourth-order noise shaper provides a flat noise floor and excellent dynamic range from 20 Hz to 20 kHz.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
AVDD/DVDD
PVDD
OUT_A
OUT_B I C Control
2
Loop Filter
(1)
PLL_FLTP
PLL_FLTM OUT_D
B0264-10
(1)
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
FUNCTIONAL VIEW
2 HB FET Out
OUT_B
SDIN
S R C
Protection Logic MCLK SCLK LRCLK Sample Rate Autodetect and PLL Microcontroller Based System Control Click and Pop Control
SDA SCL
Serial Control
Terminal Control
B0262-06
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
Power On Reset
AGND
GND
OUT_D
PWM Controller
GVDD Regulator
PWM_C
PWM Rcv
Ctrl
Timing
Gate Drive
Pulldown Resistor
OUT_C
PGND_CD
OUT_B
GVDD Regulator
PGND_AB
OUT_A
PGND_AB
B0034-06
www.ti.com
I C Subaddress in Red
2
0x72 58, 59
272F
0x51[1]
32 clip24
24
26 9BQ
2BQ
1BQ
0x73
0x71
AGL 0x52[1] 5C, 5D 3139 9BQ 2BQ
0x46[0]
0x51[0]
0x76
0x74 v2im1
Vol2
32 clip24
2
24
30
1BQ
0x77
0x75
5E, 5F 2BQ Vol
Level Meter 32
2
32
0x46[1]
5A, 5B 2BQ
TAS5727
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
PGND_CD
48 47 46 45 44 43 42 41 40 39 38 37
NC
PGND_CD
PGND_AB
PGND_AB
OUT_B
OUT_C
BST_C
BST_B
NC
NC
NC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
36 35 34 33 32
OUT_D PVDD_CD PVDD_CD BST_D GVDD_OUT VREG AGND GND DVSS DVDD STEST RESET
TAS5727
31 30 29 28 27 26 25
LRCLK
MCLK
PDN
VR_DIG
SDIN
A_SEL_FAULT
OSC_RES
DVSSO
AVDD
SCLK
SDA
SCL
P0075-12
PIN FUNCTIONS
PIN NAME AGND A_SEL_FAULT NO. 30 14 TYPE (1) P DIO 5-V TERMINATION (2) TOLERANT DESCRIPTION Local analog ground for power stage This pin is monitored on the rising edge of RESET. A value of 0 (15-k pulldown) sets the I2C device address to 0x54 and a value of 1 (15-k pullup) sets it to 0x56. this dual-function pin can be programmed to output internal power-stage errors. 3.3-V analog power supply Analog 3.3-V supply ground High-side bootstrap supply for half-bridge A High-side bootstrap supply for half-bridge B High-side bootstrap supply for half-bridge C High-side bootstrap supply for half-bridge D 3.3-V digital power supply Digital ground
AVDD AVSS BST_A BST_B BST_C BST_D DVDD DVSS (1) (2) 6
13 9 4 43 42 33 27 28
P P P P P P P P
TYPE: A = analog; D = 3.3-V digital; P = power/ground/decoupling; I = input; O = output All pullups are weak pullups and all pulldowns are weak pulldowns. The pullups and pulldowns are included to assure proper input logic levels if the pins are left unconnected (pullups logic 1 input; pulldowns logic 0 input). Submit Documentation Feedback Product Folder Link(s): TAS5727
Copyright 2010, Texas Instruments Incorporated
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
AO O O O O DI DI 5-V Pullup
Oscillator trim resistor. Connect an 18.2-k, 1% resistor to DVSSO. Output, half-bridge A Output, half-bridge B Output, half-bridge C Output, half-bridge D Low means BTL mode; high means PBTL mode. Information goes directly to power stage. Power down, active-low. PDN prepares the device for loss of power supplies by shutting down the noise shaper and initiating the PWM stop sequence. Power ground for half-bridges A and B Power ground for half-bridges C and D PLL negative loop-filter terminal PLL positive loop-filter terminal Power-supply input for half-bridge output A Power-supply input for half-bridge output D 5-V Pullup Reset, active-low. A system reset is generated by applying a logic low to this pin. RESET is an asynchronous control signal that restores the DAP to its default conditions and places the PWM in the hard-mute (high-impedance) state. I2C serial control clock input Pulldown Serial audio-data clock (shift clock). SCLK is the serial-audio-port input-data bit clock. I2C serial control data interface input/output Pulldown Serial audio data input. SDIN supports three discrete (stereo) data formats. Controls ramp time of OUT_x to minimize pop. Leave this pin floating for BD mode. Requires capacitor of 2.2 nF to GND in AD mode. The capacitor determines the ramp time. Factory test pin. Connect directly to DVSS. Internally regulated 1.8-V analog supply voltage. This pin must not be used to power external devices. Internally regulated 1.8-V digital supply voltage. This pin must not be used to power external devices. Digital regulator output. Not to be used for powering external circuitry.
P P AO AO P P DI
24 21 23 22 6
DI DI DIO DI AI
26 12 18 31
DI P P P
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
VALUE Supply voltage 0.3 to 3.6 0.3 to 30 0.5 to DVDD + 0.5 0.5 to DVDD + 2.5 (3) 0.5 to AVDD + 2.5 (3) 32 (4) 43 (4) 20 20 0 to 85 0 to 150 40 to 125
UNIT V V V V V mA mA C C C
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum conditions for extended periods may affect device reliability. 5-V tolerant inputs are PDN, RESET, SCLK, LRCLK, MCLK, SDIN, SDA, and SCL. Maximum pin voltage should not exceed 6 V. DC voltage + peak ac waveform measured at the pin should be below the allowed limit for all conditions.
THERMAL INFORMATION
THERMAL METRIC (1) qJA qJB qJC(bottom) qJC(top) yJT yJB (1) Junction-to-ambient thermal resistance Junction-to-board thermal resistance Junction-to-case (bottom) thermal resistance Junction-to-case (top) thermal resistance Junction-to-top characterization parameter Junction-to-board characterization parameter TAS5727 PHP (48 PINS) 27.9 13 1.1 20.7 0.3 6.7 UNIT C/W C/W C/W C/W C/W C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
Continuous operation above the recommended junction temperature may result in reduced reliability and/or lifetime of the device.
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
MIN 2.4
TYP
MAX
UNIT V
V mA mA
IDD
mA
No load (PVDD_x)
mA
rDS(on)
(2)
TJ = 25C, includes metallization resistance TJ = 25C, includes metallization resistance PVDD falling PVDD rising
Extra temperature drop required to recover from error Overcurrent limit protection Overcurrent response time Internal pulldown resistor at the Connected when drivers are in the high-impedance state output of each half-bridge to provide bootstrap capacitor charge.
IIH for the PBTL pin has a maximum limit of 200 A due to an internal pulldown on the pin. This does not include bond-wire or pin resistance. Specified by design
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
10
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
TEST CONDITIONS CL = 30 pF
TYP
MAX 12.288
UNIT MHz ns ns ns ns
48 50% 50%
kHz
11
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
MAX 400
UNIT kHz ms ms
ns ns ns ns ms ms ms ms pF
tsu1 SDA
th1
T0027-01
SCL
t(buf)
SDA
Start Condition
Stop Condition
T0028-01
12
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
RESET
tw(RESET)
I C Active td(I2C_ready)
I C Active
NOTES: On power up, it is recommended that the TAS5727 RESET be held LOW for at least 100 ms after DVDD has reached 3 V. If RESET is asserted LOW while PDN is LOW, then RESET must continue to be held LOW for at least 100 ms after PDN is deasserted (HIGH).
13
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
THD+N (%)
0.1
0.1
0.01
0.01 PO = 1W PO = 5W PO = 10W 1k Frequency (Hz) 10k 20k 0.001 20 100 1k Frequency (Hz) 10k 20k
0.001
20
100
Figure 6. TEXT FOR SPACING TEXT FOR SPACING TEXT FOR SPACING TEXT FOR SPACING TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY
10 PVDD = 24V RL = 8 TA = 25C 1 1 10 PVDD = 12V RL = 8 TA = 25C
Figure 7. TEXT FOR SPACING TEXT FOR SPACING TEXT FOR SPACING TEXT FOR SPACING TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER
THD+N (%)
0.1
0.1
0.01
0.01 f = 20Hz f = 1kHz f = 10kHz 1k Frequency (Hz) 10k 20k 0.001 0.01 0.1 1 Output Power (W) 10 40
0.001
20
100
Figure 8.
Figure 9.
14
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
THD+N (%)
0.1
0.1
0.01
0.01 f = 20Hz f = 1kHz f = 10kHz 0.001 0.01 0.1 1 Output Power (W) 10 40
0.001 0.01
0.1
10
40
Figure 10. TEXT FOR SPACING TEXT FOR SPACING TEXT FOR SPACING TEXT FOR SPACING CROSSTALK vs FREQUENCY
0 10 20 30 Crosstalk (dB) 40 50 60 70 80 90 100 Crosstalk (dB) VO = 1W PVDD = 12V RL = 8 TA = 25C Right to Left Left to Right 0 10 20 30 40 50 60 70 80 90 100 VO = 1W PVDD = 18V RL = 8 TA = 25C
Figure 11. TEXT FOR SPACING TEXT FOR SPACING TEXT FOR SPACING TEXT FOR SPACING CROSSTALK vs FREQUENCY
Right to Left Left to Right
20
100
1k Frequency (Hz)
10k
20k
20
100
1k Frequency (Hz)
10k
20k
Figure 12.
Figure 13.
15
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
20
100
1k Frequency (Hz)
10k
20k
Figure 14.
16
TAS5727
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FAULT INDICATION
A_SEL_FAULT is an input pin during power up. This pin can be programmed after RESET to be an output by writing 1 to bit 0 of I2C register 0x05. In that mode, the A_SEL_FAULT pin has the definition shown in Table 1. Any fault resulting in device shutdown is signaled by the A_SEL_FAULT pin going low (see Table 1). A latched version of this pin is available on D1 of register 0x02. This bit can be reset only by an I2C write.
17
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
SSTIMER FUNCTIONALITY
The SSTIMER pin uses a capacitor connected between this pin and ground to control the output duty cycle when exiting all-channel shutdown. The capacitor on the SSTIMER pin is slowly charged through an internal current source, and the charge time determines the rate at which the output transitions from a near-zero duty cycle to the desired duty cycle. This allows for a smooth transition that minimizes audible pops and clicks. When the part is shut down, the drivers are placed in the high-impedance state and transition slowly down through a 3-k resistor, similarly minimizing pops and clicks. The shutdown transition time is independent of the SSTIMER pin capacitance. Larger capacitors increase the start-up time, while capacitors smaller than 2.2 nF decrease the start-up time. The SSTIMER pin should be left floating for BD modulation.
PWM SECTION
The TAS5727 DAP device uses noise-shaping and customized nonlinear correction algorithms to achieve high power efficiency and high-performance digital audio reproduction. The DAP uses a fourth-order noise shaper to increase dynamic range and SNR in the audio band. The PWM section accepts 24-bit PCM data from the DAP and outputs two BTL PWM audio output channels. The PWM section has individual-channel dc-blocking filters that can be enabled and disabled. The filter cutoff frequency is less than 1 Hz. Individual-channel de-emphasis filters for 44.1 kHz and 48 kHz are included and can be enabled and disabled. Finally, the PWM section has an adjustable maximum modulation limit of 93.8% to 99.2%. For a detailed description of using audio processing features like DRC and EQ, see the User's Guide and TAS570X GDE software development tool documentation.
18
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
Left Channel
Right Channel
SCLK
SCLK
LSB
MSB
LSB
23 22
19 18
15 14
0
T0034-01
19
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
2-Channel I S (Philips Format) Stereo Input/Output (24-Bit Transfer Word Size) 24 Clks 24 Clks
LRCLK
Left Channel
Right Channel
SCLK
SCLK
LSB
MSB
LSB
23 22
17 16
19 18
13 12
15 14
0
T0092-01
LRCLK
Left Channel
Right Channel
SCLK
SCLK
LSB
MSB
LSB
15 14 13 12
11 10
1
T0266-01
Figure 18. I2S 32-fS Format Left-Justified Left-justified (LJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at 32, 48, or 64 fS is used to clock in the data. The first bit of data appears on the data lines at the same time LRCLK toggles. The data is written MSB-first and is valid on the rising edge of the bit clock. The DAP masks unused trailing data bit positions.
20 Submit Documentation Feedback Product Folder Link(s): TAS5727
Copyright 2010, Texas Instruments Incorporated
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
2-Channel Left-Justified Stereo Input 32 Clks LRCLK Left Channel Right Channel 32 Clks
SCLK
SCLK
LSB
MSB
LSB
23 22
19 18
15 14
0
T0034-02
SCLK
SCLK
LSB
MSB
LSB
23 22
21
17 16
13 12
19 18 17
13 12
21
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
2-Channel Left-Justified Stereo Input 16 Clks LRCLK Left Channel Right Channel 16 Clks
SCLK
SCLK
LSB
MSB
LSB
15 14 13 12
11 10
0
T0266-02
Figure 21. Left-Justified 32-fS Format Right-Justified Right-justified (RJ) timing uses LRCLK to define when the data being transmitted is for the left channel and when it is for the right channel. LRCLK is high for the left channel and low for the right channel. A bit clock running at 32, 48, or 64 fS is used to clock in the data. The first bit of data appears on the data 8 bit-clock periods (for 24-bit data) after LRCLK toggles. In RJ mode, the LSB of data is always clocked by the last bit clock before LRCLK transitions. The data is written MSB-first and is valid on the rising edge of bit clock. The DAP masks unused leading data bit positions.
2-Channel Right-Justified (Sony Format) Stereo Input 32 Clks LRCLK Left Channel Right Channel 32 Clks
SCLK
SCLK
LSB
MSB
LSB
23 22
19 18
15 14
19 18
15 14
15 14
0
T0034-03
22
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
2-Channel Right-Justified Stereo Input (24-Bit Transfer Word Size) 24 Clks LRCLK Left Channel Right Channel 24 Clks
SCLK
SCLK
LSB
MSB
LSB
23 22
19 18
15 14
19 18
15 14
15 14
0
T0092-03
23
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
SDA
Figure 25. Typical I2C Sequence There is no limit on the number of bytes that can be transmitted between start and stop conditions. When the last word transfers, the master generates a stop condition to release the bus. A generic data transfer sequence is shown in Figure 25. The 7-bit address for TAS5715 is 0101 010 (0x54) or 0101 011 (0x56) defined by A_SEL (external pulldown for 0x54 and pullup for 0x56). Single- and Multiple-Byte Transfers The serial control interface supports both single-byte and multiple-byte read/write operations for subaddresses 0x00 to 0x1F. However, for the subaddresses 0x20 to 0xFF, the serial control interface supports only multiple-byte read/write operations (in multiples of 4 bytes). During multiple-byte read operations, the DAP responds with data, a byte at a time, starting at the subaddress assigned, as long as the master device continues to respond with acknowledges. If a particular subaddress does not contain 32 bits, the unused bits are read as logic 0. During multiple-byte write operations, the DAP compares the number of bytes transmitted to the number of bytes that are required for each specific subaddress. For example, if a write command is received for a biquad subaddress, the DAP must receive five 32-bit words. If fewer than five 32-bit data words have been received when a stop command (or another start command) is received, the received data is discarded.
24 Submit Documentation Feedback Product Folder Link(s): TAS5727
Copyright 2010, Texas Instruments Incorporated
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
Supplying a subaddress for each subaddress transaction is referred to as random I2C addressing. The TAS5727 also supports sequential I2C addressing. For write transactions, if a subaddress is issued followed by data for that subaddress and the 15 subaddresses that follow, a sequential I2C write transaction has taken place, and the data for all 16 subaddresses is successfully received by the TAS5727. For I2C sequential-write transactions, the subaddress then serves as the start address, and the amount of data subsequently transmitted, before a stop or start is transmitted, determines how many subaddresses are written. As was true for random addressing, sequential addressing requires that a complete set of data be transmitted. If only a partial set of data is written to the last subaddress, the data for the last subaddress is discarded. However, all other data written is accepted; only the incomplete data is discarded. Single-Byte Write As shown in Figure 26, a single-byte data-write transfer begins with the master device transmitting a start condition followed by the I2C device address and the read/write bit. The read/write bit determines the direction of the data transfer. For a data-write transfer, the read/write bit is a 0. After receiving the correct I2C device address and the read/write bit, the DAP responds with an acknowledge bit. Next, the master transmits the address byte or bytes corresponding to the TAS5727 internal memory address being accessed. After receiving the address byte, the TAS5727 again responds with an acknowledge bit. Next, the master device transmits the data byte to be written to the memory address being accessed. After receiving the data byte, the TAS5727 again responds with an acknowledge bit. Finally, the master device transmits a stop condition to complete the single-byte data-write transfer.
Start Condition Acknowledge Acknowledge Acknowledge
A6
A5
A4
A3
A2
A1
A0
R/W ACK A7
A6
A5
A4
A3
A2
A1
A0 ACK D7
D6
D5
D4
D3
D2
D1
D0 ACK
Subaddress
Data Byte
Stop Condition
T0036-01
Figure 26. Single-Byte Write Transfer Multiple-Byte Write A multiple-byte data-write transfer is identical to a single-byte data-write transfer except that multiple data bytes are transmitted by the master device to the DAP as shown in Figure 27. After receiving each data byte, the TAS5727 responds with an acknowledge bit.
Start Condition Acknowledge Acknowledge Acknowledge Acknowledge Acknowledge
A6
A5
A1
A0 R/W ACK A7
A6
A5
A4
A3
A1
A0 ACK D7
D0 ACK D7
D0 ACK D7
D0 ACK
Subaddress
Stop Condition
T0036-02
25
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
Single-Byte Read As shown in Figure 28, a single-byte data-read transfer begins with the master device transmitting a start condition, followed by the I2C device address and the read/write bit. For the data read transfer, both a write followed by a read are actually done. Initially, a write is done to transfer the address byte or bytes of the internal memory address to be read. As a result, the read/write bit becomes a 0. After receiving the TAS5727 address and the read/write bit, TAS5727 responds with an acknowledge bit. In addition, after sending the internal memory address byte or bytes, the master device transmits another start condition followed by the TAS5727 address and the read/write bit again. This time, the read/write bit becomes a 1, indicating a read transfer. After receiving the address and the read/write bit, the TAS5727 again responds with an acknowledge bit. Next, the TAS5727 transmits the data byte from the memory address being read. After receiving the data byte, the master device transmits a not-acknowledge followed by a stop condition to complete the single-byte data-read transfer.
Start Condition Repeat Start Condition Acknowledge Acknowledge Acknowledge Not Acknowledge
A6
A5
A1
A0 R/W ACK A7
A6
A5
A4
A0 ACK
A6
A5
A1
A0 R/W ACK D7
D6
D1
D0 ACK
Subaddress
Data Byte
Stop Condition
T0036-03
Figure 28. Single-Byte Read Transfer Multiple-Byte Read A multiple-byte data-read transfer is identical to a single-byte data-read transfer except that multiple data bytes are transmitted by the TAS5727 to the master device as shown in Figure 29. Except for the last data byte, the master device responds with an acknowledge bit after receiving each data byte.
Start Condition Repeat Start Condition Acknowledge Acknowledge Acknowledge Acknowledge Acknowledge Not Acknowledge
A6
A0 R/W ACK A7
A6
A5
A0 ACK
A6
A0 R/W ACK D7
D0 ACK D7
D0 ACK D7
D0 ACK
Subaddress
Stop Condition
T0036-04
26
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
Professional-quality dynamic range compression automatically adjusts volume to flatten volume level. Each DRC has adjustable threshold levels. Programmable attack and decay time constants Transparent compression: compressors can attack fast enough to avoid apparent clipping before engaging, and decay times can be set slow enough to avoid pumping.
T 0x3B 0x3E
S
a w Z
1
B0265-04
27
TAS5727
SLOS670 NOVEMBER 2010 www.ti.com
Z Ch1 ABS a
rms
1a
Z Ch2 ABS a
rms
Bit
2 2
Bit Bit
1 0
S_xx.xxxx_xxxx_xxxx_xxxx_xxxx_xxx
M0125-01
Figure 33. 3.23 Format The decimal value of a 3.23 format number can be found by following the weighting shown in Figure 33. If the most significant bit is logic 0, the number is a positive number, and the weighting shown yields the correct number. If the most significant bit is a logic 1, then the number is a negative number. In this case every bit must be inverted, a 1 added to the result, and then the weighting shown in Figure 34 applied to obtain the magnitude of the negative number.
2 Bit
1
2 Bit
Bit
Bit
23
Bit
(1 or 0) 2 + (1 or 0) 2 + (1 or 0) 2
+ ....... (1 or 0) 2
+ ....... (1 or 0) 2
23
M0126-01
28
TAS5727
www.ti.com SLOS670 NOVEMBER 2010
Gain coefficients, entered via the I2C bus, must be entered as 32-bit binary numbers. The format of the 32-bit number (4-byte or 8-digit hexadecimal number) is shown in Figure 35.
Sign Bit Fraction Digit 1 Fraction Digit 2 Fraction Digit 3 Fraction Digit 4 Fraction Digit 5 Fraction Digit 6
Integer Digit 1 u u u u u u S x
x. x x x
x x x x
x x x x
x x x x
x x x x
x x x x 0
Coefficient Digit 8
Coefficient Digit 7
Coefficient Digit 6
Coefficient Digit 5
Coefficient Digit 4
Coefficient Digit 3
Coefficient Digit 2
Coefficient Digit 1
Figure 35. Alignment of 3.23 Coefficient in 32-Bit I2C Word Table 2. Sample Calculation for 3.23 Format
db 0 5 5 X Linear 1 1.77 0.56 L = 10(X/20) Decimal 8,388,608 14,917,288 4,717,260 D = 8,388,608 L Hex (3.23 Format) 80 0000 00E3 9EA8 0047 FACC H = dec2hex (D, 8)
29
30
Initialization Shutdown Normal Operation Powerdown 3V 2 ms Trim
(2)
TAS5727
AVDD/DVDD
3V
0 ns
PDN
0 ns
I C
SCL SDA
2 ms 0 ns
RESET
13.5 ms
100 ms
tPLL
(1)
2 ms 8V 6V 8V 6V
100 s
PVDD
(1) tPLL has to be greater than 240 ms + 1.3 tstart. This constraint only applies to the first trim command following AVDD/DVDD power-up. It does not apply to trim commands following subsequent resets. (2) tstart/tstop = PWM start/stop time as defined in register 0X1A
T0419-06
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TAS5727
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AVDD/DVDD 0 ns
3V
PDN
2 ms
0 ns I C 2 ms
2
RESET 2 ms PVDD 8V 6V
T0420-05
0 ns
Figure 37. Power-Loss Sequence Initialization Sequence Use the following sequence to power up and initialize the device: 1. 2. Hold all digital inputs low and ramp up AVDD/DVDD to at least 3 V. Initialize digital inputs and PVDD supply as follows: Drive RESET = 0, PDN = 1, and other digital inputs to their desired state while ensuring that all are never more than 2.5 V above AVDD/DVDD. Wait at least 100 s, drive RESET = 1, and wait at least another 13.5 ms. Ramp up PVDD to at least 8 V while ensuring that it remains below 6 V for at least 100 s after AVDD/DVDD reaches 3 V. Then wait at least another 10 s.
3. 4. 5. 6.
Trim oscillator (write 0x00 to register 0x1B) and wait at least 50 ms. Configure the DAP via I2C (see User's Guide for typical values). Configure remaining registers. Exit shutdown (sequence defined below).
Normal Operation The following are the only events supported during normal operation: 1. 2. 3. Writes to master/channel volume registers Writes to soft-mute register Enter and exit shutdown (sequence defined below)
Note: Event 3 is not supported for 240 ms + 1.3 tstart after trim following AVDD/DVDD power-up ramp (where tstart is specified by register 0x1A).
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Shutdown Sequence Enter: 1. 2. 3. Exit: 1. 2. 3. Write 0x00 to register 0x05 (exit shutdown command may not be serviced for as much as 240 ms after trim following AVDD/DVDD power-up ramp). Wait at least 1 ms + 1.3 tstart (where tstart is specified by register 0x1A). Proceed with normal operation. Write 0x40 to register 0x05. Wait at least 1 ms + 1.3 tstop (where tstop is specified by register 0x1A). If desired, reconfigure by returning to step 4 of initialization sequence.
Power-Down Sequence Use the following sequence to power down the device and its supplies: 1. 2. 3. If time permits, enter shutdown (sequence defined above); else, in case of sudden power loss, assert PDN = 0 and wait at least 2 ms. Assert RESET = 0. Drive digital inputs low and ramp down PVDD supply as follows: 4. Drive all digital inputs low after RESET has been low for at least 2 s. Ramp down PVDD while ensuring that it remains above 8 V until RESET has been low for at least 2 s.
Ramp down AVDD/DVDD while ensuring that it remains above 3 V until PVDD is below 6 V and that it is never more than 2.5 V below the digital inputs.
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INITIALIZATION VALUE 0x6C 0x43 0x00 0x80 0x05 0x40 0x00 0xFF (mute) 0x30 (0 dB) 0x30 (0 dB) 0x30 (0 dB) 0x90 0x02 0xAC 0x54 0xAC 0x54 0x0F 0x82 0x02
0x00 0x01 0x02 0x03 0x04 0x05 0x06 0x07 0x08 0x09 0x0A 0x0B0x0D 0x0E 0x0F 0x10 0x11 0x12 0x13 0x14 0x150x19 0x1A 0x1B 0x1C 0x1D0x1F 0x20 0x21 0x220x24 0x25 0x26
Clock control register Device ID register Error status register System control register 1 Serial data interface register System control register 2 Soft mute register Master volume Channel 1 vol Channel 2 vol Channel 3 vol
Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Reserved (1) Description shown in subsequent section Reserved
(1)
Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Description shown in subsequent section Reserved (1)
0x0001 7772 0x0000 4303 0x0102 1345 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000
Description shown in subsequent section u[31:26], b0[25:0] u[31:26], b1[25:0] u[31:26], b2[25:0] u[31:26], a1[25:0] u[31:26], a2[25:0]
0x27
ch1_bq[1]
20
u[31:26], b0[25:0] u[31:26], b1[25:0] u[31:26], b2[25:0] u[31:26], a1[25:0] u[31:26], a2[25:0]
0x28
ch1_bq[2]
20
u[31:26], b0[25:0] u[31:26], b1[25:0] u[31:26], b2[25:0] u[31:26], a1[25:0] u[31:26], a2[25:0]
(1)
Reserved registers should not be accessed. Submit Documentation Feedback Product Folder Link(s): TAS5727 33
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INITIALIZATION VALUE 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0008 0000 0x0078 0000 0x0000 0100 0xFFFF FF00
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CONTENTS
INITIALIZATION VALUE 0x0008 0000 0xFFF8 0000 0x0008 0000 0xFFF8 0000 0x0800 0000 0x0074 0000 0x0000 0000 0x0000 0006 0x0F70 8000 0x0080 0000 0x0000 0000 0x0080 0000 0x0000 0000
T2[31:0] (9.23 format) Reserved (3) Description shown in subsequent section Reserved
(3)
u[31:4], src[3:0] Description shown in subsequent section Ch 1 output mix1[1] Ch 1 output mix1[0] Ch 2 output mix2[1] Ch 2 output mix2[0] Reserved (3) Reserved (3) u[31:26], post[25:0] u[31:26], pre[25:0] (9.17 format) u[31:26], b0[25:0] u[31:26], b1[25:0] u[31:26], b2[25:0] u[31:26], a1[25:0] u[31:26], a2[25:0]
0x0080 0000 0x0002 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000
0x59
ch1_bq[11]
20
u[31:26], b0[25:0] u[31:26], b1[25:0] u[31:26], b2[25:0] u[31:26], a1[25:0] u[31:26], a2[25:0]
0x5A
ch4_bq[0]
20
u[31:26], b0[25:0] u[31:26], b1[25:0] u[31:26], b2[25:0] u[31:26], a1[25:0] u[31:26], a2[25:0]
0x5B
ch4_bq[1]
20
u[31:26], b0[25:0] u[31:26], b1[25:0] u[31:26], b2[25:0] u[31:26], a1[25:0] u[31:26], a2[25:0]
(3)
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INITIALIZATION VALUE 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0080 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0000 0x0000 0080
All DAP coefficients are 3.23 format unless specified otherwise. Registers 0x3B through 0x46 should be altered only during the initialization phase.
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FUNCTION
Default values are in bold. Only available for 44.1-kHz and 48-kHz rates Rate only available for 32/44.1/48-KHz sample rates Not available at 8 kHz
FUNCTION
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FUNCTION
Soft unmute on recovery from clock error (1) Hard unmute on recovery from clock error Reserved (1) Reserved (1) Reserved (1) No de-emphasis (1) De-emphasis for fS = 32 kHz De-emphasis for fS = 44.1 kHz De-emphasis for fS = 48 kHz
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WORD LENGTH 16 20 24 16 20 24 16 20 24
D7D4 0000 0000 0000 000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000
D3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1
D2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
D1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1
D0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
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Ternary modulation is disabled by default. To enable ternary modulation, the following writes are required before bringing the system out of shutdown: 1. Set bit D3 of register 0x05 to 1. 2. Write the following ICD settings: (a) 0x11= 80 (b) 0x12= 7C (c) 0x13= 80 (d) 0x24 =7C 3. Set the input mux register as follows: (a) 0x20 = 00 89 77 72
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In two-band DRC, register 0x0A should be set to 0x30 and register 0x0E bits 6 and 5 should be set to 1. Table 13. Volume Configuration Register (0x0E)
D7 1 (1) D6 0 1 D5 0 1 D4 1 D3 0 D2 0 0 0 0 1 D1 0 0 1 1 X D0 0 1 0 1 X Reserved (1) DRC2 volume 1 (ch4) from I2C register 0x08 DRC2 volume 1 (ch4) from I2C register 0x0A (1) DRC2 volume 2 (ch3) from I2C register 0x09 DRC2 volume 2 (ch3) from I2C register 0x0A (1) Reserved (1) Volume slew 512 steps (43 ms volume ramp time at 48 kHz) (1) Volume slew 1024 steps (85-ms volume ramp time at 48 kHz) Volume slew 2048 steps (171-ms volume ramp time at 48 kHz) Volume slew 256 steps (21-ms volume ramp time at 48 kHz) Reserved FUNCTION
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ICD settings have high impact on audio performance (e.g., dynamic range, THD, crosstalk, etc.) Therefore, appropriate ICD settings must be used. By default, the device has ICD settings for the AD mode. If used in BD mode, then update these registers before coming out of all-channel shutdown.
MODE 0x11 0x12 0x13 0x14 AD MODE AC 54 AC 54 BD MODE B8 60 A0 48
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FUNCTION
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This register can be written only with a non-reserved value. Also this register can be written once after the reset. Default values are in bold.
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FUNCTION Reserved (1) FUNCTION Channel-1 AD mode Channel-1 BD mode SDIN-L to channel 1 (1) SDIN-R to channel 1 Reserved Reserved Reserved Reserved Ground (0) to channel 1 Reserved Channel 2 AD mode (1) Channel 2 BD mode SDIN-L to channel 2 SDIN-R to channel 2 (1) Reserved Reserved Reserved Reserved Ground (0) to channel 2 Reserved FUNCTION Reserved (1) FUNCTION
(1)
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FUNCTION Reserved (1) FUNCTION Reserved (1) FUNCTION Reserved (L + R)/2 Left-channel post-BQ (1) FUNCTION
(1)
Note that channels are encoded so that channel 1 = 0x00, channel 2 = 0x01, , channel 4 = 0x03. Table 22. PWM Output Mux Register (0x25)
D31 0 D23 0 (1) D30 0 D22 0 D29 0 D21 0 0 1 1 D28 0 D20 0 1 0 1 D27 0 D19 0 D26 0 D18 0 D25 0 D17 0 0 1 1 D24 1 D16 0 1 0 1 Reserved
(1)
FUNCTION Reserved (1) FUNCTION Multiplex channel 1 to OUT_A (1) Multiplex channel 2 to OUT_A Multiplex channel 1 to OUT_A Multiplex channel 2 to OUT_A Reserved (1) Multiplex channel 1 to OUT_B Multiplex channel 2 to OUT_B Multiplex channel 1 to OUT_B (1) Multiplex channel 2 to OUT_B
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FUNCTION
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FUNCTION
FUNCTION Reserved
(1)
FUNCTION Reserved (1) FUNCTION Reserved (1) FUNCTION EQ OFF (bypass BQ 07 of channels 1 and 2) Reserved (1) Ignore bank-mapping in bits D31D8. Use default mapping. (1) Use bank-mapping in bits D31D8. L and R can be written independently. (1) L and R are ganged for EQ biquads; a write to the left-channel biquad is also written to the right-channel biquad. (0x290x2F is ganged to 0x300x36. Also, 0x580x5B is ganged to 0x5C0x5F. Reserved (1) No bank switching. All updates to DAP (1) Configure bank 1 (32 kHz by default) Reserved Reserved
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PACKAGING INFORMATION
Orderable Device TAS5727PHP TAS5727PHPR Status
(1)
Pins 48 48
Eco Plan
(2)
(3)
ACTIVE ACTIVE
(1)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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Addendum-Page 1
Device
SPQ
Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 16.4 9.6
B0 (mm) 9.6
K0 (mm) 1.5
P1 (mm) 12.0
TAS5727PHPR
1000
Pack Materials-Page 1
Device TAS5727PHPR
Pins 48
SPQ 1000
Pack Materials-Page 2
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