It was an honor representing Renesas Electronics at TSMC open innovation platform ecosystem forum - High energy, 500+ people in the room, probably the same on phone.
This tells us everything about how critical chiplet technology is to keep pushing at the frontiers of Moore’s law - how many new industries it will change, business models it will create - and new way of doing things it is leading to.
The bigger the promise, the more is the engineering responsibility - it will take a village to get this right.
Especially for automotive - the work in front of us is a broad span - At least the first 5 areas we are working intensely are -
1. New interconnect and SOC architecture
2. Achieving optimized software and dataflows for NUMA orchestration where memory space spans across devices with varying latencies
3. standardizing UCIe-S and advanced to achieve 10-20x better picoJoules per bit of data
4. developing new EDA flows needed for ensuring reliability - electrical and mechanical
5. functional safety of ASIL D class with complete freedom from interference
Renesas, TSMC and many other friends working together to get this to production in the cars - very soon.
Reach out to me - if you are interested in working at system level of architecture or packaging for chiplets in advanced nodes
Reach out - if you have suggestions on collaborating and how we can do this better for the industry on the whole
Chiplet technology is helping accelerate Software-Defined Vehicle (SDV) innovation and shape the future of automotive intelligence. Recently, Aish Dubey, Vice President & General Manager of the High Performance Computing SoC Business Division at Renesas, gave an insightful keynote on the future of SDVs at TSMC’s Open Innovation Platform Ecosystem Forum in Tokyo.
Learn more about our leading-edge automotive solutions: https://bit.ly/40CId84
#SoC #Chiplets #SDV #TSMCOIP2024
