The IEEE EPS - IEEE Electronics Packaging Society is organizing the IEEE Hybrid Bonding Symposium - Enabling Hybrid Bonding Commercialization on 16-17 January 2025 at the SEMI HQ in Milpitas, CA! See the prelimary agenda at https://lnkd.in/gRrUauZX Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas. Registration is now open: https://lnkd.in/gh4n6GEV SIGN UP TODAY! (Early-bird rates through Dec. 20th) William Chen Ravi Mahajan Paul Wesling Paul Trio Annette Teng Benson Chan Nancy Stoffel Applied Materials TOKYO ELECTRON LIMITED Adeia Sigray, Inc. Besi Netherlands B.V. EV Group Brewer Science Beth Keser, Ph.D. Patrick Thompson David McCann Eric Perfecto Alan Huffman Denise Manning Manfred (Fred) Schindler Dalma Novak Don Tan
Annette Teng
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Do plan on attending this west coast inaugural event. Great networking opportunities and great food will be provided.
Paul Wesling
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This is a great chance to focus on this technology for high-density interconnects, with a lineup of the key companies and tech leaders. We hope to see many of you at the Symposium in Silicon Valley! Visit https://attend.ieee.org/hbs for the Advance Program.
See you there!
Boeing Technical Fellow | 2024 IEEE-USA President-Elect
2wFollow our activities in the IEEE Heterogenous Integration Roadmap at https://eps.ieee.org/technology/heterogeneous-integration-roadmap.html