Solderstar - Smart Profiling Solutions’ Post

Data visualisation transforms complex manufacturing insights into clear, actionable intelligence. The Reflow Shuttle delivers unprecedented transparency through advanced parameter tracking. Four critical dimensions of process verification that should be measured include: Oxygen Analysis: Zone-by-zone O2 measurement pinpoints nitrogen leakage, displaying precise PPM levels alongside oven zone diagrams. Detect subtle process variations that impact solder quality instantly. Vibration Mapping: Capture 3-axis machine dynamics with precision. Visualise how fan speeds, conveyor performance, and extraction systems influence process stability in real-time. Temperature Profiling: Comprehensive sensor arrays measure top and bottom heater performance, revealing thermal uniformity across entire heated zones. Independent sensor measurements expose even the most subtle temperature variations. Vacuum Monitoring: Optional modules verify vacuum levels down to 10 mbar, calculating critical parameters like hold time, pull-down, and release rates. Prevent component shift with graphic overlays of vacuum and temperature profiles. To find out more visit www.solderstar.com #ElectronicsManufacturing #ProcessControl #DataVisualisation #ThermalProfile #PCB

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