Powell Industries Inc.’s Post

Did you know that none (that's 0%) of the world's major microelectronics high-density build-up (HDBU) substrate suppliers are based in the U.S.A? Don't believe us? Check out the table below from TechSearch International from their 2022 market report. In Philip Garrou's latest blog post, he explains why, and he also shares some exciting news that's geared to change all that. SPOILER ALERT: According to Phil, the United States Department of Defense has awarded funds to Calumet Electronics Corporation and GreenSource Fabrication to increase the production of IC substrates, high-density substrates, and high-density build-up substrates. Read the full story here: https://lnkd.in/gpDJZrRG

We are excited to be presenting at our first Semiconductor focused conference this Wednesday Valentines Day (2/14) https://lnkd.in/gSnPY_PC .  We will showcase how Silver Nanowire (AgNW) and Chemical Sintering (Nanoglue) technologies: · Improve the Electrical and Thermal conductivity of inks, interconnects, and electrodes by ~ 10x (with the same Silver loading) · Enable totally new materials like ECAs and composites achieving~ 10^-3 Ω･cm (~1000S/cm) @ < 5wt% Silver, > 95 wt% Resin (competitive commercial ECAs use ~ 10X more Silver) · Engender conformable, re-shapable, and pliable conductors composed of highly loaded AgNW dispersions which can achieve 10^-4 Ω･cm  (10,000 S/cm) despite containing > 30% solvent!  

Advanced materials support everything from your mobile phones to the satellites that link them. Yesterday, we attended an exhibition hosted by the Society for the Advancement of Material and Process Engineering (SAMPE) to learn more about the latest advancements in the field. Thanks to everyone who stopped by to discuss their challenges and explore how our cutting-edge alloys and composites can drive exceptional performance. Learn more on our website www.materion.com #materialscience #advancedmaterials #materialengineering #EnablingWhatsNext

Excited to present next week all about the requirements for Objective Evidence as required by changes to IPC J-STD-001. Objective Evidence is the evolution of test methods that have been used since the 70’s! I don’t need to tell anyone that electronics has changed since then… It focuses on the effects of Electro Chemical Migration (ECM) which is a major failure point in PCB’s, especially as packaging and components are getting smaller and smaller. We focus on process control tools which provide empirical data to ensure reliability of PCB’s.

#RequestforNetworkInsight | The RNI was just released for the SiC HV DEVICES opportunity. This S2MARTS announcement is intended to survey U.S. companies in the silicon carbide defense supply chain through NSTXL’s Innovation Network. The objective is to gather information related to the extent that U.S. companies have developed, or are willing to develop, technical and manufacturing capabilities specific to the silicon carbide (SiC) power semiconductor device supply chain, including substrates, epitaxy, device processing steps, packaging, and modules for > 5kV devices; and company plans for future development and sales of such devices for commercial and defense applications. Universities and industry consortia with interest in such programs are also welcome to respond. Learn more about the SiC HV DEVICES RNI here: https://lnkd.in/eHDbXFwe

I am thrilled to share my current article, published in “ACS Applied Materials & Interfaces” at American Chemical Society. Our research focused on improving the performance of wafer-scale 3D heterogenous integration via NHC self-assembled nanolayers. In particular, we succeeded in Cu/polymer bonding at the 170°C, resulting the low-temperature bonding , robust corrosion inhibition, enhanced electrical conductivity, back-end-of-line process compatibility, and fabrication process reduction. This will provide a solution for the conventional Cu/SiO2 hybrid bonding, which suffers from the different coefficient of thermal expansion. Based on this research, NHC Cu/polymer bonding provides versatile advances in 3D heterogeneous integration, indicating that NHC Cu/polymer bonding can be utilized as a platform for future 3D vertical chip architectures. Thanks to Gunhoo Woo, Gyu Young Lee, Park Systems and 양자나노과학 연구단. Check the full-text of this article in American Chemical Society. https://lnkd.in/gWFCaE4q

Potential supply issues have optics manufacturers and the U.S. government looking at alternative materials to head off disaster; here, we take a look at one DoD-approved alternative material with promising results. 🔽 LightPath Technologies Peter Fretty #LaserFocusWorld #Optics #Manufacturing

As electronicaFair approaches, schedules are filling up! I'll be at Rochester Electronics, LLC, Hall C4 Stand 161 from Tuesday to Thursday. If you're interested in learning how Rochester Electronics EMEA can help mitigate obsolescence risks on your BOMs, let's connect. Feel free to book a meeting via DM, comment, or using the appointment tab on my profile. Let's chat about obsolescence solutions for the present and future because Obsolescence is here to stay. See you at the fair! #semiconductor #obsolete #risk #supplychain #electronics

Dr. Kunal Shah, PhD. from Lilotree talks about The Importance of Precious Metals in Electronics Manufacturing. View the full episode (# 93) here: https://lnkd.in/gFgufsgM #reliabilitymatters #reliability #surfacefinish

The Metal Organic Chemical Vapor Deposition (MOCVD) Market is evolving rapidly, driven by innovations in semiconductor and optoelectronic technologies. Key players in this space are leading the charge with their advanced solutions and technologies. Let’s spotlight some of the trailblazers making significant contributions to this dynamic field. 🌐 Industry Leaders Driving Innovation: AIXTRON SE: Renowned for its high-performance MOCVD systems, Aixtron delivers cutting-edge deposition technologies that enhance the efficiency and quality of semiconductor and optoelectronic devices. #Aixtron Veeco: A key player in MOCVD equipment, Veeco provides state-of-the-art solutions for producing high-quality materials for LEDs and advanced semiconductors. #Veeco Taiyo Nippon Sanso India Pvt. Ltd. Sanso Corporation: Known for its high-purity gases and MOCVD-related equipment, Taiyo Nippon Sanso supports the growth of next-gen electronic devices with precision and reliability. #TaiyoNipponSanso Topecsh: Specializes in MOCVD systems and related technologies, Topecsh plays a crucial role in the development of advanced deposition processes for various applications. #Topecsh CVD Equipment Corporation: Offers a range of MOCVD and chemical vapor deposition solutions, contributing to the advancements in material science and electronics. #CVDEquipments 📈 Market Insights: The MOCVD market is experiencing significant growth, driven by the increasing demand for high-performance materials and advanced technologies. These industry leaders are at the forefront of innovation, shaping the future of semiconductor and optoelectronic applications. Read More: https://lnkd.in/gxbV6HcZ #MOCVD #SemiconductorTechnology #Optoelectronics #Innovation #AdvancedMaterials #TechTrends #QuantsandTrends #MarketResearch