Harald Naumann’s Post

📡 #Abracon #LTE #Niche #Antenna designed by #Crout provides cost-effective chip loop #antennas for #LTE, #5G NR, and 5G #NTN with high performance. Traditional chip SMD antennas are electric antennas and technically inferior to magnetic chip loop antennas in performance. Additionally, classic chip antennas are more expensive. 📡 Loop antennas utilize the PCB copper space to form the antenna. By purchasing a license instead of a chip antenna, you save costs. The antenna's resonance frequency is achieved by placing precise ceramic capacitors on the PCB. With a resonance range from 690 to 2700 MHz, tuning becomes cost-effective. 📡 The measurement series in the video shows you the #antenna #gain from 690 MHz to 2500 MHz measured in 3 axes and many frequency steps. The antenna shows an extremely good performance over the entire range. Measurements were taken with the measuring antenna in the picture for 671 Euros. 📡 Niche is available from Crout as a layout template. No development is required; simply copy the triangular space onto the PCB, and you're done. Variations in FR4 material are insignificant due to the antenna's bandwidth. With magnetic loop antennas, unaffected by nearby objects or changes in ground plane size, Crout's design review ensures low-cost, high-performance #IoT antennas. 📡 On June 10th - 11th, members of #DTAG's 5G NTN Early Adopter Program will meet in Bonn. Each team will pitch for 5 minutes, with an award for antenna design. #Digitanimal, one of our 5G NTN clients, will present its Cow T#racker with Abracon Niche. I will introduce the 5G NTN Edge AI Gateway with 4.3 TOPS and #NeoMesh, advocating for secure edge computing to minimize cellular traffic and CO2 emissions in wireless IoT. 📡 Delivery time for Niche antenna is 0 days, with significantly lower costs compared to traditional chip antennas. Niche is available for all bands and easy to integrate. And on top of that, you get high performance. 📡 What IoT device are you developing next? Do you want to reduce BOM costs, connectivity expenses, or energy consumption and CO2 emissions? If you answered yes, email harald.naumann(at)lte-modem. com 📧. We'll assist you in optimizing your IoT device. 👉 Like 👍 | Share ➡️ | Comment 💬 | Stay Informed 📚 | Register to our webinar! 🖥️

Antenna design integration for compact devices has never been easier, thanks to Ignion’s Oxion! Indeed! It was so much fun for ipXchange to be part of the official launch for Ignion’s new AI-enabled antenna configuration platform, Oxion, but it wasn’t until embedded world Exhibition&Conference 2024 that we could put a name to this innovation and find out exactly what to expect when you sign up. In this interview, Aitor explains it all, from starting your design with a rectangular or circular PCB, to selecting your required frequencies and getting the recommended antenna and matching network components, then adjusting the design away from the ideal with real-time feedback on RF performance. Even RF design experts will love this one, so check out the full interview on the ipXchange website and get started with Ignion’s virtual antenna technology today: https://lnkd.in/ebfHDK6v Keep designing! #EW24 #EW2024 #connectivity #antenna #rf #rfdesign #antennadesign #embedded #IoT #electronics #electronicsengineering #disruptivetechnology #rfengineering #internetofthings #oxion

📡 Analyzing Dual-Band PCB #Antenna in a Cellular Tracker: Dive into the intricate world of antenna design with a dual-band PCB antenna for #GSM #trackers. We opened the box and found a classic inverted F antenna, featuring two radiators, covering GSM 900 and GSM 1800. Detailed instructions, including length specifications, can be found in my #IoT #M2M Cookbook. 📏 Optimizing Antenna Placement: Notice the significant gap between the antenna and the ground plane. A larger gap simplifies achieving the necessary frequency bandwidth. The shorting bracket optimizes the antenna's impedance. Adjusting this bracket affects both GSM bands, necessitating a balance between GSM 900 and GSM 1800. 🔧 Tuning with Matching Network: Further optimization is achieved through the matching network, which also requires a compromise as it influences both frequency ranges. In my IoT M2M Cookbook, you'll find examples of dual-band GSM inverted F antennas, including designs from devices like the Gillette order button, suitable for #NBIoT and #LTEM. 🛠️ Practical Antenna Design: To gain hands-on experience, replicate the antenna designs from my IoT M2M Cookbook. Note that ground plane size, plastic casing, and battery position affect the antenna's mid-frequency and impedance, making an exact 1:1 copy impossible. 📊 Measurement and Testing: A Vector Network Analyzer (VNA) is essential for measuring the antenna. I use the #MegiQ #VNA and offer training on its use. Once the antenna is complete, measure its efficiency. The tool you get from me for an estimated half price of an iPhone. Remember, a good return loss doesn't guarantee effective radiation; energy might be absorbed by the casing or internal components like the battery or display. 🔍 Gaining Experience: Want to gain experience in antenna design? Copy the antenna from the IoT M2M Cookbook onto an empty PCB with a plastic casing. Start with a two-layer PCB, using copper foil for the radiators. Adjustments can be made quickly with a cutter knife, and the final design can be etched onto FR4. If necessary book consulting by video call with me. 🏗️ Further Optimization: After initial testing, experiment with different PCB sizes, casing materials, and battery types. Remember, the antenna is a dynamic system interacting with the PCB and nearby components, unlike a static 50-ohm resistor. 💡 Stay Connected and Informed: Subscribe to my #IoT #M2M Times (newsletter) on LinkedIn. Ask for a copy of the IoT M2M Cookbook and copy the antenna. Contact "harald.naumann(at) lte-modem .com" for #antenna design and #IoT consulting. Register without obligation for the 16 training sessions of the Global Webinar "#Wireless #IoT Design" in two time zones. 👉 Like 👍 | Share ➡️ | Comment 💬 | Stay Informed 📚 | Register to our webinar! 🖥️

3D ICs: The Next Frontier in Chip Innovation ⤋⤋⤋⤋ The semiconductor world is evolving fast, and 3D ICs are leading this shift. By stacking dies vertically with Through-Silicon Vias (TSVs), 3D ICs surpass traditional SoCs, offering a compact, high-performance solution that revolutionizes efficiency and cost. Imagine integrating logic, memory, RF, and analog components into one space-saving package—without using expensive process nodes. 3D ICs deliver faster interconnect speeds, lower power consumption, and rapid data transfer, perfect for ultra-light devices like smartphones and tablets. But this innovation comes with challenges: thermal management, timing, and complex co-design requirements demand advanced solutions. 3D IC technology is versatile and opens doors to a wide range of applications across various industries. The emergence of 5G technology is enabling a wide range of applications in mobile, IoT, automotive and other sectors. Consequently, there is a need for various design processes to cater to these diverse applications. Currently, the monolithic design process focuses on process technology and system architecture to accommodate increased functionality. However, there is significant potential in 3D IC designs to enhance small-sized devices by providing improved interconnects, higher performance and lower power consumption. The benefits of 3D ICs span many industries and include less power, higher performance, smaller sizes, more memory and increased bandwidth. For example: The rapid growth in bandwidth requirements between a smartphone’s processor and memory, particularly when it comes to tasks like video streaming, presents a significant challenge to the conventional interconnect systems used to connect packaged chips. Power consumption and management are concerns, and to address them you need to minimize the length of a system’s major bus lines by tightly packaging components together. This is an ideal application for 3D IC. Platforms like Cadence's Integrity 3D-IC are stepping up, providing an integrated design environment for everything from implementation to system analysis. As we stand on the edge of this new era, one question looms: Can 3D ICs meet our growing hunger for more efficient and compact chips? The future of semiconductor innovation is unfolding—are we ready for it? #3DIC #ChipInnovation #SemiconductorTech #FutureOfChips #TechRevolution

We're happy to share that our latest industrial computing solutions are featured in a recent Electropages: Electronics News article: "New Industrial Computing Solutions Offer Excellent Processing Capabilities." 🎉 As highlighted in the article, our new solutions powered by the Intel Atom® x7000RE series processors offer unmatched processing capabilities, seamless integration, and unwavering reliability. This makes them perfect for driving innovation and maintaining a competitive edge across diverse industrial sectors. 🚀 Here’s a sneak peek at our offerings: 🖥️ Miniature motherboards: Ideal for medical equipment, image analysis, and factory automation. 🌐 COM Express modules: Perfect for edge computing applications in automotive, healthcare, and machinery control. 🔧 Rugged embedded systems: With a fanless design, these are superb for extreme environments like hot, dusty factories and control rooms. Check out the full article to learn more about how our solutions can elevate your industrial operations. 🔍 🔗 Read the Article: https://lnkd.in/d_Vc3t-B Intel Corporation Intel Business Portwell Europe #IndustrialComputing #EmbeddedSystems #PortwellEurope #Innovation #Technology #Electropages #HighPerformance #IndustrialPC #IntelAtom #EdgeComputing #IoT #IndustrialComputing #Innovation #Reliability #Performance #Intel #Atom #industrial #motherboard #modules #embeddedsystem #factoryautomation #Edgecomputing #healthcare #transportation

🚀 In-Depth on Our First Project: Spatial Sigma-Delta ADC for Massive MIMO 🚀 We’re diving deeper into one of the groundbreaking projects from the #ABiDi-I lineup: Spatial Sigma-Delta ADC, designed specifically for Massive MIMO (MMIMO) in 5G applications! 🌐✨ 🔍 #Motivation: 5G technology is revolutionizing the communication landscape, enhancing system reliability, spectral efficiency, and reducing latency and power consumption. The backbone of 5G networks is MMIMO architecture, known for optimizing beamforming and minimizing interference. However, challenges persist in the analog front-end due to increased hardware complexity, cost, and power demands. To address these challenges, this project proposes replacing high-resolution ADCs with low-resolution Spatial Sigma-Delta ADCs, significantly cutting power and cost while maintaining performance. 💡 #Key_Innovation:  The Spatial Sigma-Delta ADC is built to shape quantization noise at higher frequencies through oversampling. Unlike traditional temporal implementations, our spatial domain approach mitigates the propagation of quantization noise between antennas, with phase-shifting techniques ensuring noise from previous stages is neutralized at the subsequent stages. 🔧 #Architecture: The module consists of: 4th-Order Sigma-Delta Modulator for high precision. Low-pass Digital Filter (LPF) integrated with a RISC-V core for digital processing. This system is realized using open-source IC design tools and the SKY130 CMOS process, adhering to modern, accessible design practices. 🛠️ #Technical_Highlights Bandwidth: 2 MHz SNDR: > 55 dB Oversampling Ratio (OSR): 40 Active Area: < 1 mm² By leveraging the quantization noise cancellation inherent in our spatial ADC, MMIMO systems can achieve robust channel estimation, significantly improving overall system efficiency with minimal power overhead. 🔗 #Applications This spatial ADC is poised to be a game-changer for applications in: 5G Base Stations: Lower hardware complexity and power. Next-Gen IoT and Smart Devices: Scalable, efficient, and reliable. Stay tuned for more project breakdowns and insights as we continue to showcase the cutting-edge work coming out of the FAST-NUCES IC Design Lab! 🌐🔧 #ABiDi-I #SpatialSigmaDeltaADC #5G #MMIMO #ICDesign #Innovation #FASTNUCES #PICO2022 #IEEE

🗞 Electronic News! 🗞 Kioxia Corporation has announced the development of OCTRAM , a new type of 4F2 DRAM, comprised of an oxide-semiconductor transistor that has a high ON current, and an ultra-low OFF current, simultaneously. This memory technology is expected to realise a low power DRAM by bringing out the ultra-low leakage property of the InGaZnO transistor. The OCTRAM technology was jointly developed by Nanya Technology and Kioxia Corporation and has the potential to lower power consumption in a wide range of applications, including AI and post-5G communication systems, and IoT products. The OCTRAM utilizes a cylinder-shaped InGaZnO vertical transistor as a cell transistor. This design enables the adaptation of a 4F2 DRAM, which offers significant advantages in memory density compared to the conventional silicon-based 6F2 DRAM as well as saving on power consumption. #electricalengineering #electronics #embedded #embeddedsystems #electrical #computerchips Follow us on LinkedIn to get daily news: HardwareBee - Electronic News and Vendor Directory

With the introduction of new wireless technologies, the frequency spectrum is getting very crowded. To ensure these technologies can operate simultaneously without impacting each other, RF Filters play a very important role. RF Filters are crucial in optimizing signal transmission and reception, selectively allowing desired frequencies to pass through while attenuating unwanted signals. everything RF has published the 2024 “The RF Filter Digest” eBook to act as a comprehensive resource for anyone looking to learn about the current-generation RF Filters. This eBook discusses the challenges involved with 5G mmWave filtering, high-rejection LTCC filter performance, the role of MMIC filters in developing next-generation systems, and the impact of BAW filters on 5G applications. - Qorvo, Inc. Knowles Corporation Marki Microwave Mini-Circuits Modelithics, Inc. Click here to learn more - https://ow.ly/ZiWY50Rxbot #rf #filters #5G #wireless #telecommunications #interference #eBook #mmwave #spectrum #communications #engineers #technicians #electronics #mmic #microwave #testandmeasurement #cadence #software #simulation #4G #lte #iot #chip

More About High-Frequency PCB Boards ✍ Advantages that make high frequency PCB boards so popular: 1.Enhanced Signal Integrity: High-frequency PCB boards are designed to minimize signal loss and maintain excellent signal integrity at higher frequencies. 2.Wide Frequency Range: They are capable of operating in a wide frequency range, making them suitable for applications involving radio frequencies (RF), microwave frequencies, and beyond. 3.High-Speed Data Transmission: They provide the necessary characteristics, such as controlled impedance and low signal distortion, to support high-speed data transmission in applications like telecommunications, data centers, and high-speed digital circuits. 4.Miniaturization and Integration: They allow for compact designs and integration of complex circuits. Their improved electrical properties, such as lower dielectric constant and loss tangent, enable the realization of smaller and more efficient electronic devices, particularly in industries like aerospace, automotive, and consumer electronics. 5.RF and Microwave Performance: High-frequency PCB boards excel in RF and microwave applications, where precise signal control and stability are essential. 6.Design Flexibility: They offer design flexibility, allowing for the implementation of intricate circuit layouts, controlled impedance traces, and precise signal routing. 7.Thermal Management: They can incorporate thermal vias, heat sinks, and other thermal management techniques to dissipate heat efficiently, ensuring the reliability and longevity of electronic components. 8.Compatibility with Advanced Technologies: They are compatible with advanced technologies like 5G, Internet of Things (IoT), and wireless communication protocols. #PCB #printedcircuitboard #HighFrequencyPCB

*** Call for Papers *** Dr. Ronald DeMara and I are currently serving as Guest Editors for the Special Issue on "Design of Low-Power Circuits and Systems" in Electronics MDPI. We are seeking innovative contributions to further the field of low-power circuits and system design. Topics of interest include: 1. Power-aware digital, analog, or hybridized circuit design; 2. Low-voltage and near-threshold computing; 3. Energy-efficient computing approaches for IoT applications; 4. Power-efficient AI/ML hardware and accelerator approaches; 5. Energy harvesting circuits for self-powered systems; 6. Low-power memory system designs; 7. Beyond CMOS devices for low-power and/or non-volatile applications; 8. System-on-chip (SoC) power management techniques; 9. Low-power sensor interfaces for wearable and implantable devices. More information can be found here: https://lnkd.in/eBWtNEUG Deadline: 15 May 2025 #lowpowerdesigns #circuitsandsystems #electronics #research #specialissue #SIUE #UCF #EnergyEfficientComputing #BeyondCMOS #SoCPowerManagement #SelfPoweredSystems #AI_MLHardware #AsynchronousDesigns