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Mike Konrad with Surface Mount Technology Association (SMTA) recently spoke with Nava Shpaisman Ph.D., MBA, about how advanced packaging has emerged as a critical enabler in a new era, allowing multiple chips to be integrated within a single package, enhancing performance, power efficiency, and overall system reliability. Read the full interview in his latest article, “The Era of Advanced Packaging” here: https://bit.ly/3BfNXdB.

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Advanced packaging is shaping the future of electronics, driving innovation with enhanced performance and efficiency. A must-read for insights into this transformative era.

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