Photopatternable, degradable, and performant polyimide network substrates for e-waste mitigation "The continuous accumulation of #electronic_waste is reaching alarming levels, necessitating sustainable solutions to mitigate environmental concerns. Fabrication of commercial #electronic_substrates also requires wasteful high heat. To this end, we develop a series of reprocessible electronic substrates based on #photopolymerizable_polyimides containing degradable ester linkages. Five imide-containing #diallyl_monomers are synthesized from readily available feedstocks to produce high-quality substrates via rapid photopolymerization. Such materials possess exceptional thermal (thermal conductivity, K = 0.37–0.54 W m−1 K−1; degradation temperature, Td > 300 °C), dielectric (dielectric constant, Dk = 2.81–3.05; dielectric loss, Df < 0.024), and mechanical properties (Young's modulus, ∼50 MPa; ultimate elongation, dL/L0 > 5%) needed for flex electronic applications. We demonstrate mild #depolymerization via #transesterification reactions to #recover and #reuse the functional components." Caleb J. Reese, Grant Musgrave, Chen Wang, Department of Materials Science and Engineering, University of Utah, Salt Lake City, Utah, USA; Jitkanya (Jenn) Wong, Wenyang Pan, John Uehlin, Mason Zadan, Omar Awartani, Ph.D., Reality Labs at Meta, Redmond, USA; Thomas Wallin, MIT Department of Materials Science and Engineering (DMSE), Massachusetts Institute of Technology, Cambridge, USA. https://lnkd.in/eukj5AxP
New substrate material for flexible electronics could help combat e-waste Electronic waste, or e-waste, is a rapidly growing global problem, and it’s expected to worsen with the production of new kinds of flexible electronics for robotics, wearable devices, health monitors, and other new applications, including single-use devices. A new kind of flexible substrate material developed at MIT, the University of Utah, and Meta has the potential to enable not only the recycling of materials and components at the end of a device’s useful life, but also the scalable manufacture of more complex multilayered circuits than existing substrates provide. https://lnkd.in/g-_yTN-6 #nanotechnology #electronics #materialsscience #greentech
