Adisyn (ASX:AI1)’s Post

ASX Announcement | Proposed Acquisition of 2D Generation and Capital Raise This morning, we're pleased to announce the proposed acquisition of 100% of the issued share capital of 2D Generation Ltd (“2DG”) and associated capital raise. Announcement Highlights: • Adisyn has entered into formal negotiations to acquire 100% of semiconductor IP business, 2D Generation • Adisyn will leverage 2D Generation’s innovative semiconductor solution to generate opportunities in AI1’s target markets including defence applications, data centres and cybersecurity • 2D Generation’s semiconductor IP is a critical advancement in semiconductor technology that will enable the next generation of generative AI and semiconductor solutions for data centres and beyond • The semiconductor market is thriving as the data and computing power required for generative AI continues to grow exponentially – with the acquisition of 2D Generation, Adisyn will be well positioned to benefit from this significant technological opportunity • 2D Generation is a partner in the EU's Connecting Chips Joint Undertaking with research and innovation partners including NVIDIA, IMEC, Valeo, Applied Minerals, NXP, and Unity • Firm commitments received to raise $3m (before costs), subject to execution of the Proposed Acquisition Agreement Read the full announcement here https://lnkd.in/gPYdzaEG or visit adisyn.com.au/investors 2D Generation #2DGeneration #adisyn #adisynltd #ai1 #asx Blake Burton Shane Wee

Adisyn Ltd (ASX: AI1) is excited to announce that 2D Generation Ltd (2DG) has ordered a highly specialised semiconductor manufacturing system called an Atomic Layer Deposition Machine (ALD). Announcement Highlights: • 2D Generation has ordered highly specialised Atomic Layer Deposition (“ALD”) machine from Beneq • Beneq is a global leader in ALD equipment with customers spanning the semiconductor and electronics industries • New generation ALD to complement 2D Generation’s current ALD and accelerate the development of its semiconductor technologies including the graphene coated interconnect • Installation expected in 5-6 months • 2D Generation’s semiconductor IP is a critical advancement in semiconductor technology that will enable the next generation of generative AI and semiconductor solutions for data centres and beyond • Work will continue with 2D Generation’s current equipment • Adisyn will leverage 2D Generation’s innovative semiconductor solution to generate opportunities in AI1’s target markets including defence applications, data centres and cybersecurity Download the full announcement here: https://lnkd.in/gUAtsrv9 Read the article here: https://lnkd.in/gZQDE-t5 Blake Burton Shane Wee Arye Kohavi #adisynltd #ai1 #2dg #2dgeneration #semiconductor #graphene

Congratulations to Abhi Rampal and #SolidStateAI (S2AI) — the only Canadian company officially part of the US Chips Act!  They’re part of the Semiconductor Research Corporation (SRC) consortium leading the $285M NIST Semiconductor Digital Twin Project. S2AI was chosen for its groundbreaking Physics Enhanced Digital Twin (PeDT) technology, which uniquely integrates the physics of semiconductor processes and equipment into AI. This innovation enables fabs to achieve unprecedented efficiency and precision. The consortium's founding members include industry leaders such as #Intel, #IBM, #TexasInstruments (TI), #Micron, #AMD, and the State University of New York, with other notable participants like #GlobalFoundries, #AppliedMaterials, #AnalogDevices, #NorthropGrumman, #ASM, and #LamResearch. Solid State AI is a fiery Canadian company pioneering new ways of harnessing the complexities of advanced manufacturing. It's great to see them recognized.

TSMC and Cadence are at the forefront of driving the AI buildout, collaborating on next-generation technologies, including N2P, 3Dblox, and DTCO on A16, to pave the way for the AI factories of tomorrow. “TSMC and Cadence have a long-standing, successful partnership that turns the world’s designs into silicon reality. Together, we are revolutionizing the future of silicon design with AI-powered EDA software, enabled for TSMC’s latest process nodes. Our ongoing collaboration on innovative solutions for next-generation technologies like TSMC A16 and 3Dblox is paving the way for the AI factories of tomorrow.” Chin-Chi Teng, PhD SVP, Digital and Signoff Group Discover more about how this collaboration is advancing technology. https://ow.ly/2zZo50Tz6bN #AI #3DIC #TSMCOIP

🚀 The Evolving Semiconductor Market: Innovations and Challenges The semiconductor market is witnessing continual evolution, with high-bandwidth memory #HBM technologies and #AI integration driving significant advancements in packaging solutions. Industry players are increasingly investing in cutting-edge technologies while addressing the challenges of manufacturing efficiency and cost management. Recent reports suggest that a prominent memory manufacturer is set to lead the market in operating profit, primarily due to the rising demand for its HBM chips, which are essential for AI and high-performance computing applications. Furthermore, various companies are exploring innovations in hybrid bonding technologies to enhance memory capacity and improve data transfer rates through advanced packaging methods. Despite these encouraging developments, the semiconductor sector encounters ongoing challenges related to manufacturing quality and cost efficiency. As companies work to develop their intellectual property portfolios, they seek to maintain competitive advantages in this rapidly changing landscape. In this environment, the value of strategic partnerships cannot be overstated. Collaborating with seasoned industry leaders can provide essential expertise and innovative solutions. Notably, ASMPT Ltd with its ASMPT SEMI Solutions' NUCLEUS series, FIREBIRD series, and LithoBOLT series are well-positioned to support advancements in this market segment. Engaging with such partners may enhance capabilities and foster a culture of continuous improvement, ensuring a robust response to the complexities of the semiconductor landscape. For more info, please visit: https://lnkd.in/gSxK8A_V Image source: Yole Group Yole Intelligence #Semiconductors #SoC #AdvancedPackaging #Innovation #Technology #CHIPSAct

Enthusiasm for #AI #technology recently made NVIDIA the world's third most valuable #stock and the talk of the #investment world. However, the #company's leading-edge chips are only made possible from the fabrication prowess of TSMC and South Korea's SK hynix. Both companies generate impressive #revenues but #trade at much lower valuations. Read our latest article to learn about semiconductor opportunities beyond NVIDIA and how to access them through KEMQ. Read: https://bit.ly/3U5qgvj

The semiconductor industry powers the tech that shapes our world. But as innovation speeds up, so do the challenges and generative AI is paving the way for breakthroughs and faster growth in semiconductors. Learn more about how #GenAI is accelerating semiconductor innovation: https://accntu.re/3AZMaZW #Semiconductor #GenerativeAI #HighTech #CHIPSAct

How has AI affected the Construction Industry? 1 – AI needs greater processing power from the next generation of semiconductors. 2 – These chips need to be manufactured in state-of-the-art facilities. 3 – The construction industry has risen to the challenge of quickly completing these facilities. Intel's recent funding award https://hubs.li/Q02t4G-K0 VoidForm has extensive experience with large-scale industrial, commercial, and municipal projects. Let’s discuss your next project. #construction #constructionAI #voidform #structuralengineering

The Biden-Harris Administration has announced a preliminary agreement with Absolics, an affiliate of SKC, to provide up to $75 million under the CHIPS and Science Act. This investment aims to construct a 120,000 square-foot facility in Covington, Georgia, which will manufacture glass substrates for semiconductor advanced packaging. This initiative is expected to create over 1,200 jobs, including 1,000 in construction and 200 in manufacturing and R&D. The partnership with Georgia Tech highlights the administration's commitment to enhancing U.S. technological leadership and innovation in semiconductor manufacturing, crucial for AI and high-performance computing applications. #chipsact #semiconductors #advancedpackaging #techinnovation #usmanufacturing #jobcreation #bidenharris #georgiatech #ai #highperformancecomputing Source- https://lnkd.in/gb25uZFF