Jeff Draa

🎂 It's my 20th anniversary! 🥳 October 2004 is when I began working in optics and photonics r&d for high-volume manufacturing. I frequently need to make this abundantly clear BECAAAAUSE -- of what happened *repeatedly* at San Francisco TECH WEEK by a16z last week. Lots of the guys I met questioned 🤔 the prudence of me having my own optical engineering consultancy without an abundance of experience. WHY WOULD YOU THINK I DON'T HAVE THAT, PHIL?!? Sometimes, I would find out they literally thought I was being *sarcastic* when I said I started working in O.E. and lasers 20 years ago. 📅 So, to be clear: it's not a joke. -----> I'm 42. <----------------------------- Not 24. It's just math. And your math was wrong. 🤪 If you need a *highly experienced* O.E. who specializes in non-imaging optics, - or - if you want examples of what non-imaging optics 🚨 is, my company's (Spire Starter's) website, is a great place for both those things: SpireStarter.com #opticalengineering #illumination #nonimaging #nonsequential #experience

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【Industry news】 As #TSMC's #3-nanometer #supply exceeds #demand, all four major customers' #production #capacity is fully covered. #TSMC's 3-nanometer #orders are expected to be full until 2026. According to reports, #NVIDIA, #Apple, #AMD and #Qualcomm are now considering #raising #AI #hardware #prices. #TSMC's #production #capacity plan for this year has tripled compared with last year, but it is still not enough. #Industry #demand is currently at its peak. In addition, TSMC's N3P process is also widely used in the #mobile field. Overall, the 3nm lineup is quite complete. It is not yet certain whether TSMC will increase prices as a result, but it emphasized that "pricing strategies are always strategy-oriented, not opportunity-oriented, and will continue to work closely with customers to provide value." However, foreign media believe that as the #supply of 3 nanometers exceeds demand, TSMC is likely to increase prices, which will affect IC design companies. TSMC is currently planning to convert some 5-nanometer #equipment to #support 3-nanometer #production #capacity, and the industry expects monthly production capacity to increase to 120,000 to 180,000 pieces. However, the industry has not yet considered the production capacity needs of Intel's Lunar Lake #processors. Although it cannot yet be determined whether the price of consumer products will increase due to #3nm #supply disruptions, these indicators indicate that this will happen.

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As I prognosticated earlier, my big bet for 2025 is that photonics will solve the massive power consumption problem with data centers. It’s a “perfect storm” for the right teams working on the right tech at the right time. Here are 9 photonics companies that I believe will have a breakout year in 2025: Ayar Labs - If you follow photonics, AI, or HPC, you’ve seen CEO Mark Wade highlighting their optical interconnects to boost data center efficiency from short-haul to long-haul. With a Series C under their belt, more growth is on the horizon. Watch them closely. Lightmatter - Led by photonics Wunderkind Nicholas Harris, this MIT spinout just raised $400M in a Series D, bringing their total to $850M. They’ve seen 50% YOY growth in headcount, mostly in engineering, signaling a rampup of their products. Neurophos - Co founded by Patrick Bowen and Andrew Traverso, Neurophos emerged from stealth with a $7M seed round. Their proprietary metamaterial-and-SiPho platform promises to shatter all expectations of compute power and efficiency and I have every reason to believe with Patrick at the helm, this company will succeed. Xscape Photonics Inc - Had been on my radar for a couple of years already but CEO Vivek Raghunathan, previously with Broadcom, just led them out of stealth with a $44M Series A. Their work with Columbia researchers is groundbreaking, and attracting such a leader is a huge signal for success. DustPhotonics - Israel produces some of the foremost innovations in photonics and Ronnen, Yoel and Gadi are poised to show the world their PICs can compete with the best in terms of data center efficiency. Their $24M Series B will fuel their progress. OpenLight - This 2022 spinout from Juniper led by Dr. Adam Carter holds the promise of being one of the most important enablers in this ecosystem. If you think designing photonics is difficult, try manufacturing them! Helping partners fab their PICs is where OpenLight shines. Quintessent Inc. - In a space where innovation is key, novelty has to be handled with care. CEO Alan Liu and his team are addressing the light source of the optical laser using Quantum Dots which were substantiated by a 2023 Nobel Prize in Chemistry, so their technology is on firm foundation and their $11M seed round in March is further evidence this tech has legs. HyperLight - This Cambridge, MA startup reflects how deep the region’s talent pool in photonics reaches and they attracted CEO Mian Zhang from exciting postdoctoral work at Harvard to drive their plans forward. They’ve already raised $37M in a Series B to provide thin film lithium niobate (TFLN) PICs. Black Semiconductor - The“dark horse” of the group (pun intended) they emerged from stealth with a huge $274M Series A to pioneer photonics using the metamaterial graphene. If successful, this could usher in a new era for PIC development and CEO Daniel Schall will ensure that happens. #semiconductorindustry #photonics #artificialintelligence

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Imagine a wolf in the wild: keen-eyed and relentless, each step calculated and precise. This isn’t just the visualization of an apex predator but a metaphor for Wolfspeed's ambitious pursuits in the global silicon carbide (SiC) landscape. Under CEO Gregg Lowe, Wolfspeed has evolved from a broad semiconductor player (formerly Cree) into a hyper-focused SiC specialist. This shift wasn’t just a rebrand but a strategic pivot to capture leadership in a field that many believe will define the future of power electronics. Silicon carbide’s unique properties—higher efficiency, thermal conductivity, and ability to handle higher voltages—make it essential for next-generation electric vehicles (EVs), renewable energy systems, and industrial applications. As the world moves toward greater electrification, these applications are scaling and they all need advanced power solutions that SiC can deliver. Wolfspeed’s journey to market leadership has involved bold moves, including their Mohawk Valley Fab in upstate New York, which is set to be the world’s largest SiC fab. Yet, such buildouts take substantial time and investment, and competitors aren’t idle. Infineon, for example, recently opened a 200mm SiC fab in Malaysia, asserting themselves as the “Alpha”. But Wolfspeed’s strategy goes beyond scaling up—it’s about owning the full vertical. By controlling SiC production from crystal growth to device fabrication, Wolfspeed minimizes dependencies and maximizes quality control, a rarity in the semiconductor industry. This integrated approach provides a distinct edge, appealing to customers seeking reliable partners who deliver both innovation and supply consistency. Like any hunt, the outcome is uncertain, marked by challenges both expected and unforeseen. Wolfspeed’s recent quarterly results were below expectations, impacted by closing an underperforming fab in Durham, NC, and a slowdown in EV demand. Such outcomes can affect investor confidence and make engineers look elsewhere for working on opportunities to design next-generation power ICs. Despite these challenges, Wolfspeed’s leadership is confident. Their latest earnings call projected robust growth and hinted at future partnerships to expand their influence. Collaborations with automotive and renewable energy leaders will help position Wolfspeed as a trusted partner in the supply chain, providing both expertise and operational capacity, factors that have certainly influenced the US Government to commit $750M in CHIPS Act funds to empower their growth. Lowe and Wolfspeed’s leadership are seasoned hunters and in my view, they seem sharply attuned to their target. As they stand on the edge of unprecedented market change, it’s clear they aren’t just pursuing any prey—they’re focused on the most valuable opportunities. Let’s hear from you - What strategies are essential for Wolfspeed to maintain its apex position in the SiC market? #semiconductorindustry #powermanagement #siliconcarbide

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#HBM Prices to Increase by 5–10% in 2025, Accounting for Over 30% of Total #DRAM Value, Says TrendForce Corporation 💡 Avril Wu, TrendForce Senior Research Vice President, reports that the HBM market is poised for robust growth, driven by significant pricing premiums and increased capacity needs for AI #chips. HBM's unit sales price is several times higher than that of conventional DRAM and about five times that of #DDR5. This pricing, combined with product iterations in AI #chip #technology that increase single-device HBM capacity, is expected to dramatically raise HBM’s share in both the capacity and market value of the DRAM market from 2023 to 2025. Specifically, HBM’s share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025. A big thank you again to Avril Wu and TrendForce 集邦科技 for the full article with more background and insights via the link below 🙏💡👇 https://lnkd.in/eDC9_Z7u #semiconductorindustry #semiconductors #semiconductor #tech #micron #skhynix #samsung #foundry #innovation #ai #nvidia #tsmc #server #it #ic

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TSMC's Arizona facility has achieved production yields comparable to its established plants in Taiwan, indicating strong progress in its U.S. operations. The trial production at the Arizona plant uses advanced 4-nanometer process technology, essential for maximizing chip performance and efficiency. Despite a delay in full production until 2025 due to skilled labor shortages, the U.S. government plans to support TSMC with $6.6 billion in grants and up to $5 billion in loans to enhance domestic semiconductor manufacturing. #TSMC #4nm #TSMCArizona #semiconductor #semiconductors #technology #ChipsAct #chip #yield #semiconductormanufacturing Read more https://lnkd.in/dcyNGDyd

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Tracking the Progress of the CHIPS R&D Programs Enacted in 2022 to promote U.S.-based semiconductor production and innovation, the CHIPS & Science Act is the most significant federal investment ever made in the U.S. semiconductor industry. While much attention is focused on the CHIPS incentives grant program, the other pillar of the CHIPS Act is also critically important: a substantial, $13 billion investment over 5 years in semiconductor research and development (R&D). The Department of Commerce is responsible for $11 billion, and the Department of Defense is responsible for $2 billion.  To assist the industry and other stakeholders in monitoring the progress of the CHIPS R&D Programs, SIA launched today a new resource tracking the progress of these initiatives. The CHIPS R&D programs include: CHIPS National Semiconductor Technology Center (NSTC) CHIPS National Advanced Packaging Manufacturing Program (NAPMP) CHIPS Metrology Program (Metrology) CHIPS Manufacturing USA Institute (MFG USA) DOD Microelectronics Commons (ME Commons) Thus far, the Department of Commerce has committed $5 billion to the NSTC, which will be operated by the National Center for the Advancement of Semiconductor Technology (Natcast) and $3 billion to the NAPMP. There is also an open funding opportunity for up to $285 million for MFG USA to establish the CHIPS Digital Twins Manufacturing USA Institute (SIA is supportive of an effort by the Semiconductor Research Corporation to lead this initiative). The CHIPS Metrology Program will be allocated approximately $519 million, and the program is currently supporting at least 30 ongoing research projects. Meanwhile, DOD has selected the 8 hubs that will serve as leaders of the ME Commons, committing $238 million of their total $2 billion. Intel Corporation: Received the largest grant of $8.5 billion, plus an additional $11 billion in government loans. Intel plans to invest $100 billion in new and expanded facilities across Arizona, Ohio, Oregon, and New Mexico. TSMC (Taiwan Semiconductor Manufacturing Company): Awarded $6.6 billion to construct a new chip plant with three fabs in Arizona. TSMC is expected to invest $65 billion in this project. Samsung Semiconductor: Received $6.4 billion in funding from the U.S. government. Micron Technology: Granted $6.1 billion to support its plans of investing $50 billion through 2030 for new fabs in Idaho and New York. GlobalFoundries: Awarded $1.5 billion in funding. Microchip Technology Inc. Technology: Received $162 million. BAE Systems: Granted $35 million, though this was not included in some visualizations due to the relatively small amount. #interesting #technews #technology #semiconductor #ai #innovation

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Efficient and stable hybrid perovskite-organic light-emitting diodes with external quantum efficiency exceeding 40% https://lnkd.in/gCSdnE7N #solarcell #perovskite #oled #semicunductordevice

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Last week’s DAC showcased exciting announcements from startups that are revolutionizing semiconductor design however these rising stars overshadowed a major update from an industry stalwart - Alphawave Semi - whose news is poised to accelerate the proliferation of chiplets and give rise to a “chiplet marketplace”. Alphawave Semi announced a breakthrough with the tapeout of the industry's first off-the-shelf, multi-protocol I/O connectivity chiplet. This technology can seamlessly integrate into larger SoCs or multi-chip modules, giving designers increased flexibility and more connectivity options for different applications. Reflecting on the Chiplet Summit this past spring, I remember listening to Tony Chan Carusone, Alphawave’s CTO, as he passionately described the significance of chiplets and how Alphawave will foster a more open and democratic design ecosystem. Now, just one quarter later, his team has launched a technology that brings this vision much closer to becoming a reality. Adding to their momentum, Alphawave also announced an expanded partnership with Samsung Foundry to advance the industry's progression toward cutting-edge semiconductor nodes, crucial for the evolution of advanced compute. Samsung’s roadmap in sub-4nm technologies includes FinFET and Gate-All-Around, which are designed to maximize performance in the post-Moore era. Initially targeted for data centers and HPC, these innovations may trickle down to low-cost, AI-enabled edge devices, putting the transformative power of AI into the hands of billions of people worldwide. This news follows Alphawave’s early June announcement of their new partnership with Arm, aimed at unlocking the potential of processors. Alphawave will give Arm access to their robust portfolio of connectivity solutions and silicon IP, which Arm will integrate into their proven portfolio of compute cores. At a time when AI technology is accelerating at breakneck speed, many companies are searching for ways to boost compute performance and address the challenge of moving data between compute and memory more efficiently. While multiple startups offer unique solutions, many customers want battle-tested technology to avoid the risk of investing in solutions that may become obsolete by the time they reach tapeout. Alphawave has developed vital solutions and in doing so, has increased design flexibility, built bridges to new process technologies, and shortened the path to market. “Connectors” are often the catalysts of innovation and Alphwave’s is a testament to that word. I’m encouraged by what I’ve seen from Alphawave and strongly believe they stand at the forefront of an emerging chiplet marketplace. More broadly, I believe their technology serves to democratize design technology and will give emerging companies more options to bring their brilliant ideas to life. #semiconductorindustry #ai #chiplets

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Interesting takeover bid to take ASMPT private by KKR. There is a lot of movement and potential consolidation in the advance packaging space, that’s growing fast, driven by AI applications. In particular hybrid bonding is of interest due to its use in 3D packaging and upcoming implementation for high bandwidth memory (HBM) stacks that are integrated with logic chips for AI processing. ASMPT has a strong packaging experience and a hybrid bonder with pretreatment modules from EVG on the market. An interesting twist is ASM International’s 25% stake in ASMPT, which has been an activist shareholder target in the past. Activists suggested in the past that there were no synergies between the companies and the stake should be divested for shareholders’ benefit. However, things change and I would argue that there are very strong synergies with ASMI’s deposition technology as ALD and new materials are introduced for advance packaging. Will be interesting to see how this plays out. #ALD, #ASMPT, #ASMI

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This demo by the Menlo Micro #power team is mind blowing when you see it! No thermal design...Our #MEMS (5mOhm) device vs a leading #SIC (6mOhm) device in the same space shows where an Ohmic contact shines ultra #conductivity that remains stable over temperature. The effects on SWaP are enormous. The #IdealSwitch is unmatched where conductivity is most critical! #PowerControl #PowerDistribution #PowerSafety Check out the link below.

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Wrapping up #DAC61, I am curious about the decision to rebrand the event as "DAC, The Chips to Systems Conference," instead of the traditional "Design Automation Conference." This is not just a simple change of words — consider the keynote speakers. Last year, they were all #EDA luminaries:  Mike Ellow (recently appointed CEO of Siemens EDA), Lip-Bu Tan (former Cadence CEO), Alberto Sangiovanni-Vincentelli (founder of both Cadence and Synopsys) and Walden C. ( Wally ) Rhines - long time CEO of Mentor Graphics. In contrast, this year, the keynote speakers were Jim Keller (Tenstorrent), Gary Patton (Intel) and Alan Lee (ADI) - all "Chip to Systems" executives. Is this a coincidence? Does it reflect EDA companies taking a lesser role at DAC? Siemens EDA (Siemens Digital Industries Software) was a notable exception as a Diamond sponsor, investing in a sizable booth and team, and hosting guests for a Giants' game at Oracle Park. (The famous Denali party is long gone...) Or is it because part of Design Automation is increasingly being done within "Chips to Systems" companies? Just look at Jim Keller discussing the importance of #opensource and Alan Lee explaining that "Product Design is Complex." What do you think? #Designautomation #chipdesign

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Bump Pitch Transformers Will Revolutionize Advanced Packaging There’s better, cost-effective path to 2.5D packaging landscape SAN FRANCISCO, June 27, 2024 /PRNewswire/ -- Dr. Larry Zu, Founder and CEO of Sarcina Technology, the Application Specific Advanced Packaging (ASAP) Design Service and Production leader, predicted that recent Bump Pitch Transformer (BPT) designs will speed 2.5D IC advanced packaging adoption to meet the red-hot demand for AI innovation. In remarks made in the Keysight Theater at the 61st Design Automation Conference, he envisioned new BPT technology paving the way for new artificial intelligence computing opportunities. "We believe that the Bump Pitch Transformer architecture will accelerate the growth rate of 2.5D semiconductor packages that are key to meeting the explosive demand for AI-driven computing capabilities," Dr. Zu said during his address in the Keysight Theater. Fan-Out Chip-on-Substrate with Silicon Bridge (FoCoS-B) is the latest BPT advancement, he said, and it democratize the 2.5D era. This packaging technology is now available through companies such as ASE and SPIL, breaking a logjam of innovation created by previous proprietary BPT technologies. FoCoS-B is a silicon bridge technology, replaces expensive silicon TSV interposers with more cost-effective re-distribution layers (RDL). This architecture is ideal for homogenous and heterogenous chiplet integration targeting high-performance computing (HPC) devices for AI, data center, microprocessor, and networking applications. Current advanced 2.5D packaging uses a substrate to transpose an IC's microbump pitch from 40-50 um to the package's 130 um bump pitch. These substrates are very expensive, in short supply, and are complex to design resulting in lead-time and cost challenges. The new FoCoS-B technology is effectively a Wafer Fan-out RDL technology which, due to its maturity, has inherently a lower cost and shorter lead time thus enabling system designers to optimize AI for new lower cost applications. Sarcina is currently engaging companies with two Bump Pitch Transformer derivatives across a range of applications. Its services include BPT interposer design, O/S test pattern insertion, fabrication & BPT wafer sort, along with package substrate design, PI/SI + thermal system simulation, & substrate fabrication. A complete WIPO (wafer in, package out) engagement also covers package assembly, final test, and production services. The company has had a number of 2.5D customer devices to successfully enter production going back several years, including a large 47.5 mm x 47.5 mm, 2,019 ball high performance flip chip ball grid array device. (for further reading, please go to )

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💡I’m always thinking about Points of Connection (POCs). They might seem like a small detail, but they are the backbone of any successful construction or operational strategy in any advanced manufacturing facility.   Over the past year, I’ve had the privilege of meeting with leaders at some of the world’s largest semiconductor companies.    A recurring theme? POC management is a massive challenge. It’s taking up far more engineering time than it should—time that should be spent innovating, not chasing down data or resolving preventable issues.   In construction, it causes delays and downtime as teams scramble to align connections or correct mismatches. ⏳ In operations, overloaded equipment due to poor visibility into load capacities can cause critical tools to go down. ⚡ When this happens, engineers often struggle to identify the root cause quickly, leading to costly production delays—or even worse, a halt in chip manufacturing altogether. ❌ The key isn’t just assigning connection points but ensuring engineers have real-time visibility into how those points interact with the entire facility.   At Basesite, we’re tackling this head-on with solutions designed to streamline POC management and give engineers their time back. Our tools empower teams to visualize, plan, and manage connections seamlessly—because every wasted minute in this industry matters.   What challenges are you seeing with POC management in your projects?   #Semiconductors #ConstructionTech #FacilityDesign #DigitalTransformation #EngineeringInnovation

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Every single person on your team — no matter what their position is — should know and live by your company’s values. When I first joined Coherent Corp. (known as II-VI at the time) as a board member, we had 7 values. They were printed on the back of everyone’s business card but, still, I could never remember them all. In the wake of a large acquisition, I was walking around various facilities and chatting with everyone. I asked if anyone knew what our company’s values were — and no one knew them! That was a hint of an opportunity. I realized that the acquisition was a period of transformation for the company, and it was an opportunity to revisit our values. I remember studying the values of all the S&P 500 companies for inspiration, taking into consideration the founding values of II-VI as well as the values of the companies we had acquired. Eventually, I decided on: ICARE which stands for integrity, collaboration, accountability, respect and enthusiasm. Taken in that order, they have allowed our team to declare “I care” as the primary reason for working at Coherent and helping change the world. I firmly believe that values (and sticking to them) are integral to a company’s success. This might be a little bold to say but as far as I know, today, there’s no one in the company that doesn’t know what our values are.

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NEW SOFTWARE EVERY PIC DESIGNER HAS BEEN WAITING FOR - DESIGN RULE CHECKER RELEASED AUGUST 20th. You may know that here at Optica I love watching demos of any products that save time, money and frustration for anyone working in the photonics industry. Today I want to share a new piece of affordable software designed specifically for PIC designers trying to ensure their designs are "first-time right". Watch this link up below we had a few hours ago with Kevin McComber and Aeon Williams, both working on breakthrough engineering products for Spark Photonics, based in Waltham, MA, USA. You may know about them through their partnerships with Luceda Photonics and OpenLight, or from the excellent educational work they do from the Spark Photonics Foundation. Kevin and Aoen explain about the launch of their new Design Rule Checker (DRC) software, designed to empower designers everywhere. It’s called Check Mate DRC, and the video below explains what you can do to try it out. This is an important milestone, so I recommend you check it out.

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As the growth chart for gallium nitride (GaN) wafer demand is looking more like a hockey stick, it’s apparent that innovators who have long believed in the merits of GaN are being proven right. A private company in El Segundo, CA that predates some of the other startups in the GaN-based power IC space by more than a decade has been hard at work developing solutions in this space for over seventeen years. That company is EPC - Efficient Power Conversion and I got a firsthand look at some of their solutions when I was at the 2024 APEC Conference. They were co-founded in 2007 by a luminary of the power IC industry and CEO Alex Lidow. Lidow was at International Rectifier for over thirty years and had leadership positions spanning R&D and manufacturing. He was even their CEO for 12 years. As co-inventor of the silicon power MOSFET in the 1970s, his seminal work has shaped development in this sector. Lidow was flanked by Joe Cao and Robert Beach, both of whom have also made their own impact. Cao had over 15 years of experience and more than 30 patents in developing GaN and silicon power device technologies before deciding to embark on the quest with Lidow. Beach had founded multiple companies aimed at bringing GaN ICs to the marketplace before partnering with Lidow and Cao, making him a perfect complement to their triumvirate. What put EPC on the map was the development of their proprietary enhancement-mode GaN (eGaN) transistors which they released in June 2009. Unlike traditional MOSFETs, which used built-in channels between the drain and source, eGaN MOSFETS had no such channel. eGaN MOSFETs’ have small geometry, low power dissipation, and are easy to manufacture, making them desirable for a wide array of applications. The founders also had the foresight to manufacture using a foundry meant to produce silicon devices and were able to create a mature, efficient, and low-cost supply chain to bring new products to market quickly. Nowadays, newer companies in the space are gaining similar traction using this approach, but it’s safe to say EPC was a pioneer and began to reap the benefits decades ahead of competitors. This is another key element that differentiates them. In my experience, “mature startups” tend to be modest organizations, often letting their technology speak for itself and not over-indexing on marketing their brands to potential talent. But the hiring landscape is far more competitive than it was when they started and the allure of high-growth startups can be attractive for talented engineers. EPC’s goal is to enable companies to develop their technologies by leveraging the power of GaN and avoid being left behind by developing on silicon. That, combined with their lengthy market presence and leadership team, are strong elements to highlight and EPC would be well-served to fold these details into their talent attraction messaging. #semiconductorindustry #galliumnitride #powermanagement

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What is a LED fab: Key Companies and Applications 🚀 LED fab is an abbreviation for Light-Emitting Diode fabrication facility. It's a specialized manufacturing plant where LED chips and devices are produced. These facilities involve complex processes, including wafer fabrication, chip processing, and packaging. 🚀 Key Companies in LED Fabrication The LED industry is highly competitive, with several major players dominating the market. Some of the key companies in LED fab include: 1) Nichia Corporation: A Japanese company renowned for its LED technology, particularly in the blue and white LED sectors. 2) Cree: An American company that has been a major player in the LED industry for many years. 3) Osram: A German lighting company that has a significant presence in the LED market. 4) Samsung Electronics: A South Korean conglomerate that has invested heavily in LED technology. 5) Lumileds: A Dutch company that is a leading manufacturer of LED lighting solutions.    🚀 Applications of LED Technology LEDs have become ubiquitous in various applications due to their energy efficiency, long lifespan, and versatility. Some of the most common applications include: 1) General lighting: LEDs are used in various lighting applications, such as residential, commercial, and industrial lighting. 2) Automotive lighting: LEDs are increasingly used in headlights, taillights, and interior lighting in vehicles. 3) Backlighting: LEDs are used to backlight displays in televisions, smartphones, and computer monitors. 4) Signage and displays: LEDs are used in various signage and display applications, such as billboards, digital signage, and LED screens. 5) Decorative lighting: LEDs are used in various decorative lighting applications, such as holiday lights and architectural lighting. 6) Medical applications: LEDs are used in various medical applications, such as surgical lighting and therapy devices.    -------- P.S: If you like writings like these, we have compiled 100s of such questions in our book- The semiconductor Saga- a book that teaches you everything about semiconductors in simple words. Link in comments.

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Discover how NXP’s MCX C Series can elevate your designs—click to explore these efficient MCUs.

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