Gopinath Ranganathan

In the fiercely competitive semiconductor industry, companies are in a constant battle to retain top talent because in the heart of every good engineer is a passionate problem solver, looking for their next challenge. For them, innovation is the currency of success. Yet companies like Qualcomm, Intel, and Broadcom attract tens of thousands every year by dangling lucrative compensation packages to lure them from competitors. Startup leaders don’t have those resources, so they have to work harder to attract the best talent and then fight like hell to retain them. But some of the most successful startup leaders I know take a different approach. Rather than viewing attraction and retention as a fight, they leverage the inherent qualities of their companies as their advantage. They use their nimbleness, bias toward innovation, and their collaborative cultures like superpowers to attract the right people and those usually end up being the reasons why people stay. Take Richard Fung, CEO of The Six Semiconductor, for example. I had a conversation with Richard and asked him to share his approach to motivating his team. His response was like a mini-masterclass on the topic of talent attraction and retention. Richard emphasized that a culture that encourages engineers to dive deep into the intricacies of their craft, understand the systems they’re building, and connect with the end customer is a successful culture. Richard has been using this approach and it's been paying dividends for The Six Semiconductor so in his honor, here are his six key concepts for creating this type of organization: 1. Foster a Learning Culture: Support ongoing learning and skill development beyond employees' core responsibilities. 2. Prioritize Customer Focus: Embed a customer-centric mindset, and encourage employees to enhance user experiences through their work. 3. Champion Problem-Solving: Empower employees to creatively solve challenges with a focus on customer needs. 4. Promote System-Level Understanding: Encourage employees to grasp the bigger picture of the company's offerings and their role within it. 5. Break Down Silos: Promote collaboration to ensure a comprehensive understanding of projects across teams. 6. Offer Meaningful Challenges: Provide intellectually stimulating projects that make a tangible impact on the company's success. What Richard highlighted is that success goes much deeper than getting great people to join. It's about unleashing the full potential of every individual on your team to drive innovation and help shape the company, and ensuring your team heads in the right direction together. I’m thrilled I got to learn Richard’s perspective and believe other leaders can benefit from hearing it, so I shared the video below. My "challenge question" to other startup leaders is this: what are you doing to foster this type of culture in your organization? Either share below or, feel free to DM me. #semiconductorindustry #startup #leadership

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YC is right to try. Innovation and stuff. Also the notion that LLMs can only find bugs that were in the training set is not true. Ben Cohen for example is using LLMs that generate assertions. See the training set is not limited to systemverilog, many more syntactically compatible languages. It trained on algos as well. It is not because it never saw a bug in a rtl multiplier of 154*321 that it cannot generate a sequence exhaustively and find all bugs by comparing with a behavioral systemverilog multiply of the two inputs it applies.

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Jim Keller, former Intel, AMD, and Tesla engineer, aims to challenge Nvidia's dominance in AI with Tenstorrent's energy-efficient chip design. Tenstorrent's upcoming second-generation AI chip promises superior energy and cost efficiency, presenting a viable alternative to Nvidia's offerings. The innovative design of Tenstorrent's chip features independent decision-making cores, potentially reshaping AI chip technology across diverse applications. #AI #Nvidia #semiconductor #semiconductors #chip #technology #innovation #research #computing Tenstorrent NVIDIA https://lnkd.in/g6a3vAu4

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#HBM4 set to land sooner than expected 💡 Suppliers and JEDEC are bringing their HBM4 plans forward as they suspect the forecasted Gen #AI boom means incoming NVIDIA GPUs will need it sooner. High bandwidth memory (#HBM) bypasses #X86 socket-connected #DRAM capacity and bandwidth limits by having #memory dies stacked on top of a logic layer, with interconnecting TSV channels, all linked to a #GPU via an interposer component providing higher bandwidth than X86 sockets. The Joint Electron Device Engineering Council (JEDEC) confirms and issues HBM standards, with the current one being its fifth, HBM3E (extended). JEDEC has said it will issue a completed HBM4 spec by the end of this year – just few months ago the schedule was for a 2025 delivery. Preliminary HBM4 characteristics are emerging already. Thanks again to Chris Mellor and Blocks and Files for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eZp_wyHB #semiconductorindustry #semiconductors #semiconductor #technology #tech #innovation #semiconductormanufacturing #it #chip #chips #ic #it

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Qualcomm has approached Intel Corporation for a potential acquisition, which could lead to one of the largest M&A deals in history, though it is still uncertain if an agreement will be reached due to possible antitrust scrutiny. Intel's shares rose following the report of Qualcomm's interest, despite the company facing significant challenges, including a 37% decline in stock value over the past year and ongoing restructuring efforts led by CEO Pat Gelsinger. Qualcomm is engaging with U.S. regulators in hopes that an all-American merger could alleviate regulatory concerns, while Intel is also exploring various options and has received a boost from recent announcements, including a deal with Amazon Web Services (AWS). #semiconductor #technology #Intel #Qualcomm #Amazon #chipmaker

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Tackling Data Retention in SSDs (by Anil Burra from Intelligent Memory) 🤩 "SSDs have conquered the market due to their speed, durability, energy efficiency, and small form factor. However, write endurance and data retention are concerns in #embedded and #industrial applications, especially as the technology moves to ever smaller nodes." (Anil Burra) With the scaling of #NAND #flash #technology to higher densities (e.g., Triple-Level-Cell or Quad Level-Cell) and smaller process nodes, data retention becomes more challenging due to increased cell-to-cell interference and reduced margins for charge storage. Therefore, newer #technologies may have shorter specified data retention periods compared to older, more robust #SLC (Single-Level-Cell) or #MLC (Mul ti-Level-Cell) #NAND products. Two key factors affect data retention, the period over which #flashmemory can store #data without loss or corruption, in #NANDflash cells: program/erase (P/E) cycling and operating temperature. A very big thank you to Anil Burra from Intelligent Memory for this insightful article via Electronic Specifier Ltd with more background and insights via the link below 💡🙏👇 - A very good read to an important TOPIC 🤩 https://lnkd.in/eqdH7-N2 #semiconductorindustry #semiconductormanufacturing #innovation #it #ai #ssd #datastorage #automotiveindustry #embeddedsystems #ic #computer #computing #iot #memory #chip #chips #technology #tech

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Intel Corporation will now be spinning off it's Intel Foundry division into a wholly owned subsidiary and also consolidating all it's design operations into CCG (client computing group, or lpatop/PC division) and DCAI (datacenters and AI, the server group). Networking group NEX will remain for now, but it is too small now and I'm guessing it will be sold off. Qualcomm is already looking to acquire some of Intel's operations as per The Wall Street Journal; Qualcomm is most likely interested in the CCG piece. (https://lnkd.in/gYkgwxGq) Intel will likely break itself into three major pieces - Manufacturing/Foundry, CCG and DCAI will become separate companies. But let's talk about Intel Foundry : Intel consolidated all it's manufacturing and research into Intel Foundry which started reporting it's own P&L from Q1 of this year. But it wasn't a different legal entity which now Pat Gelsinger has announced will happen. But even then, without a much more massive US govt assistance, Intel can't pay to become competitive again. US govt is the only entity that can pay for, the R&D needed to catch to TSMC and match Samsung Semiconductor, pay for new fabs etc. However Intel's failure to get a customer (Broadcom most recently, and Qualcomm and NVIDIA long ago, dropped the 18A offering) created multiple problems - the US Commerce Department's conditons for funding were not being met. And since AMD never showed any interest, - any help to Intel Foundry, which has been a part of Intel (unlike help to TSMC and even Samsung Semiconductors - both of which have well established fab business and serve multiple customers), would be construe a help to wider Intel business which then competes with AMD, Qualcomm, Nvidia. The latest move to separate out the Foundry as a legal entity opens to path to solve multiple problems at month. In my speculation the following will happen before Q3'2025: (1) Intel Foundry will not only become a separate company (legal entity) as Pat Gelsinger has already announced, it will in fact drop the name "Intel" altogether and be names something like "American National Fab corporation" - National Semiconductor would have been a good name but it is already taken. (2) Intel (or whatever survives without Foundry) will have less than majority stake in the new entity. A consortium made of AMD, Qualcomm, NVIDIA, Texas Instruments, Analog Devices ... all the marquee names of US Semiconductor industry will also be "encouraged" by US Commerce department to aquire, between themselves, a majority stake. Even the likes of TSMC may be persuaded. (3) US Govt will subsequently open the floodgates of money to the foundry to make it a success. (4) The new owners will bring about management and technical ladder changes acutely needed. I hope this happens for the sake of the talented employees, the US and the world public.

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🔍 AMD’s Strategic Acquisition of ZT Systems: A Game-Changer for AI and Data Centers AMD’s recent $4.9 billion acquisition of ZT Systems isn’t just about expanding our chip business—it's about transforming how we deliver AI and data center solutions. Here's why this move matters: 1️⃣ World-Class Expertise: By acquiring ZT Systems, AMD gains 1,000 top-tier design engineers with deep expertise in motherboard, power, thermal, networking, and rack design. This strengthens our ability to create comprehensive, high-performance AI systems that go beyond just chips. 2️⃣ Staying Focused: While we’re acquiring ZT Systems, we’re divesting their manufacturing business. This ensures we stay aligned with our core strengths and avoid competing with our valued customers like Dell Technologies and Supermicro. 3️⃣ Enhanced AI Capabilities: This acquisition boosts AMD’s ability to serve a wider range of AI use cases, helping us close the gap with industry leaders like Nvidia. Our AMD Instinct MI300 system is already driving strong growth in data centers, and with ZT Systems, we’re poised to do even more. 4️⃣ Sustaining Strong Margins: By focusing on design and leaving manufacturing behind, AMD can maintain our strong profit margins, even as we bring on new talent and expand our AI offerings. 💼 The Bottom Line: This acquisition is a strategic move that positions AMD as a stronger competitor in the AI space, enhancing our ability to deliver full-system solutions that meet the evolving needs of data centers. We’re not just thinking outside the box—we’re redesigning it. ▶️ Want to dive deeper? Read the full The Wall Street Journal article on the acquisition, "AMD Deal Shows AI Chip Business Isn’t Just About Chips" here: https://lnkd.in/gFjtSpAv #AMD #ZTSystems #AI #DataCenters #Innovation #Leadership

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"𝑰𝒇 𝒚𝒐𝒖𝒓 𝒂𝒄𝒕𝒊𝒐𝒏𝒔 𝒊𝒏𝒔𝒑𝒊𝒓𝒆 𝒐𝒕𝒉𝒆𝒓𝒔 𝒕𝒐 𝒅𝒓𝒆𝒂𝒎 𝒎𝒐𝒓𝒆, 𝒍𝒆𝒂𝒓𝒏 𝒎𝒐𝒓𝒆, 𝒅𝒐 𝒎𝒐𝒓𝒆 𝒂𝒏𝒅 𝒃𝒆𝒄𝒐𝒎𝒆 𝒎𝒐𝒓𝒆, 𝒚𝒐𝒖 𝒂𝒓𝒆 𝒂 𝒍𝒆𝒂𝒅𝒆𝒓." -𝑱𝒐𝒉𝒏 𝑸𝒖𝒊𝒏𝒄𝒚 𝑨𝒅𝒂𝒎𝒔 Here is some latest update about Embedkari community : Good News : *One member joined commercial Satellite making company last month *One candidate joined as Sr FAE *Two have offers in hand *One member has Engagement ceremony this week and other is getting married. Both are sincere about career growth as well. We have few embedded system candidates available for PAN India, US, Canada and Remote *I started new Sunday batch today with 2.5 hours discussion for Cortex M Programming model , Memory model , NVIC , Assembly basics etc. We had good discussion over few Embedded C concepts as well. *Provided some tips for hardware debugging during doubt clarification session. My simple message to student : Try to learn the concept in the class itself. No need to just make a note and keep learning pending for future. Book your slots for live session in advance. Don't wait for any batch to be started. https://lnkd.in/gMsMHTYP #embeddedsystems #embeddedc #microcontroller #microcontrollers #embedded #embeddedsystem #embeddedlinux #freertos #firmware #firmwareengineer #firmwarejobs #devicedriver #softwareengineers #electronics #embeddedjobs #embeddedengineer #embedkari #indiajobs #careers #jobs #opentowork #openings #hiring #work #freshers

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We’re one day into DAC, and there have already been announcements that will shape the future of semiconductor design. One startup that I've followed closely for two years shared groundbreaking news that promises to revolutionize chip development and democratize accessibility to chiplets. Baya Systems emerged from stealth mode last week, and CEO and co-founder Sailesh Kumar has done a remarkable job of staying under the radar since founding the company, choosing the perfect moment to unveil updates. Baya revealed not only WHAT they’re working on but also HOW they plan to tackle some of the most pressing challenges faced by SoC architects and designers, and it’s inspiring. The complexity of system design, high costs, and long time-to-market for advanced SoCs often means that a chip can be nearly obsolete by the time it reaches customers. The rapid pace of innovation, especially in AI chips, creates an unforgiving environment where promising startups might only have one shot at success. Baya’s solutions, WeaverPro and WeaveIP, aim to accelerate the design and performance of complex single-die and multi-die SoCs and chiplets. By leveraging a software-centric architecture, Baya simplifies development and accelerates data movement between chiplets and dies. This approach reduces the overall costs associated with advanced AI and CPU acceleration and speeds up time-to-market. WeaverPro and WeaveIP have already received the best kind of acclaim, customer adoption, and Baya announced this week that chiplet technology advocate Tenstorrent will license their WeaveIP fabric to scale their AI and RISC-V chiplet solutions. Chip design icon Jim Keller, who sits on Baya’s Advisory Board, praised the company, saying: “Baya makes great, comprehensive fabric tools that start with top-level architecture and allow us to plan at a detailed level… this, coupled with their visualization tools, enables designers to build next-generation chips, chiplets, and IP.” Adding to their momentum, Baya announced a partnership with Blue Cheetah Analog Design, Inc. yesterday at DAC and introduced a combined chiplet-optimized Network on Chip and PHY interconnect IP solution that simplifies the design and architecture of chiplet-based systems. Sailesh said, “In partnership, we provide system architects with a state-of-the-art platform and powerful tools to create the most innovative and cost-effective chiplet-based products.”   I've mentioned before that enabling development is key to unlocking the door to innovation. For founders without deep pockets or connections to investors, gaining access to better tools and proven intellectual property allows them to move faster and at a lower cost, ultimately helping to bring new designs to life. I’m impressed that Baya, a small yet mighty startup, has created this accessibility and fostered partnerships to help proliferate it. My encouragement to the community - watch them closely. #semiconductorindustry #ai #chiplets

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/startrant A floorplan needs a human to start the tool somewhere to be able to get reasonably fast to a solution that has a chance of success. Because this is pure probability. Simplistic (KISS principle, I was made for teaching you): if you have 8 flops and you have 8 positions to place them, the first flop is placed at random in 8 potential places. Then the next flop has 7 possible positions. Then 6, 5, 4 ... until there is only one place left. But, we only looked at flops and we restricted the places to just 8 positions. Designs with hundreds of millions of gates are therefor a N! problem. And in the design, if you group two SPIs together (logically) and have them physically on different sides of the die, fictitious but plausible scenario, you can be constrained by the way the design is structured. You can flatten all hierarchy but if you use internal UVM agents, you need to connect to known signal names. In the nineties we were all-round engineers, knowing all front-end tasks and the consequence on backend work. Today we have partitioning, designers hating verification engineers and vice versa while working on the same goal, because we don't understand each other anymore. The whole blowup of the tape-out cost has a major factor related to simplistic hiring practices of single skilled people that are cheaper than multi-skilled people but in the end cost multiple times more in extra resources needed, waste (the circle problem between walled-off teams), over budget and too late for market tape-outs. But the excel cheaters don't see it because they are monitoring JIRA bugs opening and closed to get a feel of what is happening on the floor. Humans never learn and are never able to see their destructive influence on innovation and continuous improvement. /endrant

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#Memory Production Utilization Near Full Capacity, Surpassing Mature Nodes Foundries 💡 As memory prices and demand rise, memory manufacturers Nanya Technology and Winbond have resumed normal production, no longer reducing output as they did last year. TrendForce Corporation and industry sources cited in a report from Liberty Times Net also indicate that memory shipments will continue to recover in the third quarter. Reportedly, memory manufacturers’ utilization rates have reached 90% to 100%, surpassing the 60% to 70% utilization rates of mature process foundries. Last year, in response to market conditions, #Winbond adjusted its inventory and reduced production at its Taichung plant by up to 30-40%. This year, as market demand has rebounded, production has resumed, with capacity now at full utilization, producing 58,000 #wafers per month. Moreover, Winbond’s #Kaohsiung plant has introduced new capacity equipment, increasing monthly production from 10,000 to 14,000 wafers and upgrading processes from 25nm to 20nm. #Nanya Technology adjusted production levels dynamically last year, reducing output by up to 20%. However, production has gradually increased this year. Thanks again to TrendForce 集邦科技 for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/eKPUUCis #semiconductorindustry #semiconductors #dram #datacenter #pc #it #ai #smartphone #notebook #mobile #taiwan #industrial #technology #tech

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And the winning spree continues!!! Yet another feather on the cap - showcasing the presentation selected as "Best Paper" at the same prestigious DVCon Japan 2024 - "Optimizing UPF Integration Efficiency through Enabling Automation with UPVM for Unified Power Verification". Silicon Interfaces

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My article on SuperComputing Architecture Shift in EFY's Aug Magazine. "The silicon chipset, which is procured from Intel as of today, is the most crucial component in the high-performance compute server. Everything involved in making a supercomputer like the motherboard, the rack, cooling systems, and the software stack, depends on the architecture and features of the silicon chipset. " Electronics For You #Aum #Supercomputing #HPC

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BREAKING: A POTENTIAL Qualcomm-Intel MERGER COULD Reshape the Semiconductor Industry Amid Intel's Struggles. US network CNBC has confirmed that Qualcomm recently approached Intel Corporation about a possible takeover. While it remains unclear if Intel has engaged in formal discussions or what the terms might be, this potential merger—if it goes through—could rank among the most significant tech deals in history, with Intel’s market cap exceeding US $90 billion. Once the global leader in chipmaking, Intel has experienced a steady decline, a situation exacerbated in 2024. The company reported disappointing earnings earlier this year, triggering the largest single-day stock drop in over five decades. Intel shares have plummeted 53% year-to-date as investors question its costly strategy to manufacture and design its own chips. This contrasts sharply with Qualcomm’s more asset-light approach, which relies on partners like TSMC Semiconductor Manufacturing Company and Samsung Semiconductor for production. Intel’s efforts to bounce back include a bold $100 billion investment plan to expand its foundry business over the next five years, but the firm has struggled to capitalize on the booming artificial intelligence (AI) market. NVIDIA, not Intel, has claimed more than 80% of the rapidly growing AI chip market, especially for systems like ChatGPT. Qualcomm, despite generating less revenue than Intel in 2023 (US $35.8 billion vs. $54.2 billion), might see the potential for a broader market share and technical synergies from a merger, particularly in the AI space and computing. Boardroom Moves & Strategic Delays Intel CEO Pat Gelsinger has recently sought to reassure employees of the company’s long-term vision, emphasizing its commitment to the foundry business. However, in a significant update, Intel also announced the delay of its Magdeburg project in Germany—a cornerstone of Europe's semiconductor manufacturing ambitions—pausing construction for two years. A Qualcomm-Intel merger, however, wouldn’t come without hurdles. Both companies have faced antitrust scrutiny in the past, especially from Chinese regulators. Intel’s failed bid for Tower Semiconductor and Qualcomm's blocked attempt to acquire NXP Semiconductors are cautionary tales of how international regulatory frameworks can derail deals. The national security landscape also looms large—Broadcom's $100 billion bid to acquire Qualcomm was blocked in 2018 by the Trump administration over concerns about foreign ownership. Similarly, Nvidia’s attempted purchase of Arm was shelved in 2022 following pressure from regulators in multiple regions. What is ahead? Both companies have declined to comment, but the stakes are clear: A successful merger would signal a dramatic realignment of power in an industry critical to everything from consumer electronics to defence technologies. And what about the impact on photonics? #Qualcomm #Intel #Mergers #AI #NationalSecurity #Chipmaking #Nvidia #TSMC

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✨𝗘𝘅𝗰𝗶𝘁𝗶𝗻𝗴 𝗶𝗻𝘀𝗶𝗴𝗵𝘁𝘀 𝗶𝗻𝘁𝗼 𝗼𝗽𝘁𝗶𝗺𝗶𝘇𝗶𝗻𝗴 𝗔𝗜 𝘄𝗼𝗿𝗸𝗹𝗼𝗮𝗱𝘀 𝗮𝗻𝗱 𝗯𝘂𝗶𝗹𝗱𝗶𝗻𝗴 𝘁𝗼𝗼𝗹 𝗰𝗵𝗮𝗶𝗻𝘀 𝗳𝗼𝗿 𝗥𝗜𝗦𝗖-𝗩 𝗮𝗰𝗰𝗲𝗹𝗲𝗿𝗮𝘁𝗼𝗿𝘀 💨💨💨 Last month at the RISC-V Summit in Santa Clara, Dr. Jeremy Bennett from our partner Embecosm delivered a compelling talk on using open-source tools like oneAPI and OpenCL to efficiently run neural network models on high performance RISC-V AI accelerators. Key takeaways included: 🔹Practical methods for offloading operations from PyTorch with "the PrivateUse1 interface," allowing efficient dispatch to custom accelerators.  🔹 Prototyping with QEMU to test RISC-V configurations pre-silicon.  🔹 The use of the oneAPI Construction Kit from the Unified Acceleration Foundation, now part of PyTorch 2.4, for rapid bring-up AI of accelerators. Special thanks to Akeana for their support in helping drive this important work forward in conjunction with Embecosm and Ashling. You can check out a video of the full talk here: [https://lnkd.in/ezx7AKiY] or just grab the slides here: [https://lnkd.in/esWsV4Xk] Thanks. #RISCVEverywhere #RISCVSummit #oneAPI #AI #hardwareacceleration

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In my two decades of recruiting, I've rarely seen the investment in hardware startups like that surrounding AI. Its rapid rise has brought many newcomers vying to make compute more efficient. But, this makes it tough for customers to separate the "signal from the noise". The harsh reality is that some offer little more than concepts—essentially, vaporware. This undermines years of work by patent-holding researchers but it’s the operating reality for startups like Ayar Labs, whose collective time invested in R&D can be measured in centuries rather than decades. What started in 2015 as the brainchild of Professor Milos Popovic, Alex Wright-Gladstein, and five eminent researchers soon evolved into a company that showed immense promise for integrating photonics and processors to accelerate computing. They took a deliberate path, ignoring hungry VCs and choosing strategic investors like GlobalFoundries, Intel, and Applied Materials, allowing them to focus on advancing their technology and mission. Under their first commercial CEO Charlie Wuischpard, he led them to a key design win in 2022 that fueled investor confidence and resulted in an additional $130M in funding. But if you ask any photonics engineer or architect, they’ll tell you using this technology to accelerate computing is BRUTAL. Combining photons and electrons requires a Herculean level of precision and deep insight into physics and engineering. Recognizing this, Ayar’s Board looked within and tapped co-founder and Chief Scientist Mark Wade to be their new CEO in 2023. This was a stroke of brilliance. Not only has Mark helped shepherd the company through their most painstaking technical developments, but he’s also been an evangelist for optical interconnectivity, attending what seems like every top conference to share its potential. Under Mark, Ayar has progressed to have not one, but two revenue-generating products and they’re shipping tens of thousands. BUT (and excuse me for framing it that way) in our industry, you’ve got to be in the “hundred million club” to make it; frankly, the clock is ticking and competitors are circling. Ayar turns ten next year and the game has changed. That AI gold rush I mentioned has made it harder to get in front of customers with a salient value proposition, and the same goes for attracting talented engineers and leaders. Those we recruit are leery of startups making big claims. My advice to Mark and the rest of the team is to go BIG or go HOME. Secure the next round of funding and expand the team swiftly and holistically. Do an entire team lift-out! You’ll save time and accelerate faster through a group with proven synergy rather than hiring piecemeal. I’ve said it before: 2025 is primed to be the year photonics revolutionizes the data center so make your moves now because you don’t want to be left on the sidelines when all the key players have already been picked. #semiconductorindustry #photonics #artificialintelligence

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HBM (High-Bandwidth Memory), which is based on DRAM products, is a crucial building block for data centers. The following article addresses some complex issues in building such products. https://lnkd.in/gSYcAxuN

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#Startup Tackles #Chiplet Design Complexity 💡 Baya Systems is coming out of stealth mode to take the guess work out of #chiplets 👏 In a briefing with EE Times | Electronic Engineering Times, Nandan Nayampally, Baya’s chief commercial officer, said that with #SoC and chiplet system design, as well as #software development complexity exploding, there is also a growing need to accelerate analysis, design, and deployment of chiplets. He said Baya’s broader agenda is to tackle the data movement bottleneck faced by #AI workloads in #heterogeneous #computing environments, or what Baya said is now “intelligent compute.” Nayampally said a more cohesive system is necessary to reduce data movement, even as more complex #memory hierarchies and processing solutions are coupled together. Chiplets provide a solution but even with standardization, there is a need for tools to support an end-to-end workflow as software development for both them and SoCs gets more complex, he added. A big thank you again to Gary Hilson and EE Times | Electronic Engineering Times for the full article with more background and insights via the link below 💡🙏👇 https://lnkd.in/es_tUdPh #semiconductorindustry #semiconductormanufacturing #semiconductor #technology #innovation #tech #chip #chips #ic #foundry #aiot #it #ml #cloud #datacenter #data #computing #computer #server

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