Brian O'Keeffe

PCB Directory has listed Solder Flux for PCBs from the leading manufacturers. View and compare Solder Flux from multiple manufacturers on the PCB Directory. Click here to learn more https://ow.ly/Z5IQ50R6f1F #pcb #directory #solder #products #flux #solderflux #manufacturers #global #industry

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Settle an argument for me! I didn't expect to start Monday with an argument about solder mask defined pads and non solder mask defined pads. But here we are. You can blame Sean Kincaid and Elias Malfavon Jr. for this! My anecdotal experience has shown it is easier to control the results when you have non solder mask defined (NSMD) pads. I do not have hard data on this from my own research yet, but I was curious to hear the opinion of others. Careful what you wish for! To the PCB designers, can you explain the reason why you use one over the other? Robert Gray, what is your experience dealing with each?

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🧪 Understanding Acid Traps in PCB Design Acid traps are areas on a PCB that can collect corrosive chemicals during the etching process, potentially compromising board integrity. Learn about acid trap prevention and how to ensure a more reliable design. 👉 Read More: https://ow.ly/ig4q50ReJ1T #PCB #PCBDirectory #TechnicalArticle #PCBDesign #CorrosionPrevention #AcidTrap #PCBManufacturing #IndustryInsights

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The Semiconductor Industry Association (SIA) projects the U.S. semiconductor industry workforce will grow by nearly 115,000 jobs by 2030, a 33% increase! This growth creates a golden opportunity, especially in chip testing, a critical but understaffed area. Why Invest in Chip Testing Skills? ➡ High Demand, Limited Talent: The chip testing field is facing a significant talent shortage, hindering production efficiency. Filling this gap is crucial. ➡ Specialized Skillset: Chip testing requires a unique blend of engineering expertise, software knowledge, and sharp analytical thinking. ➡ Future-Proof Your Career: As chip complexity skyrockets, the demand for skilled testers will only rise, offering long-term career security. At SilTest Semiconductors, we're committed to fostering the next generation of chip testers. That's why we launched SilTest Academy: 🔀 Tailored Training Programs: We offer a comprehensive curriculum designed to meet the specific needs of the industry. 🔀 Expert Instructors: Learn from industry veterans with real-world experience in chip testing methodologies. 🔀 Hands-on Learning: Gain practical skills through simulations and real-world testing scenarios. 🔀 Career Support: We equip graduates with the knowledge and connections to launch successful careers in chip testing. Join us in building a future-ready workforce for the semiconductor industry. Visit SilTest Academy to learn more! #semiconductors #chiptesting #workforcedevelopment #futureoftechnology #SilTestAcademy

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6 Steps of Semiconductor Testing (for non-engineers): 🔍 Wafer Probing: Imagine a large circular slice of semiconductor material loaded with countless tiny electronic chips. Wafer probing is like giving each chip a quick check-up before they're separated and packaged. It ensures they're working correctly right from the start, like a preliminary health screening for electronics! 💡 Fine Pitch & Micro Bumped Wafers: To pack more circuits into smaller spaces, engineers use innovative techniques like fine pitch and micro bumped wafers. Think of it as fitting more passengers onto a bus without overcrowding – it's about maximizing efficiency and space utilization on the semiconductor wafer. 🔌 DC to Full RF Probing: Now, let's talk about the tools used in wafer probing – probe cards. These nifty gadgets are designed to handle various electrical signals, from the steady flow of Direct Current (DC) to the speedy transmissions of Radio Frequency (RF). It's like having a versatile tool belt for testing electronic circuits of all kinds! 🚀 High Multisites Testing: Testing one chip at a time is efficient, but testing multiple chips simultaneously is even better! High multisites testing allows engineers to check several chips on the same wafer at once, speeding up the process like scanning multiple items at a grocery store checkout. Efficiency at its finest! 📊 Wafer Sorting Interface: Once the chips are probed and tested, it's time to sort them based on their performance and quality. This process is akin to grading exam papers – chips that meet the standards get a pass, while those that fall short are flagged for further inspection or adjustments. It's all about ensuring only the best chips make it to the final product! 🔬 Final Testing: Before the chips are packaged and shipped off to power our devices, they undergo one last round of rigorous testing. This final check ensures that each chip meets the highest standards of quality and reliability. It's like the grand finale of a fireworks show – a dazzling display of precision and perfection! For opportunities to work on semiconductor test processes, contact us at DELVE Search! #semiconductor #semiconductorjobs #semiconductortest #osat #advancedpackaging

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Charge storage capacitors play a uniquely important role in transmit amplifier circuits for radar, so choose your capacitors wisely: https://hubs.ly/Q02JxNGf0

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Replace your MOSFETs with GaN: Enter any low voltage MOSFET (up to 350V) and get our parts with parameters and Digi-Key prices. #GaN #MOSFETReplacement https://hubs.ly/Q02J0zjZ0

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Mini-Q&A about physical burn options for RENICE R-SATA SSD 🔔 Q1️⃣:Flash whether be burned out? 🚨 A:Yes. ✅ Q2️⃣:Is the burned hard drive a high voltage breakdown of Nand Flash particles? 💥 A:Yes. ✅ Q3️⃣:What can be done to trigger physical burnout? ❓ A: This can be done by pressing a button 🛎 , or you can set some condition so that the SSD automatically triggers the burn. · For example, if the SSD is bound to a host, when the SSD is inserted into an invalid host, the burn function is automatically triggered after the SSD is powered on 💻 . The SSD can be limited to a certain distance range, and if the SSD is out of this range, the destruction procedure is automatically initiated 🛰 . · In short, burning is only the basic function, combined with different application scenarios can meet a variety of derivative destruction needs. 💾 ·In fact, physical burn SSD is a double-edged sword, when the need to destroy, physical burn can completely destroy the SSD. ·But if an error burns the hard drive when it doesn't need to be destroyed, the data on it will be completely unrecoverable. ·Therefore, data security can not only rely on the security protection design on the SSD, but also the user's caution. · The RENICE R-SATA SSD is designed for extreme environments with safety options, making it ideal for aerospace, military and defense use. For more details or inquiries, feel free to reach out to us 🤗 Look forward to working with you !

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Gap capacitors are a type of SMT capacitor used in high-frequency applications. They are essentially 2 single-layer capacitors placed in series with a ‘GAP’ between them. Click here to learn more about GAP Capacitors - https://ow.ly/ZTrz50SPWRH #gap #capacitor #electronics #powerelectronics #capacitance #rf #transmitter #receiver #amplifiers

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TT Electronics launches LRF4W High Power SMT Shunt Resistor. https://lnkd.in/gvj3bCDQ TT Electronics plc #TTElectronics #ShuntResistor #CurrentSensing #HighPower #AECQ200 #SMTTechnology #PowerConversion #MotorControl #Engineering #BatteryManagement #ThickFilm #PCBAssembly #EnergyEfficiency #SurgeProtection #Reliability

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LAST CHANCE TO REGISTER! Join us Tues, June 18 at 10am CST for a webinar to learn how you can increase yield in your semiconductor wafer manufacturing process by optimizing the thermal loop system through proper component selection, installation, & performance testing: https://hubs.ly/Q02yRXjx0

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Discover how Kalray pioneers data processing unit (DPU) development with AI-based Cadence tools including Cadence Cerebrus Intelligent Chip Explorer, Innovus Innovation System, and Voltus IC Power Integrity Solution. Learn more here: https://ow.ly/iY8r50Tf00y

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🔹 Onto Innovation Debuts Sub-surface Defect Inspection for Advanced Packaging 🔹 New capability released for the Dragonfly® G3 inspection system enables 100% wafer inspection for critical sub-surface defects 🔹 Onto has received multiple orders in support of high bandwidth memory (HBM), advanced logic and a variety of specialty segments Onto Innovation Inc. today announced the release of a new sub-surface inspection capability for the Dragonfly® G3 sub-micron 2D/3D inspection and metrology platform. The new capability enables whole wafer inspection for critical yield impacting defects that can lead to lost die as well as entire wafers breaking in subsequent process steps. Such defects were previously impossible to find in a production environment. In today’s world of wafer thinning and multi-layer wafer or die bonding, sub-surface defects are far more dangerous than ever before as bonded layers are now a tenth of their former thickness and far more brittle and therefore more susceptible to damage pre- or post-bonding. Sub-surface defects that occur during the bonding or thinning process such as micro-cracks can cause not only die yield issues, but wafers can be shattered resulting in the loss of hundreds of die in an instant. For more, please visit: https://lnkd.in/ef5VSUXF. To learn more about the Dragonfly system, please visit: Dragonfly G3 System - Onto Innovation.

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