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#DDR5 #spot #price is relatively supportive; #DDR4 is difficult to see a rebound in the short term! Similar to the price trend of the contract market, #DDR5 is relatively supportive, but the quotation pressure of DDR4 is very obvious. In order to avoid subsequent inventory pressure, the three major suppliers are eager to get rid of their existing DDR4 chips, so #TrendForce believes that the spot price trend of DDR5 and DDR4 will be decoupled, and the price recovery will be difficult to occur in DDR4 products. The price of DDR4 1Gx8 2666MT/s dropped by 0.94% (US$1.905 to $1.887) during the week. 📖 Related hashtag #DRAM News: https://buff.ly/4aBteNm 🔗 📊 More hashtag #DRAM價格 news: https://buff.ly/3VORebT 🔗

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7 factors that impact RF PCB design 1. Impedance matching 2. Radio-frequency board materials 3. RF PCB stack-up 4. RF trace design 5. Design of ground planes 6. Via design 7. Power supply decoupling -- Read the article for PCB design tips. #RadioFrequency #Wireless #ElectricalEngineering

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Keysight RF expert and YouTuber, Anurag Bhargava, recently appeared on the The EEcosystempodcast to discuss the challenges of 3D #RF module design, particularly the integration of dissimilar technologies into compact form factors. He emphasized the crucial role of an open, interoperable ecosystem of design tools, and the importance of simulation and characterization in ensuring system-level performance and reliability. Tune in to gain valuable insights on overcoming these engineering hurdles for driving innovation forward! https://gag.gl/ga1U7t

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MathWorks welcomes Cadence #Tensilica #DSP into the Connections program for an integration that enables rapid porting of #MATLAB and #Simulink models, including #PIL (processor-in-the-loop) capability as well as verification and testing of generated code.

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Case study: reverse engineering a flex PCB to generate design files Our PCB design engineers reverse-engineered a flex circuit to recreate the design files and optimize the LCD connectivity. The FPC connected the LCD display and the main rigid circuit board. Since the client didn't possess the design files, we had to redesign the board to generate the Gerber files to get the board manufactured. In this case study, you'll learn how our design engineers overcame three major issues: lack of original PCB design and layout documentation, ensuring accurate pad alignment, and addressing complex routing requirements. -- Read the case study. -- Send this to PCB designers and hardware engineers. #rigidflexpcbdesign #flexiblepcb #reverseengineering

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Don't miss out on our new major design guide release with the PCB Stack-Up Design Guide! Stack-up design significantly impacts PCB factors such as signal integrity, power distribution, and thermal management. It provides the mechanical support necessary to withstand physical stresses and environmental factors. A well-designed signal-to-ground plane arrangement minimizes cross-talk and signal distortions. See what’s inside and download: - Design guidelines for HDI, flex, and hybrid stack-ups - Stack-up representation in fab drawing - DFM checks for layer stacks - Manufacturing tolerances - Inspection methods - PCB stack-up examples with illustrations https://lnkd.in/gFUSamY3 #pcb #pcbdesigner #pcbdesigning #pcbmanufacturer

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In this ✨FREE✨ course, learn how to save time, effort, and avoid wasting RF board hardware: https://gag.gl/0iAmaD? Eliminate wasteful cut-and-try RF #BoardDesign iterations and instead meet specs in one pass using accurate #RF paths simulation BEFORE building hardware. #PCB #EngineerEducation #Technology

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6 common challenges in designing a high-density board 1. The increased component density and multiple signal layers result in complex routing requirements within a limited space. This leads to routing congestion and increases the risk of crosstalk. 2. Traces of varying lengths due to a compact layout can lead to propagation delays and skew between signals. 3. Impedance mismatch in HDI due to insufficient trace widths and spacing causes signal reflections and signal degradation. 4. The compact layout can make it challenging to ensure low-impedance power distribution and effective decoupling, leading to voltage fluctuations. 5. For HDI designs operating at high frequencies, electromagnetic phenomena such as skin effects and dielectric losses become significant, leading to signal attenuation and distortion. 6. Miniaturized components, densely packed traces, high-speed signal switching, and component power dissipation can lead to localized heating, damaging ICs. -- Read the blog for 10 best design practices for maintaining signal integrity in HDI PCBs. #HDI #SignalIntegrity #PCBLayout #ElectricalEngineering

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Explore the latest insights on TDECQ measurement accuracy in Greg Le Cheminant's recent Electronic Design article. Gain insights into ensuring data reliability and understanding instrumentation effects—essential for professionals in optical communications. #TDECQ #ElectronicDesign <https://gag.gl/bOSPY5?>

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9 factors that impact #RFPCB designs and tips to resolve them 1. #Substrates with Dk>4 increase propagation delay 2. Impedance mismatch leads to inefficient signal transmission 3. Asymetrical RF stack-up leads to board warping 4. Narrow RF traces increase heat generation 5. Inadequate RF ground planes increase interference 6. Vias induce parasitic capacitance in RF boards 7. Inefficient power supply decoupling increases noise 8. Poor shielding increases RF interference 9. Inefficient thermal management alters the dielectric properties of RF PCBs -- Read the blog to learn the best practices to design an RF board. -- Share this post with #RFengineers. #pcblayout #pcbdesign #electricalengineering

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Welcome to V.E.R.N At high-frequency signals, the signal traces on a PCB act like transmission lines, which have an impedance at each point on the signal trace trajectory. If this impedance varies from one point to the next one, there will be a signal reflection whose magnitude will depend on the difference between the two impedances. The larger the difference is, the greater the reflection will be. This reflection will travel in the opposite direction of the signal, which means that the reflected signal will superimpose on the main signal. https://lnkd.in/gDdbqMxm #pcb #ee #electricalengineering #impedance #signal #tech #madeinusa #video #techjoke

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China's Double 11 Shopping Festival is approaching, #NAND bargaining tide may intensify..... The spot market demand is weak, the buying gas is sluggish, and how to reduce inventory has become the primary goal at present. In the #retail and #channel #markets, there are frequent low-price sell-offs, and some of the larger #module manufacturers are even selling #client #SSDs at a loss to speed up inventory clearance. As China's Singles' Day Shopping Festival approaches, this wave of price bargaining will become more pronounced, so spot market prices are expected to continue to decline. This week, the spot price of #512Gb #TLC wafer fell by 0.08% to US$2.493.

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Pulse Electronics Corporation TLVR Dual Winding Inductors. These inductors feature TLVR topology that enables faster transient response and utilizes a dual-winding power bead inductor. https://lnkd.in/gnYMdzbY

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How to pick #RF PCB materials: 6 important factors to consider When designing RF PCBs, selecting the suitable material is pivotal for achieving optimal board performance. The properties of the RF laminates directly impact signal integrity, thermal management, impedance uniformity, dimensional stability, and manufacturing efficiency. Article highlights: When designing radio-frequency boards: 1. Choose laminates with a low dielectric constant (<4) and low dissipation factor (<0.005). 2. Select materials with similar CTEs to prevent warping and improve reliability. 3. Opt for high thermal conductivity materials for effective heat dissipation. 4. Use low-profile copper foils to reduce signal losses. -- Read the article to learn how to choose the right dielectric material for your RF prototypes. -- Send this to post to PCB designers and engineers. #rfengineering #rfdesign #highfrequencypcb #electricalengineering

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