Chip Industry Week In Review

By The SE Staff - 08 Nov, 2024 - Comments: 0

Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

Workload-Specific Data Movements Across AI Workloads in Multi-Chiplet AI Accelerators

By Technical Paper Link - 04 Nov, 2024 - Comments: 0

A new technical paper titled "Communication Characterization of AI Workloads for Large-scale Multi-chiplet Accelerators" was published by researchers at Universitat Politecnica de Catalunya. Abstract "Next-generation artificial intelligence (AI) workloads are posing challenges of scalability and robustness in terms of execution time due to their intrinsic evolving data-intensive characteris... » read more

Globally Asynchronous, Locally Synchronous Clocks

By Ed Sperling - 04 Nov, 2024 - Comments: 0

Typical IC clocking schemes are under stress in complex chip/chiplet designs, where multiple compute elements may not be operating at the same frequency consistently. Some cores may be powered down to save energy, or they may age at different rates, which in turn reduces performance. Lee Vick, vice president of strategic marketing at Movellus, explains why locally asynchronous clocking schemes ... » read more

Revolutionizing High-Performance Silicon With Next-Gen Chiplets

By Shivi Arora - 31 Oct, 2024 - Comments: 0

By Shivi Arora and Sue Hung Fung As 5G wireless communications systems continue to be deployed, enterprises are busy planning for 6G—the next generation of wireless communications set to transform our lives. Poised to merge communication and computing, 6G promises to create a hyperconnected world that blends digital and physical experiences with ultra-fast speeds and low latency as a start... » read more

Early Architecture Performance and Power Analysis of Multi-Die Designs

By Synopsys - 30 Oct, 2024 - Comments: 0

Despite the clear advantages of multi-die designs, there are numerous new challenges that stand in the way of multi-die design realization. This white paper focuses on those challenges that can be addressed by early architecture exploration of multi-die designs, including: -System pathfinding -Memory utilization and coherency -Power/thermal management Find out how to overcome such chall... » read more

Advanced Packaging Driving New Collaboration Across Supply Chain

By Gregory Haley - 24 Oct, 2024 - Comments: 0

The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems. At the heart of this change is the convergence of heterogeneous integration, chiplets, and 3D stacking. Heterogeneous approaches allow companies to combine different te... » read more

New Approaches To Power Decoupling

By Bryon Moyer - 24 Oct, 2024 - Comments: 0

Decoupling capacitors have long been an important aspect of maintaining a clean power source for integrated circuits, but with noise caused by rising clock frequencies, multiple power domains, and various types of advanced packaging, new approaches are needed. Power is a much more important factor than it used to be, especially in the era of AI. “Doing an AI search consumes 10X the power t... » read more

Current and Emerging Heterogeneous Integration Technologies For High-Performance Systems (Georgia Tech)

By Technical Paper Link - 23 Oct, 2024 - Comments: 0

A technical paper titled "Heterogeneous Integration Technologies for Artificial Intelligence Applications" was published by Georgia Tech. Abstract "The rapid advancement of artificial intelligence (AI) has been enabled by semiconductor-based electronics. However, the conventional methods of transistor scaling are not enough to meet the exponential demand for computing power driven by AI. ... » read more

Open-Source, Chiplet-Compatible RISC-V Controller

By Technical Paper Link - 22 Oct, 2024 - Comments: 0

A new technical paper titled "ControlPULPlet: A Flexible Real-time Multi-core RISC-V Controller for 2.5D Systems-in-package" was published by researchers at ETH Zurich and University of Bologna. Abstract "The increasing complexity of real-time control algorithms and the trend toward 2.5D technology necessitate the development of scalable controllers for managing the complex, integrated oper... » read more

Unbundling Analog From Digital Where It Makes Sense

By Ed Sperling - 17 Oct, 2024 - Comments: 0

Semiconductor Engineering sat down to discuss what's changing in analog design with the shift toward heterogeneous integration and more safety- and mission-critical applications with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal product manager for custom I... » read more

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Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

tag: chiplets