Nor Budi Cahyono

How to Choose the Right Collector Emitter Breakdown (Max) Voltages in #IGBTModules for Your Application? 1. Identify Your System’s Operating Voltage Start by determining the maximum operating voltage of your system. A good rule of thumb is to select an IGBT with a VCE(max) at least 1.5 to 2 times higher than your system’s peak operating voltage. 2. Account for Voltage Spikes and Transients Voltage transients caused by inductive loads or switching events can exceed the normal operating voltage. A higher VCE(max) helps protect against these spikes. Analyze your system’s transient behavior to ensure adequate headroom. 3. Consider Efficiency Requirements If efficiency is a critical factor, avoid unnecessarily high breakdown voltages. Instead, select a module optimized for lower conduction and switching losses within your voltage range. 4. Evaluate Cost vs. Performance Balance your budget with performance needs. For low to medium voltage applications, a lower VCE(max) IGBT may offer sufficient performance at a reduced cost. 5. Check Thermal Management Higher-rated IGBT modules may generate more heat. Ensure your system’s cooling design can handle the thermal load to avoid derating or failure. Selecting an IGBT module with an appropriately rated VCE(max) ensures optimal performance, reliability, and cost-effectiveness for your specific needs. Perceptive offers a wide range of IGBT modules to meet your unique requirements. #IGBTPerformance #SelectIGBT #ElectricVehicles #Perceptive #IGBTModulesApplication #ElectronicsIndustry #PowerElectronics #ElectricalEngineering #IGBTModuleVoltageRatingSelection #VoltageCollectorEmitter #ElectronicComponentsDistributor

𝖠 𝖢𝗈𝗆𝗉𝗅𝖾𝗍𝖾 𝖦𝗎𝗂𝖽𝖾 𝗍𝗈 𝐂𝐚𝐛𝐥𝐞 𝐀𝐬𝐬𝐞𝐦𝐛𝐥𝐲 .. [ PDF Guide ] ➤ 𝐂𝐥𝐢𝐜𝐤 𝐡𝐞𝐫𝐞 𝐟𝐨𝐫 𝐏𝐃𝐅 >> https://lnkd.in/ddDGEhDa #Cable #assembly is a collection of wires and cables banded together in a single unit. It is used to connect various types of systems and equipment to carry out its desired operation in component and finished product manufacturing. These assemblies are majorly used in industries such as automotive, computers and peripherals, telecom/ datacom, military/aerospace, industrial, consumer, transportation, medical, instrumentation, business/office, and others. # 𝐊𝐞𝐲 𝐏𝐥𝐚𝐲𝐞𝐫𝐬: TE Connectivity Ltd. (Switzerland), Amphenol Corporation (U.S.), Molex, LLC (U.S.), 3M (U.S.), Lapp Group (Germany), Eland Cables Limited (“Eland Cables”) (U.K.), Flux Connectivity Inc. (Canada), Fischer Connectors SA (Switzerland), CommScope, Inc. (U.S.), Rosenberger Hochfrequenztechnik GmbH & Co. KG. (Germany), etc. # 𝗗𝗿𝗶𝘃𝗲𝗿𝘀: ➮  Increasing Demand from the #AerospaceIndustry ➮  Growing Internet Penetration Across the Globe Some of the #cableassemblies used in data centers include rectangular cable assemblies, #fiberopticcable assemblies, #powercable assemblies, and modular cable assemblies. Fiber optic cable assemblies are most commonly used in data centers for high-speed data transmission over long distances. Power cable assemblies and custom #cableassemblies, including those with fire-resistant coating, provide reliable power distribution throughout the facility and help meet specific safety and regulatory requirements within data centers. #ElectricVehicle #fiberoptics #VideoCable #RadioFrequency #powercables #telephonecable #computers #cables #cablemanagement #cabling #adas #telecommunication #telecom #datacom #wireandcable #cableharness #wiringharness #wireassembly #connectors #wireharnessprocessing #wireharness #Cableassembly #customcable #Peripheral #ElectricVehicles #Vehicles #wires #telecommunications

𝖠 𝖢𝗈𝗆𝗉𝗅𝖾𝗍𝖾 𝖦𝗎𝗂𝖽𝖾 𝗍𝗈 𝐂𝐚𝐛𝐥𝐞 𝐀𝐬𝐬𝐞𝐦𝐛𝐥𝐲 .. [ PDF Guide ] ➤ 𝐂𝐥𝐢𝐜𝐤 𝐡𝐞𝐫𝐞 𝐟𝐨𝐫 𝐏𝐃𝐅 >> https://lnkd.in/ddDGEhDa #Cable #assembly is a collection of wires and cables banded together in a single unit. It is used to connect various types of systems and equipment to carry out its desired operation in component and finished product manufacturing. These assemblies are majorly used in industries such as automotive, computers and peripherals, telecom/ datacom, military/aerospace, industrial, consumer, transportation, medical, instrumentation, business/office, and others. # 𝐊𝐞𝐲 𝐏𝐥𝐚𝐲𝐞𝐫𝐬: TE Connectivity Ltd. (Switzerland), Amphenol Corporation (U.S.), Molex, LLC (U.S.), 3M (U.S.), Lapp Group (Germany), Eland Cables Limited (“Eland Cables”) (U.K.), Flux Connectivity Inc. (Canada), Fischer Connectors SA (Switzerland), CommScope, Inc. (U.S.), Rosenberger Hochfrequenztechnik GmbH & Co. KG. (Germany), etc. # 𝗗𝗿𝗶𝘃𝗲𝗿𝘀: ➮  Increasing Demand from the #AerospaceIndustry ➮  Growing Internet Penetration Across the Globe Some of the #cableassemblies used in data centers include rectangular cable assemblies, #fiberopticcable assemblies, #powercable assemblies, and modular cable assemblies. Fiber optic cable assemblies are most commonly used in data centers for high-speed data transmission over long distances. Power cable assemblies and custom #cableassemblies, including those with fire-resistant coating, provide reliable power distribution throughout the facility and help meet specific safety and regulatory requirements within data centers. #ElectricVehicle #fiberoptics #VideoCable #RadioFrequency #powercables #telephonecable #computers #cables #cablemanagement #cabling #adas #telecommunication #telecom #datacom #wireandcable #cableharness #wiringharness #wireassembly #connectors #wireharnessprocessing #wireharness #Cableassembly #customcable #Peripheral #ElectricVehicles #Vehicles #wires #telecommunications

🔎 When replacing components or troubleshooting, the pins of the original components need to be removed from the PCB board. 𝗠𝗼𝗿𝗲 𝗗𝗲𝘁𝗮𝗶𝗹𝘀:https://qcxpcba.ru/ #pcb #pcba #ElectronicComponents #smt

How to TSVs Manufactured???? **Through-Silicon Vias (TSVs)** are a critical technology for connecting various die in a stacked die configuration. They allow for vertical interconnection between different layers of integrated circuits (ICs) in a 3D integration scheme. Here's how TSVs are manufactured: 1. **Etching the Via**: - TSVs are created by etching trenches into the silicon substrate or a dielectric material. - The via is essentially a vertical hole that penetrates through the layers of the stacked ICs. 2. **Barrier and Seed Layer Deposition**: - After etching, the via is lined with a barrier layer to prevent copper diffusion. - A seed layer is then deposited on top of the barrier layer. - The barrier layer ensures the integrity of the diffusion barrier, while the seed layer provides a foundation for subsequent copper deposition. 3. **Copper Filling**: - The via is filled with copper using some form of aqueous deposition. - The copper fills the via from the bottom (where the seed layer is) to the top. - The deposition process ensures that the via is completely filled with copper, creating a conductive path between the stacked die. 4. **Challenges and Considerations**: - TSVs are larger than typical interconnects in integrated circuits. Their diameters can range from 5 microns to several tens of microns. - High aspect ratios (depth-to-width ratio) and scalloped sidewall profiles are challenging for physical vapor deposition (PVD) processes used for barrier and seed layer deposition. - Electrografting, an electrochemical process, has been proposed as a solution for TSVs. It applies an electrical current to an aqueous solution containing chemical precursors, allowing controlled deposition of metals or polymers onto conducting or non-conducting surfaces¹[1]. In summary, TSVs play a crucial role in achieving efficient communication and functionality in 3D ICs by providing vertical interconnections between stacked chips¹[1] ²[2].

Understanding PCB Failures: Common Causes and Prevention Strategies https://buff.ly/3UxqoCG #PCB #PCBs #PCBassembly #PCBassemblyservices #PCBfabrication #PCBcomponents #PCBmanufacturing #PCBmanufacturer #RushPCBUK

FAKRA female A type VSWR: ≤1.5 Frequency range: 6GHz Impedance: 50Ω Adapter cable specification: 303/1.5D Waterproof Rate:IP67

BGA fan-out PCB design and wiring tutorials IV. BGA spacing and its effect on fanout BGA pitch: defined as the distance between two adjacent solder balls measured from centre to centre. As the number of pins increases, the pitch of the component decreases. This decrease in pitch complicates fan-out. As a result, more internal layers should be added to route the pins, which in turn increases the cost of PCB manufacturing. Learn more about PCB/PCBA/electronic components: [email protected] #pcba #pcb #power #energy #iot #hardware #managingdirector #purchaser #project #design #engineering #quality #pcbassembly #pcbdesign #electronicsmanufacturing #supplychain #ic #chips #electronics #mcu #hardwaredesign #circuitdesign #manufacturing #pcbmanufacturing #iot #Accesscontrol

PCB DFM vs PCB DFA: What’s the difference? Two of these acronyms are PCB DFM and PCBA DFA. While they may sound similar, they actually refer… https://lnkd.in/gxCX8HjM