Join us at #SemiconEuropa 2024 in Munich! From today until Friday, you can meet our colleagues at the Silicon Saxony joint booth in Hall C1. We look forward to meeting you!
confovis
Herstellung von Halbleitern
Jena, Thüringen 1.264 Follower:innen
See the world in nanometers
Info
Wir, die Confovis GmbH aus Jena (Thüringen), sind Entwickler und Hersteller von Systemen für die automatische optische Oberflächeninspektion (AOI Tools) und optischen 3D-Oberflächenmesssystemen für die Halbleiterindustrie und Forschung. Unsere Geräte kommen bei der Defekterkennung und der dimensionalen Vermessung (z.B. in der statistischen Prozesskontrolle) zum Einsatz. Anders als bei Standard AOI Systemen, sind unsere Lösungen durch ihre Hardware universell einsetzbar. Anpassungen in den Prüfprogrammen für die Defekterkennung und Klassifizierung können unmittelbar über das Graphical User Interface (GUI) vorgenommen werden. Hierbei werden die Fehlerklassen mit nur sehr kurzen GUI gestützten Anlernphasen mittels regelbasierter künstlicher Intelligenz unterschieden. Für unsere Kunden aus den Bereichen Halbleiter & MEMS, Oberflächentechnik, Automotive & Aerospace sowie der optischen Industrie setzen wir seit dem Jahr 2009 auf kundennahe und anwendungsorientierte Systemlösungen.
- Website
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https://www.confovis.com/?utm_campaign=linkedin.profile&utm_medium=referral&utm_source=linkedin
Externer Link zu confovis
- Branche
- Herstellung von Halbleitern
- Größe
- 11–50 Beschäftigte
- Hauptsitz
- Jena, Thüringen
- Art
- Kapitalgesellschaft (AG, GmbH, UG etc.)
- Gegründet
- 2009
- Spezialgebiete
- AOI Tools, semiconductors, 3D metrology und surface inspection
Orte
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Primär
Ernst-Ruska-Ring 11
Jena, Thüringen 07745, DE
Beschäftigte von confovis
Updates
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📆 Join us at SEMICON Europa 2024 (November 11 - 15)! 📌 Hall C1, Booth C1419 (Silicon Saxony booth)! Co-located with #electronica, #SEMICONEuropa is the largest European electronics platform connecting industry leaders across the entire design and manufacturing supply chain. 🎟️ Do you want to meet us at SEMICON? You can secure your free visitor ticket through us. Just follow the link in the comments. We look forward to meeting you in Munich! #semicon #munich
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🏃♀️🏃♂️ Some of us now take a few more steps to reach our desks - but it's for a great reason! At the start of October, we expanded our premises for the second time since moving into Ernst-Ruska-Ring 11 here in Jena back in 2017. 🏢 Not only have our cleanrooms doubled in size over the past few years, but this time we’ve also expanded our production area to better serve our customers' needs. More space means more innovation, and we’re happy to climb a few extra stairs for that! 😊 #confovis #TeamConfovis #workinjena #jena
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Are you interested in delving deeper into defect inspection and metrology for #semiconductors? We have released four comprehensive #whitepapers and #casestudies addressing critical challenges in semiconductor manufacturing and highlighting the role of optical inspection. Gain valuable insights with Confovis! 🤓 👉You can download our resources here: https://bit.ly/426Wvwp #semiconductorindustry #semiconductormanufacturing
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As #MEMS devices are an ubiquitous part of our everyday life in smartphones for example, device manufacturers need reliable systems for non-destructive inspection to assure quality in product development and manufacturing. MEMS-based LiDARs are trending right now towards fully autonomous systems in production facilities and vehicles. #LiDAR has already been successfully applied in many fields of operation such as robotics navigation and land surveying. The emergence of micro-optical MEMS and micro-mirrors is providing a promising solution to low-cost, reliable, and highly integrable LiDAR systems. A recent study published in Nature demonstrates how a LiDAR system with 360º x 8.6º (horizontal x vertical) field of view (FoV) was achieved with the combination of a MEMS micro-mirror and a rotating platform. This MEMS-based LiDAR exhibits an angular resolution of 0.07º 0.027º (horizontal x vertical) which is 13.8 times better than commercial LiDAR sensors. [Yang, D., Liu, Y., Chen, Q. et al. Development of the high angular resolution 360° LiDAR based on scanning MEMS mirror. Sci Rep 13, 1540 (2023)] The micro-mirrors used in MEMS LiDARs are #photonics microsystems. They are fabricated on large diameter silicon wafers which require specific inline test equipment. The WAFERinspect AOI Dual system is of particular interest for MEMS in general, and for LiDARs specifically, as it can cope with topographies ranging from few nm to mm on the same wafer. Thanks to the two high-end sensors equipping this new automatic optical inspection system can perform a full 3D scan of wafers up to 300 mm within to 2 to 3 minutes followed by a 100% 3D defect and anomaly inspection with single nm accuracy. #semiconductors #semiconductormanufacturing
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In the rapidly evolving field of #photonics, Photonic Integrated Circuits (PIC) offer: ✅ superior performance, 📏 reduced size, and 🔋 lower power consumption compared to traditional discrete optical devices by integrating multiple optical components onto a single chip. Maintaining the highest standards of performance and reliability in PICs requires precise manufacturing and rigorous quality control. By leveraging advanced imaging systems and AI-driven analysis, Automated Optical Inspection (#AOI) can efficiently detect and distinguish between various anomalies, including subtle color variations, rough polymer surfaces, and critical defects. This ensures that only PICs meeting stringent quality standards proceed to the next production stages. At Confovis, we are at the forefront of developing cutting-edge AOI solutions for PICs. Our AI-powered WAFERinspect AOI systems are designed to optimize your production processes by efficiently handling large volumes of data acquired in matters of minutes for 100% wafer scans. The AOI workflow revolves around the following steps: 🔬 Optical Imaging: High-resolution microscopes capture detailed images of PICs. 🧠 Pattern Recognition: AI-powered systems analyse the images, rapidly identifying even the slightest anomaly. 📐 3D Profiling: Confocal image stacks provide a comprehensive three-dimensional analysis, crucial for detecting topographical anomalies. The key benefits of AOI for PICs are: 📈 Increased Yield and Efficiency: Early detection of defects enhances overall production yield, ensuring cost-effectiveness in PIC manufacturing. 🎯 High Precision: AOI systems offer unparalleled resolution for precise defect detection to guarantee optimal PIC performance. ⚙️ Non-contact Inspection: AOI eliminates the risk of damaging PICs during inspection by avoiding physical contact. Stay tuned as Confovis remains at the forefront of AOI and metrology advancements, delivering cutting-edge solutions for the PIC industry. 🚀 #IntegratedCircuits #AutomatedInspection #QualityControl #AI #Metrology #TechAdvancement #SmartManufacturing #Semiconductors #Technology
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🌐 As of 2023, the global Photonic Integrated Circuits (PIC) market was valued at approximately USD 21.15 billion, while the broader #Photonicsmarket reached an estimated USD 920.56 billion. Projections indicate the PIC market will reach approximately USD 113.98 billion by 2032 and the photonics market could reach up USD 1.64 trillion, reflecting compound annual growth rates (CAGR) of 20.3% and 6.7% respectively. The growth in the #photonics and #PIC markets is driven by several factors, including: 📡 Increasing demand for high-speed data transfer, 🌐 Advancements in fiber optic communications, 📡 Increasing demand for high-speed data transmission, ☁️ Widespread adoption of cloud computing and data centers, 🌍 The rise of Internet of Things (IoT) applications, 📶 The deployment of 5G networks. Furthermore, photonics-enabled products are expected to generate over USD 2.39 trillion in revenue, encompassing a wide range of technologies that underpin many modern conveniences, from smartphones to laser-based instruments.. 📱🔬 Overall, the photonics industry is expanding rapidly, with Asia-Pacific regions, particularly China, showing strong growth due to investments in research and development and manufacturing capabilities. On the other hand, North America is leading the PIC market, accounting for a substantial share due to its strong emphasis on technological innovation and infrastructure development. The Asia-Pacific region is anticipated to experience the fastest growth for PICs, driven by extensive R&D activities and rapid expansion of telecommunications networks. 📈 This robust growth highlights the increasing reliance on photonics technologies in various sectors and its significant economic impact globally. It also indicates a robust trajectory for PICs, positioning them as key enablers of modern technological applications across various sectors. #Optics #5G #IoT #Semiconductors #TechTrends #PhotonicsIndustry #FutureTech
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🚀 Wir suchen Sie! 🚀 Wir bei Confovis sind aktuell auf der Suche nach engagierten neuen Mitarbeitenden, die unser Team verstärken möchten. Wenn Sie Teil eines innovativen Unternehmens werden wollen, haben wir zwei spannende Positionen für Sie: 1️⃣ Mitarbeiter im Controlling (m/w/d) Haben Sie ein gutes Zahlenverständnis und ein Auge für Details? In dieser Position spielen Sie eine zentrale Rolle in unserem Unternehmen, indem Sie für Transparenz und Effizienz in unseren finanziellen Prozessen sorgen. 🔗 Mehr erfahren und bewerben: https://lnkd.in/e-MKs2xC 2️⃣ Mitarbeiter im Back-Office-Bereich (m/w/d) – auch in Teilzeit Sie sind organisiert, kommunikationsstark und haben ein Händchen für administrative Aufgaben? In dieser Position unterstützen Sie unser Team durch administrative Aufgaben und sorgen dafür, dass unsere internen Abläufe reibungslos funktionieren. 🔗 Mehr erfahren und bewerben: https://lnkd.in/eEJUM56U Wenn Sie in einem innovativen Umfeld mit vielfältigen Entwicklungsmöglichkeiten arbeiten möchten, freuen wir uns auf Ihre Bewerbung! #jobsinjena #Karriere #Jobangebote #Confovis #BackOffice #Controlling #Stellenangebote
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This week we continue our #Photonics series with diving into the profound impact of lasers and photonics on the field of #optics. It introduced a powerful tool for the manipulation of light, allowing for the emergence of photonics which replaced electronics in fields such as telecommunications primarily through the adoption of fiber optic technology. Fiber optics uses light pulses to transmit data at high speeds over long distances with significantly greater bandwidth and less signal degradation compared to traditional metal wire-based systems. This shift enabled the rapid expansion and modernization of global telecommunications infrastructure. Unlike electronic integration where silicon is the dominant material, photonic integrated circuits (PIC) are fabricated from a variety of materials including: 🔹 Indium Phosphide (InP): Favoured for its ability to generate and amplify light, making it ideal for lasers and detectors. 🔹 Silicon Nitride (SiN): Chosen for its low optical loss at a wide range of wavelengths, useful in applications requiring broad spectral ranges. 🔹 Gallium Arsenide (GaAs): Useful for active optical components due to its direct bandgap properties. PICs have a wide range of applications across various fields: 📡 Telecommunications: PICs enhance data transmission capabilities in fiber optic networks, improving bandwidth and signal integrity. 💻 Data Centers: They help manage high-speed data operations and improve connectivity within and between servers. 🩺 Biomedical Devices: PICs are used in biosensors and optical coherence tomography for advanced medical imaging and diagnostics. 🧠 Quantum Computing: They play a crucial role in developing scalable quantum information systems. 🌍 Sensing and Metrology: Employed in environmental sensing, aerospace, and automotive industries for enhanced detection and measurement capabilities. 🚗 LiDAR (Light Detection and Ranging): PICs enable more precise and faster processing of optical signals, which is critical for the accurate and rapid distance measurements required in automotive, robotics, and mapping technologies. 🚀