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2020 – today
- 2023
[c7]Ted Letavic, Massimo Sorbara, Ken Geiwont, Yusheng Bian, Vihbor Jain, Sameer Jain, Koushik Ramachandran, Zhuo-Jie Wu, Brittany Hedrick, Kevin K. Dezfulian, Yarong Lin, Teck Jung Tang, Thomas Houghton, Daniel Fisher, Takako Hirokawa, Monica Esopi, Vaishnavi Karra, Won Suk Lee, Michelle Zhang, Ryan Sporer, Jorge Lubguban, Jae Kyu Cho, Rongtao Cao, Hanyi Ding, Sujith Chandran, Michal Rakowski, Abdelsalam Aboketaf, Subramanian Krishnamurthy, Scott Mills, Norman Robson, Ian Melville, Robert Fox, Vikas Gupta, Anthony Yu:
Monolithic Silicon Photonics. BCICTS 2023: 263-269- [c6]Yusheng Bian, Hanyi Ding, Abdelsalam Aboketaf, Vaishnavi Karra, Massimo Sorbara, Takako Hirokawa, Salman Mosleh, Crystal Hedges, Won Suk Lee, Sujith Chandran, Avijit Chatterjee, Riddhi Nandi, Ken Giewont, Karen Nummy, Alon Gabbay, Yannick De Koninck, Jochem Verbist, Santiago Echeverri, Liron Gantz, Qidi Liu, Dylan Logan, Omid Jafari, Kyle Murray, Edgar Huante-Ceron, Subharup Roy, Paul Webster-Pact, Michal Rakowski, Kevin K. Dezfulian, Andy Stricker, Thomas Houghton, Keith Donegan, Ryan Sporer, Jae Kyu Cho, Farid Barakat, Dan Moy, Zhuo-Jie Wu, Subramanian Krishnamurthy, Arman Najafi, Seyedeh Fahimeh Banihashemian, Rick Mincar, Ranjani Sirdeshmukh, Norman Robson, Ian Melville, Rod Augur, Jae Gon Lee, Wenhe Lin, George Gifford, Robert Fox, Vikas Gupta, Anthony Yu, John Pellerin, Ted Letavic:
Polarization mode dispersion in CMOS-integrated monolithic SiPh components: simulations and experiments. OFC 2023: 1-3 - [c5]Yusheng Bian, Takako Hirokawa, Vaishnavi Karra, Arpan Dasgupta, Won Suk Lee, Abdelsalam Aboketaf, Francis Afzal, Ryan Sporer, Karen Nummy, Ken Giewont, Nickolas C. Harris, Reza Baghdadi, Shashank Gupta, Keith Donegan, Thomas Houghton, Brian Popielarski, Kevin K. Dezfulian, Petar Ivanov Todorov, Bo Peng, Sujith Chandran, Mohamed Gheith, Ian Stobert, Mini Modh Ghosal, Jae Kyu Cho, Apoorva Vakil, Sunoo Kim, Zhuo-Jie Wu, Andy Stricker, Kate McLean, Benjamin V. Fasano, Michal Rakowski, Qidi Liu, Matt Rauer, Ryan Gallagher, Ranjani Sirdeshmukh, Norman Robson, Ian Melville, Rod Augur, Jae Gon Lee, Wenhe Lin, George Gifford, Robert Fox, Vikas Gupta, Anthony Yu, John Pellerin, Ted Letavic:
Monolithically integrated self-aligned SiN edge coupler with 520 mW high-power handling capability. OFC 2023: 1-3 - [c4]Zhuo-Jie Wu, Ping-Chuan Wang, Seungman Choi, Patrick Justison, Martin Gall, Jae Kyu Cho, Takako Hirokawa, Yusheng Bian, Thomas Houghton, Vaishnavi Karra, Dan Moy, Karen Nummy, Dave Riggs, Norman Robson, Ian Melville, Ken Giewont:
Self-aligned Fiber Attach on Monolithic Silicon Photonic Chips: Moisture Effect and Hermetic Seal. OFC 2023: 1-3 - 2021
- [c3]Yusheng Bian, Koushik Ramachandran, Bo Peng, Brittany Hedrick, Scott Mills, Keith Donegan, Armand Rundquist, Ed Vail, Vaishnavi Karra, Firat Yasar, Monica Esopi, Benjamin Fasano, Asli Sahin, Thomas Houghton, Karen Nummy, Hanyi Ding, Takako Hirokawa, Kevin Dezfulian, Zhuo-Jie Wu, Daniel Fisher, Jim Pape, Jay Steffes, Louis Medina, Subharup Gupta Roy, Harry Cox, Bart Green, Jorge Lubguban, Won Suk Lee, Abdelsalam Aboketaf, Michal Rakowski, Kate McLean, Zoey Sowinski, Oh-Jung Kwon, Gabrielle Robert, Massimo Sorbara, Subramanian Krishnamurthy, Andy Stricker, Jae Kyu Cho, Ian Melville, Dave Riggs, Rod Augur, Norman Robson, Daniel Berger, Luke Lee, Vikas Gupta, Anthony Yu, Ken Giewont, Ted Letavic, John Pellerin:
Hybrid III-V laser integration on a monolithic silicon photonic platform. OFC 2021: 1-3 - 2020
- [c2]Bo Peng, Tymon Barwicz, Asli Sahin, Thomas Houghton, Brittany Hedrick, Yusheng Bian, Michal Rakowski, Shuren Hu, Javier Ayala, Colleen Meagher, Zoey Sowinski, Karen Nummy, Andy Stricker, Jorge Lubguban, Hui Chen, Benjamin Fasano, Ian Melville, Zhuo-Jie Wu, Jae Kyu Cho, Ajey P. Jacob, Dave Riggs, Daniel Berger, Ted Letavic, Anthony Yu, John Pellerin, Ken Giewont:
A CMOS Compatible Monolithic Fiber Attach Solution with Reliable Performance and Self-Alignment. OFC 2020: 1-3
2010 – 2019
- 2019
- [c1]Zhuo-Jie Wu, Manish Nayini, Charles Carey, Samantha Donovan, David Questad, Edmund D. Blackshear:
CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate. IRPS 2019: 1-7
Coauthor Index
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