Teledyne DALSA

Teledyne DALSA

Appliances, Electrical, and Electronics Manufacturing

Waterloo, ON 18,333 followers

Teledyne DALSA technology is out of this world. Join us on the edge of innovation!

About us

Teledyne DALSA is an international technology leader in sensing, imaging, and specialized semiconductor fabrication. Our image sensing solutions span the spectrum from infrared through visible to X-ray; our MEMS foundry has earned a world-leading reputation. In addition, through our subsidiaries Teledyne Optech and Teledyne Caris, we deliver advanced 3D survey and geospatial information systems. Teledyne DALSA employs approximately 1400 employees worldwide and is headquartered in Waterloo, Canada. For more information, visit www.teledynedalsa.com. Teledyne DALSA has earned its reputation as a global leader in high-performance imaging and semiconductors. Teledyne DALSA, its employees, and partners are committed to enabling industry, art, and exploration through innovative technology. Our business aligns into three core business units: Digital Imaging (Waterloo, Montreal, Billerica), Semiconductor (Bromont), and Life Sciences Imaging/Medical Devices (Eindhoven, Sunnyvale). Teledyne DALSA has R&D locations around the world, including Waterloo, ON (Canada), Bromont, QC (Canada), Montreal, QC (Canada), Eindhoven (The Netherlands), Billerica, MA (USA), plus several Sales & Support sites, including Munich, Tokyo, and Shanghai. Teledyne DALSA is part of the Digital Imaging business unit of Teledyne Technologies, Inc, headquartered in Thousand Oaks, California. Teledyne Technologies (www.teledyne.com) is a global leader in several key technology verticals, with annual revenues of $2 billion (USD) and 9,000 employees worldwide.

Industry
Appliances, Electrical, and Electronics Manufacturing
Company size
1,001-5,000 employees
Headquarters
Waterloo, ON
Type
Public Company
Founded
1980
Specialties
MEMs, integrated circuit and electronics technology, machine vision, software, framegrabbers, semiconductor, wafer processing, CMOS, CCD, line scan, application specific contracts, area scan, image sensors, and X-ray detectors

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